News – Page 55 – EEJournal

Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms

Strategic Collaboration to Deliver Practical Chip Design Experience to Prepare the Next Generation of Engineering Talent

September 5, 2025

Key Highlights

Launching a pilot ‘chip design to tapeout’ flow curriculum, enabling academic institutions with industry-aligned coursework.
Pilot testing underway at over 40 select worldwide universities with intent to scale.
Combination of access to Synopsys’ EDA solutions and GlobalFoundries’ technology solutions to provide students valuable, real-world experience.

SUNNYVALE, Calif. and MALTA, N.Y., Sept. 4, 2025 /PRNewswire/ — Read More → "Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms"

Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging

Zuken Contributes to Design and Manufacturing Process Validation and Tool Development for Panel-Level Organic Interposers

September 5, 2025

WESTFORD, MA, USA, September 4, 2025 – Zuken Inc. (President:　Katsube Jinya, hereinafter “Zuken”) has joined “JOINT3” consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic … Read More → "Participating in “JOINT3” Consortium to Develop Next-Generation Semiconductor Packaging"

Silicon Summer Schools with Synopsys

September 5, 2025

What’s New: This summer, Synopsys hosted a series of academic programs across the globe, empowering students with hands-on experience and real-world insights into semiconductor engineering. These initiatives are both educational opportunities and investments in the future semiconductor industry workforce.

Why it Matters: The world’s reliance on advanced technology—from smartphones to electric vehicles and beyond—has never been greater, and at the core of every innovation lies the essential semiconductor. At the same time, the semiconductor industry faces a critical challenge: a significant workforce gap that threatens to slow progress and … Read More → "Silicon Summer Schools with Synopsys"

SeoulTech scientist develops artificial synapses that mimic human brain function for next-gen AI chips

The innovative organic materials proposed by Dr. Eunho Lee and his team bring us closer to brain-like computer processors

September 4, 2025

The Emerging Investigator Series by the journal Materials Horizons features outstanding work by young researchers in the field of materials science. In the latest Editorial article of the Series, Dr. Eunho Lee, an Assistant Professor of Chemical and Biomolecular Engineering at Seoul National University of Science and Technology, Republic of Korea, where he leads the Functional Semiconductors and Devices Lab, discusses and elaborates upon his Emerging Investigator Series research paper titled “Improving ion uptake in artificial synapses through facilitated … Read More → "SeoulTech scientist develops artificial synapses that mimic human brain function for next-gen AI chips"

Heliospace Hardware Successfully Completes Mission on the Moon

Deployable antennas and sensors successfully deploy and complete operations in support of geophysics experiment on the Moon.

September 3, 2025

Berkeley, Calif., Sept. 03, 2025 (GLOBE NEWSWIRE) — Heliospace Corp. (OTC:HLEO), an aerospace company specializing in cutting-edge technologies that empower space exploration and innovation, today announced the successful completion of mission objectives for its deployable hardware and sensors on the Moon aboard the Firefly Aerospace Blue Ghost Mission 1.

Heliospace provided critical mechanisms and a unique low frequency antenna as part of the Lunar Magnetotelluric Sounder (LMS) experiment on Blue Ghost Mission 1. Led by Southwest Research Institute, LMS is designed to study the interior of the Moon by measuring low … Read More → "Heliospace Hardware Successfully Completes Mission on the Moon"

TDK and ASICS launch joint research on motion analysis technology to support athletes

September 3, 2025

Integration of TDK’s sensing technology and ASICS’s sports engineering
Embodying the new brand identity “In Everything, Better” and accelerating the long-term vision “TDK Transformation”
“TDK Sensing Within” project: contributing to social transformation through sensing technology together with partners

September 3, 2025

TDK Corporation (TSE:6762) announces that it has launched a joint research project with ASICS Corporation (hereafter “ASICS”) to analyze athletes’ movements using motion sensing technology. By combining TDK’s sensor technology with ASICS’s extensive expertise in sports engineering, TDK aims to visualize athletes’ movements and contribute to … Read More → "TDK and ASICS launch joint research on motion analysis technology to support athletes"

Impulse Embedded Powers Next-Generation Industrial Computing with Intel® Core™ Ultra Solutions

September 3, 2025

Staffordshire, UK – Impulse Embedded Ltd, a leading UK provider of industrial computing solutions, has announced the availability of new systems powered by Intel® Core™ Ultra processors, bringing enhanced performance, stronger security, and greater efficiency to demanding industrial applications.

The Intel Core Ultra platform introduces a breakthrough 3D performance architecture and Intel Foveros packaging, separating critical functions into specialised tiles to deliver greater flexibility and … Read More → "Impulse Embedded Powers Next-Generation Industrial Computing with Intel® Core™ Ultra Solutions"

Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions

GenAI capabilities accelerate workflows from days to hours, hours to minutes

September 3, 2025

SUNNYVALE, Calif., Sept. 3, 2025 /PRNewswire/ — Today Synopsys (Nasdaq: Read More → "Synopsys Announces Expanding AI Capabilities for its Leading EDA Solutions"

Abaco Systems Launches MAGIC2 Next-Gen High-Performance Modular Mission Computer

September 3, 2025

HUNTSVILLE, AL., September 3, 2025 – Abaco Systems proudly announces the launch of the MAGIC2, a high-performance, modular mission computer designed for rugged computing in aerospace and defense applications. The MAGIC2 is a 3U VPX two-slot line replaceable … Read More → "Abaco Systems Launches MAGIC2 Next-Gen High-Performance Modular Mission Computer"

Infineon expands OptiMOS™ 6 portfolio with 150 V MOSFETs in TOLL, TOLG, and TOLT packages to drive vehicle electrification

September 3, 2025

Munich, Germany – 1 September 2025 – With the increasing electrification of vehicles worldwide, the demand for highly efficient, compact, and reliable power systems continues to grow – not only in passenger cars but also in electric two-wheelers. These vehicles require special systems, such as HVLV DC/DC converters at xEVs and traction inverters at electric two-wheelers, which must meet high-quality standards while also fulfilling considerable technical, commercial, and manufacturing challenges. To address these demands, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its OptiMOS™ 6 … Read More → "Infineon expands OptiMOS™ 6 portfolio with 150 V MOSFETs in TOLL, TOLG, and TOLT packages to drive vehicle electrification"