industry news archive
Subscribe Now

Newark partners with Würth Elektronik to support e-mobility developers

Chicago – February 24, 2022: Newark, an Avnet Company and global distributor of electronic components, products and solutions, has launched a new campaign in partnership with Würth Elektronik to support electric mobility (e-mobility) developers in their projects.

The rapid growth of the electric vehicle (EV) market is evidence of an irreversible shift to electric mobility. However, developers still face a range of electromagnetic compatibility (EMC) problems when … Read More → "Newark partners with Würth Elektronik to support e-mobility developers"

Ampleon extends isolator-free sub-6GHz line-ups with compact multistage Doherty MMIC drivers for 5G NR and 4G LTE Macro base station applications

Nijmegen, The Netherlands – Ampleon, utilizing advanced LDMOS transistor technology, introduces the B11G3338N80D push-pull 3-stage fully integrated Doherty RF transistor being the carrier product for GEN11 Macro driver family covering all sub-6GHz frequency bands. This highly efficient multiband device covers a frequency range from 3.3 to 3.8GHz, enabling the implementation of next-generation high power and market-leading efficiency macro base stations.

The driver product family comes in PQFN 12 x 7mm² packages, integrating the carrier and peaking devices, input splitter, output combiner and pre-match for each section. The push-pull configuration of the devices eliminates the need for … Read More → "Ampleon extends isolator-free sub-6GHz line-ups with compact multistage Doherty MMIC drivers for 5G NR and 4G LTE Macro base station applications"

KIOXIA First to Introduce Next-Generation UFS Embedded Flash Memory Devices Supporting MIPI M-PHY v5.0

Düsseldorf, Germany, 24 February 2022 – KIOXIA Europe GmbH, a world leader in memory solutions, today announced that the sampling[1] of the industry’s first[2] Universal Flash Storage (UFS)[3] embedded flash memory devices supporting MIPI M-PHY® v5.0[4] has started. The new line-up utilizes the company’s BiCS FLASH™ 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. The new … Read More → "KIOXIA First to Introduce Next-Generation UFS Embedded Flash Memory Devices Supporting MIPI M-PHY v5.0"

Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power.

ISSCC ’22 contribution confirms that UWB technology is capable of supporting low-power, high-bitrate applications – from smart glasses delivering tomorrow’s AR/VR experiences, to wireless telemetry modules for intracortical sensing 

LEUVEN (Belgium), February 24, 2022 At this week’s International Solid-State Circuits Conference (ISSCC), imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – presents a new impulse-radio ultra-wideband (IR-UWB) transmitter chip that could redefine the future of UWB technology.

Fabricated in 28nm CMOS and occupying an area of merely 0.155mm², imec’s IR-UWB chip comes with a … Read More → "Imec Pioneers Ultra-Wideband Transmitter Chip That Pushes Data Rates up to 1.66Gb/s with Milliwatt Power."

Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency

Düsseldorf, February 24, 2022  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth® Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits … Read More → "Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency"

Siemens and Nexii unveil easy-to-deploy and sustainable electric vehicle charging concept

Siemens Smart Infrastructure in the U.S. today unveiled a new sustainable, EV charging concept structure designed for electrifying fleets and high demand charging applications at scale. The new VersiCharge XL concept (UL standard) was created to electrify new or existing parking lots and building structures quickly and efficiently by using a modular, scalable design made in partnership with Nexii Building Solutions using their proprietary, sustainable building material with low carbon footprint in the U.S. The solution, which resembles a modern-day fueling station, was developed in late 2021, and then installed in only three days at Siemens’ research and … Read More → "Siemens and Nexii unveil easy-to-deploy and sustainable electric vehicle charging concept"

congatec introduces three new Server-on-Module families with Intel Xeon D processors

San Diego, CA, 24 February, 2022 * * * congatec – a leading vendor of embedded and edge computing technology – celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver … Read More → "congatec introduces three new Server-on-Module families with Intel Xeon D processors"

SolidRun and IoT.bzh Streamline Custom Imaging and Deployment of SolidSense Edge Gateways

TEL AVIV, February 24, 2022 – SolidRun, a leading developer and manufacturer of high-performance edge computing solutions, today announced in collaboration with < … Read More → "SolidRun and IoT.bzh Streamline Custom Imaging and Deployment of SolidSense Edge Gateways"
featured blogs
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...