News – Page 570 – EEJournal

Microchip Enables Qi 1.3 Wireless Charging with Authentication

Announcing a new secure storage subsystem and key provisioning for the Wireless Power Consortium (WPC) Qi 1.3 Wireless Charging standard.

March 30, 2022

CHANDLER, Ariz., March 29, 2022— In order to ensure high quality wireless charging power transmitters, the Wireless Power Consortium (WPC) has released the Qi 1.3 specification with the extended power profile. This new specification created demand for high security silicon authentication devices for full-service support. In response, Microchip Technology Inc. (Nasdaq: MCHP) is announcing the new industrial grade TrustFLEX ECC608 and the … Read More → "Microchip Enables Qi 1.3 Wireless Charging with Authentication"

Cognifiber Downsizes its System for Edge Computing With Breakthrough Glass Processors

The limitations of edge computing put a strain on connected devices to store, transfer, and manage data. “The miniaturization capabilities of glass-based photonic chips will bring server-size products to the edge,” said Dr. Eyal Cohen, Co-founder & CEO of Cognifiber.

March 29, 2022

Cognifiber, a deep technology company focusing on revolutionizing photonic computing, announced the development of a glass-based photonic chip that will bring its technology one step closer to revolutionizing edge computing. Being the first of its kind, this glass-based chip reduces power consumption and takes a fraction of the size of previous designs in CogniFiber’s solutions.

Edge devices, including smart … Read More → "Cognifiber Downsizes its System for Edge Computing With Breakthrough Glass Processors"

Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services

March 29, 2022

• GF qualifies the Cadence digital solution on AWS for its proprietary, differentiated 22FDX platform

• Xenergic leverages the Cadence Cloud Passport to tape out test chip featuring Tensilica Fusion F1 DSP and low-power memories on the GF 22FDX platform

SAN JOSE, Calif., March 23, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that GlobalFoundries® (GF®) has qualified the Cadence® digital solution on Amazon Web Services (AWS). The qualification of the digital solution on GF’s 22FDX™ platform enables customers to achieve cloud scalability, efficiency and productivity, while also attaining optimal design power, performance and area (PPA) and … Read More → "Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services"

NVIDIA Announces DGX H100 Systems – World’s Most Advanced Enterprise AI Infrastructure

Combined With New NVLink Switch System, Each DGX SuperPOD to Deliver 1 Exaflops of AI Performance; New NVIDIA Eos Supercomputer Expected to Be World’s Fastest AI System; Immediate On-Ramp for Customers via Expanded DGX Foundry Service

March 29, 2022

SANTA CLARA, Calif., March 22, 2022 (GLOBE NEWSWIRE) — GTC—NVIDIA today announced the fourth-generation NVIDIA® DGX™ system, the world’s first AI platform to be built with new NVIDIA H100 Tensor Core GPUs.

Cat M1 vs Cat 1 vs Cat 4: Connectivity for Telematics

March 29, 2022

Through increased adoption of data driven telematics use cases in vehicles, there has been a rising need for telematics edge hardware across a range of vehicles. Telematics and connected vehicle solutions help unlock value across a range of vehicle types: passenger cars, heavy duty trucks, electric vehicles, boats, with the list growing day by day.

Different applications require different data processing and connectivity architectures – A few applications require more edge processing with … Read More → "Cat M1 vs Cat 1 vs Cat 4: Connectivity for Telematics"

Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers

March 29, 2022

TOKYO, Mar 28, 2022 – (JCN Newswire) – Showa Denko K.K. (SDK) (TOKYO: 4004) has launched mass production of silicon carbide single crystal wafers (SiC wafers) with a diameter of 6 inches (150 mm), which are used as materials for SiC epitaxial wafers*1 to be processed and installed into SiC-based power semiconductors (SiC power semiconductors).

SiC power semiconductor has excellent heat-resisting property and high withstanding voltage much better than those of conventional silicon-based power semiconductor, which is currently the mainstream of power semiconductors. SiC power semiconductor contributes to improvement in power module’s energy efficiency and downsizing. Therefore, the … Read More → "Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers"

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System- in-Package

March 28, 2022

Houston, Texas, United States (March 24, 2022) – Read More → "Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System- in-Package"

SEGGER releases new Embedded Studio for RISC-V with hard real-time C++ support

March 28, 2022

Monheim am Rhein, Germany – March 24th, 2022

SEGGER’s Embedded Studio for RISC-V, Version 6, now uses real-time memory management which improves efficiency and response time when allocating and freeing up memory, satisfying requirements for hard real-time in applications written in C++. The new version supports all common RISC-V 32-bit and 64-bit cores, including but … Read More → "SEGGER releases new Embedded Studio for RISC-V with hard real-time C++ support"

Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers

March 28, 2022

SiC power semiconductor has excellent heat-resisting property and high withstanding voltage much better than those of conventional silicon-based power semiconductor, which is currently the mainstream of power semiconductors. SiC power semiconductor contributes to improvement in power module’s energy efficiency and downsizing. Therefore, the demand for SiC power … Read More → "Showa Denko Launches Mass Production of 6-inch SiC Single Crystal Wafers"

Himax Launches Intelli-Sensing Module Enabling Context-Aware AI Vision Sensing on the Edge

March 28, 2022

TAINAN, Taiwan, March 28, 2022 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its ultralow power Intelli-Sensing Module featuring AI vision sensing in human detection, people counting, face detection and face recognition to enable a broad range of context-aware applications on the edge. Himax Intelli-Sensing Module will debut at the tinyML Summit 2022 on March 29 – 30, 2022.

Himax Intelli-Sensing Module incorporates the Company’s proprietary WE-I Plus AI processor and HM01B0 AoS (Always-On Sensor) … Read More → "Himax Launches Intelli-Sensing Module Enabling Context-Aware AI Vision Sensing on the Edge"