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Vishay Intertechnology TRANSZORB® TVS Offer High Surge Capability to 3 kW, Leakage Current Down to 1 μA in SMC (DO-214AB) Package

For Automotive, Industrial, and Telecom Applications, Bidirectional Devices Provide High Temp Operation to +175 °C, Stable Breakdown Voltage From 11.1 V to 133 V
June 3, 2022

MALVERN, Pa. — June 1, 2022 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of surface-mount TRANSZORB® bidirectional transient voltage suppressors (TVS) in the SMC (DO-214AB) package for automotive, industrial, and telecom applications. Offering high surge capability of 3 kW at 10/1000 μs to meet the specifications of ISO 16750-2 Pulse b, SMC3KxxxCAHM3_A series devices provide low leakage current down to 1 μA from 22 V to 120 V and high temperature operation to +175 °C.

Suitable for high reliability applications, the Vishay General Semiconductor TVS released today are AEC-Q101 qualified and offer extremely stable breakdown voltage from 11.1 V to 133 V … Read More → "Vishay Intertechnology TRANSZORB® TVS Offer High Surge Capability to 3 kW, Leakage Current Down to 1 μA in SMC (DO-214AB) Package"

Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio

Latest additions enable comprehensive and fast verification to ensure SoCs meet the latest standard specifications
June 3, 2022

SAN JOSE, Calif., June 1, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of 15 new Verification IP (VIP) solutions that enable engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols. The new Cadence® VIP offerings empower customers to confidently develop their next-generation industrial, automotive, hyperscale data center and mobile SoCs while keeping pace with the latest industry standards, including LPDDR5x, MIPI® CSI-2® 4.0 and UFS 4.0, and the newest versions of the USB4, Arm® AMBA® 5 CHI and GDDR interfaces.

The new Cadence VIP offer customers a comprehensive verification solution … Read More → "Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio"

CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput

Paper at ECTC Presents Success With Self-Assembly Process That Uses Capillary Forces Of Water to Align Dies on Target Devices for Possible Memory, HPC and Photonic Applications
June 2, 2022

SAN DIEGO – June 2, 2022 – In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour. The approach uses capillary forces of a water droplet to align dies on a target wafer.

The results were presented in a paper, “Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration”, at the 2022 Electronic Components and Technology Conference (ECTC). While leading microelectronics companies see the … Read More → "CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput"

Renesas Introduces Complex Device Driver Software to Ease Development of Battery Management Systems for Electric Vehicles

New Software Complements Renesas Leading Li-Ion Battery Manager IC to Enable ASIL D-Compliant Designs
June 2, 2022

TOKYO, Japan, June 02, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs). The new software pairs with Renesas’ industry-leading ISL78714 Li-Ion battery management IC to speed design … Read More → "Renesas Introduces Complex Device Driver Software to Ease Development of Battery Management Systems for Electric Vehicles"

Panasonic Connect Introduces New Offerings to Enhance Engagement and Collaboration in Higher Education and Corporate Environments

New AV Solutions bring ultra-connected, interactive engagement to in-person and hybrid environments
June 2, 2022

Newark, NJ | June 02, 2022 – Panasonic Connect North America, today announced several collaboration-focused solutions to its professional audiovisual (AV) portfolio to create interactive experiences for students, educators and professionals across in-person and remote environments. The new audio and display solyutions join Panasonic’s holistic ecostystem of professional AV technology on display at InfoComm in booth #N1629, aimed at improving work and leanring experiences.

“Flexible technology that creates opportunities for workers, educators and students to engage more seamlessly and create deeper connections is no longer a nice to have, but a necessity across corporate environments and college and university venues,” … Read More → "Panasonic Connect Introduces New Offerings to Enhance Engagement and Collaboration in Higher Education and Corporate Environments"

element14 Community Launches ‘Summer of Sensors’

Summer of educational enrichment, skill-building trainings, webinars, quizzes, product testing and giveaways will help community members gain expertise in essential components
June 2, 2022

Chicago – June 2, 2022: element14, an Avnet community, is providing educational enrichment and skill-building opportunities for engineers all summer long with its ‘Summer of Sensors’ program, a multi-supplier event where members of the element14 Community will receive the opportunity to enhance their sensor-specific knowledge and develop new skills.

“Today’s sensing technologies are the building blocks of just about everything in … Read More → "element14 Community Launches ‘Summer of Sensors’"

Lanner Electronics Launches Falcon H8 PCIe AI Accelerator Card, Powered by Hailo-8™AI Processors

Lanner Electronics & Hailo collaborate on one of the most cost-efficient PCIe accelerator cards on the market, with record high tera operations per second (TOPS), enabling high-end deep learning applications on edge servers
June 2, 2022

Lanner Electronics, a global leader in the design and manufacturing of intelligent edge computing appliances, announced its first Hailo-8™AI-powered PCIe accelerator card, the Falcon H8. Lanner Electronics collaborated with leading AI (Artificial Intelligence) chipmaker Hailo to design the Falcon H8, enabling scalable and powerful intelligent video analytics applications for multiple industries operating at the edge, including intelligent transport systems (ITS), smart cities, smart retail, and Industry 4.0. The Falcon H8 is one of the most cost-efficient PCIe AI accelerator cards on … Read More → "Lanner Electronics Launches Falcon H8 PCIe AI Accelerator Card, Powered by Hailo-8™AI Processors"

Microchip Simplifies Automotive Designs with ISO 26262-Compliant, AUTOSAR-Ready Devices and Ecosystem

New dsPIC33C DSCs add support for AUTOSAR, OS, MCAL drivers and functional safety, enabling robust and secure automotive solutions
June 2, 2022

CHANDLER, Ariz., June 2, 2022 – OEMs are experiencing increasing application complexity and the need for AUTOSAR, ISO 26262 functional safety-compliant and secure solutions as the market for electric and autonomous vehicles grows. For automotive developers looking to design scalable applications for future technology while also meeting the latest automotive requirements, Microchip Technology Inc. (Nasdaq: MCHP) today announces a comprehensive ecosystem around AUTOSAR-ready dsPIC33C Digital … Read More → "Microchip Simplifies Automotive Designs with ISO 26262-Compliant, AUTOSAR-Ready Devices and Ecosystem"

Classiq Quantum Algorithm Design Platform Now Integrated With Amazon Braket

Customers can experiment with quantum algorithms faster by creating sophisticated circuits on the Classiq platform and seamlessly executing them on Amazon Braket
June 2, 2022

TEL-AVIV – June 02, 2022 – Classiq, which provides a leading platform for creating quantum software, today announced the build of its solution on Amazon Braket. Amazon Braket is a fully managed quantum computing service from Amazon Web Services (AWS), designed to help speed up scientific research and software development for quantum computing.

Quantum computing has the potential to offer transformational opportunities for numerous industries: from financial services to material sciences, from logistics to healthcare, and from cybersecurity to automotive. But customers find that moving from ideas to experimentation can be difficult because most quantum … Read More → "Classiq Quantum Algorithm Design Platform Now Integrated With Amazon Braket"

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