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Ceva Introduces Wi-Fi 7 1×1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems

ROCKVILLE, MD – October 21, 2025 – As IoT devices demand faster, more reliable and intelligent connections, Wi-Fi® 7 emerges as a critical enabler for real-time performance and next-generation user experiences at the edge. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced general availability of its Read More → "Ceva Introduces Wi-Fi 7 1×1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems"

Microchip Adds Highly Integrated Single-Chip Wireless Platform Designed for Advanced Connectivity, Touch and Motor Control

CHANDLER, Ariz., Oct. 21, 2025 (GLOBE NEWSWIRE) — As connectivity standards and market needs evolve, upgradeability has become essential for extending device lifecycles, minimizing redesigns and enabling differentiated features. To solve this challenge, Microchip Technology (Nasdaq: MCHP) has released the highly integrated PIC32-BZ6 MCU that serves as … Read More → "Microchip Adds Highly Integrated Single-Chip Wireless Platform Designed for Advanced Connectivity, Touch and Motor Control"

Allegro MicroSystems Unveils Industry’s First Production-Ready 10 MHz TMR Current Sensor, Enabling Optimal Protection and Control of Wide Bandgap Power Electronics

Knowles Corporation Unveils MM60 MEMS Microphone at EUHA, Setting New Standard for AI-Optimized Hearing Aids

ITASCA, Ill., October 21, 2025 — Knowles Corporation (NYSE: KN), a leading manufacturer of specialty electronic components, including high performance capacitors, radio frequency (“RF”) filters, advanced medtech microphones, and balanced armature (BA) speakers, today announced the launch of its groundbreaking MM60 MEMS microphone at the European Hearing Aid Acousticians Convention (EUHA) in Nuremberg, Germany. For optimal performance of the AI chipset in a hearing aid, high quality sound input is essential. The MM60 represents a complete reimagining of hearing health technology, designed from the ground up to deliver superior electroacoustic performance and robustness specifically designed to maximize the performance for AI chipsets … Read More → "Knowles Corporation Unveils MM60 MEMS Microphone at EUHA, Setting New Standard for AI-Optimized Hearing Aids"

New VPX Chassis Manager from LCR Embedded Systems Allows Open Source In-field Code Upgrades; Manufactured in the USA

Technical Highlights:

  • In-field code upgrades using open source software
  • Deployment and development mount configurations
  • Management via graphical user interface
  • Designed for VPX / SOSA chassis applications
  • Meets VITA 46.11 requirements

October 2025 – Audubon, PA – LCR Embedded Systems, a leader in rugged integrated systems and enclosures for defense electronics, today announced the release of its VITA 46.11 compliant Read More → "New VPX Chassis Manager from LCR Embedded Systems Allows Open Source In-field Code Upgrades; Manufactured in the USA"

Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is introducing the LPKF CuttingMaster 2240 Cx, an advanced automated laser depaneling system designed to be fully inline, to maximise efficiency and reduce costs in high-volume PCB production.
Developed by LPKF Laser and Electronics SE, the CuttingMaster 2240 Cx represents a major advancement in laser depaneling technology. The system eliminates the need for circulating workpiece carriers, simplifying automation and lowering operational costs while maintaining LPKF’s hallmark precision and reliability. Its integrated clamping device and product-specific fork handling and unloading capabilities streamline the depaneling … Read More → "Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up"

Onspring Ushers in the Next Era of GRC with New Intelligent AI Capabilities

OVERLAND PARK, Kansas — October 14, 2025 — Onspring, a leading provider of integrated GRC software, today announced the launch of Onspring AI, a suite of embedded artificial intelligence capabilities designed to address the escalating demands faced by governance, risk and compliance (GRC) teams. By intelligently managing routine tasks and providing context-specific insight, Onspring AI empowers professionals to transcend manual tasks and refocus time on forward-thinking priorities.

Read More → "Onspring Ushers in the Next Era of GRC with New Intelligent AI Capabilities"

ST introduces new image sensors for industrial automation, security and retail applications

  • Four new 5MP image sensors allow customers to optimize image capture with high speed, high detail with a single, flexible product instead of two chips
  • New device family is ideal for high-speed automated manufacturing processes and object tracking
  • New sensors leverage market-leading technology for both global and rolling shutter modes, with a compact 2.25µm pixel with advanced 3D stacking, and on-chip RGB-IR separation

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers … Read More → "ST introduces new image sensors for industrial automation, security and retail applications"

Infineon presents XENSIV™ TLE4971/TLI4971, the most accurate coreless magnetic current sensor on the market

Munich, Germany – 20 October 2025 – Accurate current measurement is key to efficient, safe, and reliable power electronics. To address this, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its XENSIV™ magnetic current sensor family with the new TLE4971/TLI4971 sensors, housed in a 300-mil package. These new products offer the highest accuracy in magnetic coreless current sensors on the market, with a total error of only 0.7 percent over temperature and lifetime. Combined with the characteristics of the 300-mil package, the high accuracy … Read More → "Infineon presents XENSIV™ TLE4971/TLI4971, the most accurate coreless magnetic current sensor on the market"

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