News – Page 54 – EEJournal

IAR enables agile automotive development on Renesas RH850/U2A MCU with MCAL support

September 8, 2025

September 4, 2025 – Uppsala, Sweden – IAR announces that Renesas has released its new RH850/U2A MCAL (Microcontroller Abstraction Layer) package qualified for mass production, with support for the IAR toolchain for RH850 (v2.21.2 FS). The Renesas RH850/U2A microcontroller family is designed for automotive applications that demand high performance, functional safety, and low power consumption. The RH850/U2A is well-suited for systems such as ADAS, body control, and electric vehicle platforms.

The MCAL package for RH850/U2A ASIL D MP is now available through Renesas. … Read More → "IAR enables agile automotive development on Renesas RH850/U2A MCU with MCAL support"

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

September 8, 2025

LEHIGH VALLEY, PA, September 4th, 2025 – iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling.

SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching and conduction. It delivers a step-change in performance and efficiency while preserving the core advantages of silicon: ruggedness, high-volume manufacturability, and proven reliability at 175 °C.

The first 200 V device to reach mass production, the iS20M028S1P, is … Read More →

OIX Association Introduces the Digital Infrastructure Framework Committee

The Committee Aims to Help Communities Define What They Have, Need, and Want to Meet Future Technology Demands

September 8, 2025

CLAYMONT, DE – September 4, 2025 – The OIX Association, a global, volunteer-driven organization dedicated to creating fair, reasonable and non-discriminatory standards and best practices for digital infrastructure deployments, announces today the formation of the Digital Infrastructure Framework Committee (DIFC). The framework will provide guidance to community … Read More → "OIX Association Introduces the Digital Infrastructure Framework Committee"

EnGenius Expands Into Data Center Infrastructure with Latest Intel® Xeon® 6 Server Series

Introducing the EAS2210 and EAS1210 servers, powered by Intel® Xeon® 6, accelerate AI inferencing and training workloads, high-density virtualization, and enterprise storage operations

September 8, 2025

COSTA MESA, Calif., September 4th, 2025 — EnGenius Technologies, a global leader in networking solutions, today announced its expansion into the data center server market with the launch of the EAS Series DC-MHS Data Center Servers. This milestone marks EnGenius’ entry into the high-performance, AI-driven data center market. The new EAS2210 (2U) and EAS1210 (1U) servers, powered by Intel® Xeon® 6, are purpose-built to accelerate digital transformation with modular OCP scalability for AI, virtualization, and private cloud workloads.

New Barkhausen Noise Measurement System Unlocks Key to Efficient Power Electronics

Researchers developed a highly sensitive magnetic Barkhausen noise measurement system to understand energy loss mechanisms in soft magnetic materials

September 5, 2025

Soft magnetic materials can be easily magnetized and demagnetized, which makes them a key component in electrical power devices, such as generators, transformers, and amplifiers. As power electronics advance toward high-frequency operation, demand is growing for low-loss soft magnetic materials. The efficiency of these materials is fundamentally limited by iron loss, where energy is lost as heat when a varying magnetic field passes through them, as is typical in transformers and generators. Iron loss mainly consists of hysteresis loss, classical eddy current loss, and excess eddy current loss. Among these, excess eddy current loss becomes increasingly dominant at high … Read More → "New Barkhausen Noise Measurement System Unlocks Key to Efficient Power Electronics"

Infineon introduces AURIX™ TC4x software to enable quality, safety, and security in automotive applications

September 5, 2025

Munich, Germany – 4 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a comprehensive software portfolio designed specifically for the latest AURIX™ TC4x microcontroller (MCU) family. It enables automotive safety applications with production ready ASIL D drivers for the AUTOSAR MCAL and safety software. By reducing efforts for software partitioning, system level safety argumentation, and simplifying virtual control units it speeds up time to market.

The portfolio includes the production-grade MC-ISAR AUTOSAR MCAL, safety software (SafeTlib), complex device … Read More → "Infineon introduces AURIX™ TC4x software to enable quality, safety, and security in automotive applications"

Antenova launches cellular antenna that operates on new 5G bands worldwide

September 5, 2025

Waterlooville, Hampshire, UK, Sept. 4, 2025 – Antenova Ltd. launches Opaca, a surface-mount design that operates in band 71 (617 – 698 MHz) used by T-Mobile in the USA.

Since its debut in 20219, 5G connections worldwide have soared past 1.5 billion in 2024, making it the fastest growing mobile technology the industry has seen. 5G comes in three main types: Low-band (600 MHz to 1 GHz), mid-band (1 GHz – 6 GHz), and high-band (above 24 GHz).

The Opaca (SR4L104) is ‘future-proofed’ as it covers the most common current 4G & 5G … Read More → "Antenova launches cellular antenna that operates on new 5G bands worldwide"

Himax to Demonstrate Industry-Leading Automotive Display and Cutting-Edge Technologies at 2025 SID Vehicle Displays and Interfaces Symposium

September 5, 2025

TAINAN, Taiwan, Sept. 05, 2025 (GLOBE NEWSWIRE) — Himax Technologies, Inc. (“Himax” or “Company”) (Nasdaq: HIMX), an industry leader in fabless display driver ICs and other semiconductors, today announced it will showcase its industry leading comprehensive automotive display portfolio in addition to other state-of-the-art technologies at the upcoming SID Vehicle Displays and Interfaces Symposium, taking place September 9 – 10, 2025, at Huntington Place in Detroit, Michigan. Organized by the Society for Information Display (SID), the symposium is one of the premier international events dedicated to automotive display and human–machine interface (HMI) technologies.

Concurrent launches Huey: A versatile edge compute system for land and air defence platforms

September 5, 2025

Concurrent, today announced the launch of Huey, its new 3-slot rugged compute system engineered to deliver high-performance edge processing for land and air defence platforms.

Defence environments are evolving rapidly. From ground-based vehicles to airborne ISR pods, platforms are becoming more autonomous and sensor-rich, driving the need for compute-intensive systems that can keep pace with increasing data demands. The challenge? Integrating powerful processing into platforms that must withstand harsh conditions, support flexible mission profiles, and stay operational with minimal downtime.

Huey is the answer.

Read More → "Concurrent launches Huey: A versatile edge compute system for land and air defence platforms"

Purdue’s SCALE and SCALE K-12 programs partner with Arm to form EducateAI Coalition  

September 5, 2025

WEST LAFAYETTE, Ind. — Purdue University’s Scalable Asymmetric Lifecycle Engagement and SCALE K-12 programs will continue to prepare America’s youth for careers in emerging technologies thanks to a new partnership with high-performing compute platform Arm to launch the Arm EducateAI Coalition.

SCALE, led by Purdue, partners with universities, government and industry to prepare a highly skilled microelectronics workforce. The SCALE K-12 national initiative equips teachers and schools with the tools to design and implement engaging learning experiences in microelectronics.

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