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PICMG releases brand new COM-HPC Carrier Board Design Guide

The design guide supplements the COM-HPC specification for high performance compute modules
January 28, 2022

Wakefield, MA., USA, January 2022 – PICMG, a leading consortium for developing open embedded computing specifications, announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website. The 160-page document provides electronics engineers and PCB layout engineers comprehensive information for designing custom system carrier boards for COM-HPC modules. COM-HPC – short for computer-on-module (COM) – high performance computing (HPC) – is a brand new open Computer-on-Module form factor standard that targets extremely high I/O and computer performance levels from high end clients up to the entry server class and even beyond. Standard COM-HPC modules plug into a … Read More → "PICMG releases brand new COM-HPC Carrier Board Design Guide"

New Single Pole Power Connector from Amphenol Sets the Standard for Reliability and Durability of Solar Connectors

Amphe-PV H4 Plus is UL and IEC certified for use in 1500V PV systems
January 28, 2022
Technical Specifications
  • RADSOK technology
  • Maximum operating temperature of 120˚C
  • Secure cable sealing with ratcheting lock feature
  • Moisture resistant
  • Dual-certified at 1500V DC to UL 6703 and IEC 62852
  • Accepts wire gauges from 14 AWG/2.5mm2 to 8 AWG/10.0mm2
  • IP68 rating 24 hours at 1 meter
Endicott, N.Y. January 2022 – Amphenol Industrial Sustainable Technologies, a global leader in interconnect systems, now offers a Read More → "New Single Pole Power Connector from Amphenol Sets the Standard for Reliability and Durability of Solar Connectors"

RadioWaves Adds New Low Wind Load, Dual Polarity, Mesh Dish Antennas

Low Wind Load, Dual Polarity, Mesh Dish Antennas Are Perfect for Outdoor Applications
January 28, 2022

IRVINE, Calif. − RadioWaves, an Infinite Electronics brand and a manufacturer of high-quality microwave antennas and accessories, has just released a new series of low wind load, dual polarity, mesh dish antennas with frequency coverage of 1710-4200 MHz and 2300-2700 MHz.

RadioWaves’ new series of Read More → "RadioWaves Adds New Low Wind Load, Dual Polarity, Mesh Dish Antennas"

Assured Position, Navigation and Timing solution for defence applications

January 27, 2022

Concurrent Technologies announce a rugged 3U VPX™ Position, Navigation and Timing (PNT) Plug In Card.  Designed in alignment with the SOSA ™ Technical Standard, PR A11/61d-RCR provides resilient PNT data  for sensor-based solutions that are used in Electronic Warfare and Intelligence, Surveillance and  Reconnaissance applications. As a key differentiator, PR A11/61d-RCR is ITAR free and is designed and  built in the UK utilising technology licensed from Racelogic, another UK company specialising in  positioning data. 

In normal operation, PR A11/61d-RCR sources … Read More → "Assured Position, Navigation and Timing solution for defence applications"

Altium Announces Release of Altium Designer 22

Latest release of the PCB industry’s leading design tool allows engineers to focus more on designing and worry less about supply chain shortages
January 27, 2022

SAN DIEGO – January 27, 2022 – Today at AltiumLive 2022 CONNECT, Altium announced the release of Altium Designer 22, which includes added features to help designers source component availability, enhanced capabilities that reduce manual design tasks, along with advanced real-time lifecycle management tools used in conjunction with Altium 365.

Altium Designer customers who have active subscriptions can take advantage of all the features and upgrades included in the new Altium Designer 22 release, including:

Altium and MacroFab Partner to Launch Industry-First Integrated PCB “Design WITH Manufacturing” Application

“Altimade” combines real-time supply chain data and elastic manufacturing capabilities on the Altium 365 electronics design platform
January 27, 2022

SAN DIEGO, January 27, 2022 – Altium LLC (ASX:ALU) and MacroFab, Inc. today announced that Altimade, the electronics industry’s first “design WITH manufacturing” application, is now available to the Altium user community. Available on the Altium 365 cloud platform and connected directly to MacroFab’s fully digital, elastic manufacturing platform, Altimade enables customers to request an instant quote and place an order to produce their PCB assembly without ever leaving their design environment. 

While the electronics … Read More → "Altium and MacroFab Partner to Launch Industry-First Integrated PCB “Design WITH Manufacturing” Application"

Optimal Analysis, Test and Debug Tool for the Next Generation of Automotive MCUs

PLS' UDE now also supports the new Infineon AURIX™ TC4x family
January 27, 2022

Lauta (Germany) / Cupertino (CA), January 26, 2022 – With the latest version of its Universal Debug Engine® (UDE) PLS Development Tools is providing system developers with comprehensive analysis, test and debugging functions for the latest generation of AURIX™ microcontrollers from Infineon.

The highly integrated multi-core SoCs of the TC4x family, manufactured in 28-nm technology, address a wide range of automotive applications such as e-mobility, ADAS and AI applications and also master highly complex challenges in the area of domain and zone control. At the same time, the devices meet the highest safety requirements with regard to autonomous driving. They … Read More → "Optimal Analysis, Test and Debug Tool for the Next Generation of Automotive MCUs"

CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets

January 27, 2022

• Fortrix™ SecureD2D IP enables secure authentication and firmware boot/code load between chiplets in a heterogeneous system-on-chip (HSoC)
• IP adopted by leading system companies as part of Department of Defense State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program

ROCKVILLE, MD, January 26, 2022 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded its IP market reach by introducing the Read More → "CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets"

Turing Launches a Global, Career-Centric Community for Developers

One-of-a-kind online community set to propel career growth for developers
January 27, 2022

San Francisco, January 27  – Turing, an AI-powered, international platform that connects software developers with high quality, long-term, remote U.S. jobs, announces today the launch of Turing Community: a career-centric developer community platform.</ … Read More → "Turing Launches a Global, Career-Centric Community for Developers"

Infineon’s MOTIX™ 12 V motor control kit with MOTIX™ Embedded Power and XENSIV™ sensors gets the motor spinning in seconds

January 27, 2022

Munich, Germany – 26 January, 2022 – With the MOTIX™ motor control kit, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents a complete system solution for motor control. The pre-assembled kit provides everything needed to get the motor spinning in a matter of seconds: a market-proven chipset combined with pre-flashed sample software as well as a BLDC motor – only a power supply needs to be connected. Therefore, the motor control kit enables rapid prototyping and evaluation of low voltage motor controls. Typical applications include auxiliary pumps, cooling fans, HVAC blowers, or any other application that uses 3 … Read More → "Infineon’s MOTIX™ 12 V motor control kit with MOTIX™ Embedded Power and XENSIV™ sensors gets the motor spinning in seconds"

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