News – Page 581 – EEJournal

Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning

As Part of Collaboration, Companies Launch Cloud-Based Evaluation Environment for R-Car SoCs to Enable Simple Initial Evaluation for Device Selection

March 3, 2022

TOKYO, Japan, March 2, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Fixstars Corporation, a global leader in multi-core CPU/GPU/FPGA acceleration technology, announced their intention to collaborate in the automotive deep learning field. In April 2022, the two companies will establish an Automotive SW Platform Lab tasked with the development of software and operating environments for Renesas automotive devices. The new Lab will support early development and ongoing operation of advanced driver-assistance systems (ADAS) and autonomous driving (AD) systems. The two companies will develop technologies aimed at software development for deep learning and … Read More → "Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning"

Telit Introduces Next Gen 3GPP Release 16 5G M.2 Modules Powered by Snapdragon® X65 and X62 Modem-RF Systems

March 3, 2022

New 3GPP Release 16 compliant modules are the latest in Telit’s long tradition of being an early adopter of Qualcomm Technologies’ innovations
Next gen M.2 5G module series is a natural evolution of the current FN980 series powered by Snapdragon X55 Modem-RF System for 3GPP Release 15

London, March 1, 2022 – Telit, a global enabler of the Internet of Things (IoT), today introduced its new 5G M.2 worldwide module SKUs powered by the fourth-generation Read More → "Telit Introduces Next Gen 3GPP Release 16 5G M.2 Modules Powered by Snapdragon® X65 and X62 Modem-RF Systems"

JMA Wireless Launches World’s First 5G Cloud Radio Access Network That Is Compatible With All Processors and Cloud Platforms

First Solution to Fulfill the Potential of ORAN to Provide Multiple Alternatives for Customers

March 3, 2022

BARCELONA, Spain–(BUSINESS WIRE)–JMA Wireless, an American company focused on re-establishing U.S. leadership in 5G network technology, announced its cloud-native 5G standalone (SA) Radio Access Network (RAN) solution live during Mobile World Congress. This fully agnostic solution provides customers unprecedented levels of flexibility across cloud platforms and processors, unlocking greater competition and the potential for powerful new applications.

“Our all-software RAN was designed for easy porting to any platform. With 5G SA XRAN®, we are now able to fulfill the promise of ORAN to run on … Read More → "JMA Wireless Launches World’s First 5G Cloud Radio Access Network That Is Compatible With All Processors and Cloud Platforms"

Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD

Reliable QoS and industry-leading form factors address the unique needs of data center workloads

March 3, 2022

BOISE, Idaho , March 01, 2022 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq: MU), today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center. The Micron 7450 SSD with NVMe^TM delivers quality-of-service (QoS) latency at or below 2 milliseconds (ms),¹ a wide capacity range and the broadest set of form factors available to meet the needs of the most demanding data center workloads.

This new data center SSD includes Micron’s industry-leading NAND, which contains 176 layers of storage cells and proven CMOS-under-the-array technology, to deliver an ultraefficient … Read More → "Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD"

ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors

ADLINK’s new COM-HPC Server Type and COM Express Type 7 Modules boost real-time computing with integrated high-speed Ethernet and industrial-grade reliability & longevity

March 3, 2022

ADLINK Technology Inc., a global leader in edge computing, introduces its latest Intel® Xeon® D-based Computer-on-Modules (COMs), available in two form factors – Read More → "ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors"

Microchip Introduces Industry’s Highest-Performance 16-Channel PCIe® Gen 5 Enterprise NVMe® SSD Controller

The Flashtec® NVMe 4016 controller enables unparalleled performance and a rich ‘cloud-ready’ feature set including industry-leading security features

March 3, 2022

CHANDLER, Ariz., March 02, 2022 (GLOBE NEWSWIRE) — As data processing requirements continue to evolve, cloud-scale infrastructure requires solutions that maximize bandwidth, minimize latency, and are optimized for efficient resource utilization. Microchip Technology Inc. (Nasdaq: MCHP) today announced the newest member of the Read More → "Microchip Introduces Industry’s Highest-Performance 16-Channel PCIe® Gen 5 Enterprise NVMe® SSD Controller"

Vishay Intertechnology Releases Commercial and Automotive Grade IHLE® Integrated E-Field Shield Inductors in Compact 2020 Case Size

Lowering Costs and Saving Space, Devices Provide Up to -20 dB Electric Field Reduction at 1 cm

March 3, 2022

MALVERN, Pa. — March 2, 2022 — Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields for the reduction of EMI with new commercial and Automotive Grade devices in the 5 mm by 5 mm by 3.4 mm 2020 case size. The smallest such devices on the market, the Vishay Dale IHLE-2020CD-51 and IHLE-2020CD-5A lower costs and save board space by eliminating the need for separate board-level Faraday shielding.

The devices released today contain the electric and B field associated with EMI in a tin-plated copper integrated shield, providing up to … Read More → "Vishay Intertechnology Releases Commercial and Automotive Grade IHLE® Integrated E-Field Shield Inductors in Compact 2020 Case Size"

STL, VMware and ASOCS unveil end-to-end 5G Enterprise solution at MWC 2022

March 3, 2022

Barcelona, Spain, 02 March 2022: STL [NSE: STLTECH], an industry-leading integrator of digital networks, together with ASOCS and VMWare, today announced the launch of industry’s first end-to-end 5G Enterprise solution to address the growing demand for private 5G enterprise connectivity for campus, industrial and venue applications. Unveiled at MWC 2022, where STL demonstrated its All-in 5G offerings, this 5G Enterprise solution will comprise Read More → "STL, VMware and ASOCS unveil end-to-end 5G Enterprise solution at MWC 2022"

Lantronix Announces New Software Build for Open-Q 8250CS Android 10-Based SOM

Software speeds time-to-market for compute-intensive camera and Edge AI applications

March 3, 2022

IRVINE, Calif., March 01, 2022 (GLOBE NEWSWIRE) — Read More → "Lantronix Announces New Software Build for Open-Q 8250CS Android 10-Based SOM"

CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions

Adapted for Spectronite’s X-Series Modem for 5G Systems, the Technology Enables Carrier Aggregation that Provides Radio Links with 10Gb/s Capacity

March 3, 2022

GRENOBLE and SOPHIA-ANTIPOLIS, France – March 1, 2022 – CEA, a French key player in research, development and innovation, and Spectronite, a leading innovator in wireless backhaul technology, today announced they have adapted and optimized CEA-Leti’s spectrally efficient waveform with enhanced spectral efficiency for Spectronite’s X-Series modem for 5G systems.

CEA-Leti is a technology research institute at CEA that pioneers micro- and nanotechnologies, … Read More → "CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions"