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New HUBER+SUHNER SYNCRO family simplifies optical timing integration for data center operations

Nanosecond accurate time synchronisation is essential for global trade, stock exchanges, mobile communications, navigation, and geodesy. Now data center operators requiring precise time synchronisation can integrate optical timing into existing fiber architectures – enhancing performance and reducing costs – with the new SYNCRO solution from HUBER+SUHNER.

The SYNCRO family is an integrated, modular timing and Global Navigation Satellite System (GNSS) distribution portfolio designed for rapid deployment and reliable performance by extending transmission distances, reducing the number of required GNSS antennas, and eliminating many limitations of coaxial cabling.

GNSS provides the reference time used across modern networks … Read More → "New HUBER+SUHNER SYNCRO family simplifies optical timing integration for data center operations"

Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access

  • The world’s first Armv9 edge AI platform, optimized for IoT and edge AI workloads, will be available through Arm Flexible Access, giving innovators low-cost, easy access to advanced AI performance and security at the edge
  • With more than 400 tape-outs and 300 active members, Arm Flexible Access continues to fuel rapid innovation across the ecosystem, helping startups and OEMs accelerate the next generation of intelligent edge devices

The next wave of AI computing innovation will unfold at the … Read More → "Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access"

New AEC-Q200 Compliant, Automotive Grade 4-Terminal Type Shunt Resistors Now Available from Bourns

RIVERSIDE, Calif., October 16, 2025 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its CSS4C-1216 Series 4-terminal current sense resistors. … Read More → "New AEC-Q200 Compliant, Automotive Grade 4-Terminal Type Shunt Resistors Now Available from Bourns"

BOPLA BoVersa: A New Enclosure Concept for Wireless, Embedded, and Instrumentation Systems

BOPLA , a leading specialist in electronic enclosures, has introduced BoVersa,  an innovative new enclosure concept designed for next-generation wireless, embedded, and instrumentation systems. Combining modern design with robust engineering, BoVersa delivers maximum … Read More → "BOPLA BoVersa: A New Enclosure Concept for Wireless, Embedded, and Instrumentation Systems"

New Low-Cost, Efficient Single-Photon Source for Powering Future Quantum Internet

With the rise of quantum computers, the security of our existing communication systems is at risk. Quantum computers will be able to break many of the encryption methods used in current communication systems. To counter this, scientists are developing quantum communication systems, which utilize quantum mechanics to offer stronger security. A crucial building block of these systems is a single-photon source: a device that generates only one light particle at a time. These photons, carrying quantum information, are then sent through optical fibers. For quantum communication systems to work, it is essential that single photons are injected into optical … Read More → "New Low-Cost, Efficient Single-Photon Source for Powering Future Quantum Internet"

MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications

BRIDGEWATER, N.J., Oct. 16, 2025 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced the release of SoundWire I3S (MIPI SWI3S v1.Read More → "MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications"

TDK announces 1U high, 13-output modular power supply delivering up to 1500 W with extremely low acoustic noise

October 14, 2025

TDK Corporation (TSE:6762) announces the expansion of the TDK-Lambda MU series with the introduction of the MU6 modular power supplies. Featuring extremely low acoustic noise and BF-ready medical isolation, the MU6 can provide up to 1200 W with an input of 85 to 264 Vac (derating below 90 Vac) and 1500 W with a 180 to 264 Vac input in a compact footprint. Up to 13 fully isolated output voltages can be easily configured using TDK-Lambda’s online Read More → "TDK announces 1U high, 13-output modular power supply delivering up to 1500 W with extremely low acoustic noise"

New MEMS-based MultiGBASE-T1 FIUs from Pickering to launch at Automotive Testing Expo North America

October 2025 – Tewksbury, MA, USA – Pickering Interfaces will showcase its range of industry-standard modular signal switching and sensor simulation solutions for electronics test and verification – including the launch of its new Read More → "New MEMS-based MultiGBASE-T1 FIUs from Pickering to launch at Automotive Testing Expo North America"

Upscale AI Unveils SkyHammer™ Architecture

Upscale AI today offers a first glimpse of SkyHammer™, a clean-slate architecture purpose-built to overcome the fundamental limits of scale-up AI networking. With SkyHammer, Upscale AI reinvents what “scale” truly means in scale-up networking. While traditional front-end switches, PCIe fabrics, and proprietary topologies strain under the demands of explosive AI growth, SkyHammer has been designed from day one to power the world’s largest AI clusters with deterministic latency, extreme bandwidth, and predictable performance at scale.

]Why Must Scale-Up Start from the Ground-Up?

Scale-up interconnects fuse CPUs, … Read More → "Upscale AI Unveils SkyHammer™ Architecture"

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