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VSORA Launches Europe’s Most Powerful AI Inference Chip

October 23, 2025
  • Production of ultra-high-performance AI chip called Jotunn8 begins
  • Redefining cost-effective, high-performance AI inference deployment at scale
  • Semiconductor Manufacturing Partnership for quality, scalability, access to cutting-edge fabrication technologies


PARIS––October 22, 2025––VSORA, a French semiconductor innovator, today announced the production launch of Jotunn8, an artificial intelligence (AI) inference … Read More → "VSORA Launches Europe’s Most Powerful AI Inference Chip"

Silicon Labs Unveils the Next Evolution of IoT Development with the Simplicity Ecosystem

Developers gain faster, smarter workflows today – and AI-powered collaboration in 2026
October 23, 2025

AUSTIN, Texas, Oct. 22, 2025 /PRNewswire/ — Silicon Labs (NASDAQ: SLAB), the leading innovator in low-power wireless, today announced the launch of the Simplicity Ecosystem, a next-generation suite of modular software tools with planned AI augmentation designed to transform embedded IoT development. Anchored by Read More → "Silicon Labs Unveils the Next Evolution of IoT Development with the Simplicity Ecosystem"

Microchip Adds Highly Integrated Single-Chip Wireless Platform Designed for Advanced Connectivity, Touch and Motor Control

Bluetooth® Low Energy, Thread®, Matter and proprietary protocols come together in a secure, feature-rich platform for supporting evolving standards, interface needs and market demands
October 23, 2025

CHANDLER, Ariz., October 21, 2025 — As connectivity standards and market needs evolve, upgradeability has become essential for extending device lifecycles, minimizing redesigns and enabling differentiated features. To solve this challenge, Microchip Technology (Nasdaq: MCHP) has released the highly integrated PIC32-BZ6 MCU that serves as a common, single-chip platform to reduce … Read More → "Microchip Adds Highly Integrated Single-Chip Wireless Platform Designed for Advanced Connectivity, Touch and Motor Control"

NextSilicon’s Maverick-2 Powers AI and HPC Breakthroughs with up to 10x Performance Boost at Less Than Half the Power

Company’s Intelligent Compute Architecture delivers immediate acceleration without code changes for customers including Sandia National Laboratories
October 22, 2025

TEL AVIV, Israel and MINNEAPOLIS – Oct. 22, 2025 – NextSilicon, a leader in next-generation computing solutions for AI and high-performance computing (HPC), today disclosed architecture and performance details for Maverick-2, the next-generation processor enabling order-of-magnitude better compute for HPC and AI:

Renesas Adds Two New MCU Groups to Blazing Fast RA8 Series with 1GHz Performance and Embedded MRAM

RA8M2 Devices Address General-Purpose Applications and RA8D2 Devices Target High-End Graphics and HMI; Both Offer Dual-Core Options for Even More Horsepower
October 22, 2025

TOKYO, Japan, October 22, 2025 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm® Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry benchmark for MCUs. The optional Cortex-M33 processor enables efficient system partitioning and task segregation.

Both Read More → "Renesas Adds Two New MCU Groups to Blazing Fast RA8 Series with 1GHz Performance and Embedded MRAM"

New MEMS-based MultiGBASE-T1 FIUs from Pickering ramp up test system bandwidth, throughput & operational life

Pickering’s highest bandwidth fault insertion units to date incorporate MEMS switches for fast, high-quality switching & very long life
October 22, 2025

October 2025 – Tewksbury, MA, USA – Pickering Interfaces the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced a major new addition to its extensive range of PXI FIU (fault insertion unit) switch modules: available in a compact single-slot form factor, models
Read More → "New MEMS-based MultiGBASE-T1 FIUs from Pickering ramp up test system bandwidth, throughput & operational life"

Curtiss-Wright Expands PacStar Modular Radio Center with new Tactical Radio Gateways to Expand Mission-Critical Radio Interoperability at the Tactical Edge

New Radio Gateways enhance PacStar 400-Series-based Modular Radio Center (MRC) with unmatched flexibility, rapid deployment, and simplified integration for radio and voice unified communications
October 22, 2025

NXP’s AI-Enabled i.MX 952 Applications Processor Advances Automotive HMIs and In-Cabin Sensing

The i.MX 952 applications processor’s integrated eIQ® Neutron NPU intelligently combines sensor input to improve the driver experience
October 21, 2025
What’s new: NXP Semiconductors today announced the i.MX 952 applications processor, part of NXP’s i.MX 9 series. The i.MX 952 applications processor is designed for AI-powered vision, human-machine interfaces (HMIs) and in-cabin sensing applications, leveraging sensor fusion powered by the integrated eIQ® Neutron Neural Processing Unit (NPU) to deliver driver monitoring, child presence detection and more. With pin-to-pin compatibility to the i.MX 95 family, the i.MX 952 SoC makes it easier for developers to scale their hardware and software design to address different price points with a single platform design, reducing costs and … Read More → "NXP’s AI-Enabled i.MX 952 Applications Processor Advances Automotive HMIs and In-Cabin Sensing"
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