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Qualcomm and Valeo Accelerate the Transition to Software-Defined Vehicles (SDV) by Bringing New Scalable, Safety-Focused ADAS Systems to Automakers Worldwide

  • Qualcomm and Valeo have established a long-standing collaboration, combining system expertise and innovation to deliver reliable ADAS and automated driving solutions.
  • The pre-integrated ADAS/AD platform simplifies implementation in vehicles and accelerates time to market.
  • It adapts to different hardware configurations, including the use of Snapdragon Ride Flex SoCs, to merge ADAS and infotainment.
  • It leverages Valeo’s proven expertise in complex systems integration and is ready to enter production to deliver advanced safety, parking and driving features.

San Diego and Paris — September 8, 2025 — Qualcomm Technologies, Inc. and Valeo today … Read More → "Qualcomm and Valeo Accelerate the Transition to Software-Defined Vehicles (SDV) by Bringing New Scalable, Safety-Focused ADAS Systems to Automakers Worldwide"

Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems

Palo Alto, CA. September 8, 2025. Sarcina Technology, a pioneer in semiconductor and photonic package design, has announced the development of patented methodologies for the UCIe-A (Universal Chiplet Interconnect Express-Advanced) and UCIe-S (Standard) protocols. The company’s latest innovations include an optimized RDL (redistribution layer) interposer design for die-to-die interconnections, supporting data rates up to 32 gigabits transfers per second (GT/s) whilst optimizing signal routing architecture to minimize crosstalk and maximize signal integrity.

As AI workloads continue to expand at an unprecedented pace, the semiconductor industry faces the dual challenge of performance and manufacturability. Traditional … Read More → "Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems"

Students develop novel multi-metal 3D printing process

Students at ETH Zurich have developed a laser power bed fusion machine that follows a circular tool path to print round components, thereby being able to process multiple metals at once. The system significantly reduces manufacturing time and opens up new possibilities for aerospace and industry. ETH has filed a patent application for the machine.

Today, virtually all modern rocket engines rely on 3D printing to maximise their performance with tight … Read More → "Students develop novel multi-metal 3D printing process"

Living Optics Showcases Real-Time Hyperspectral Imaging on NVIDIA Jetson, Demonstrating Blood Perfusion Breakthrough for Edge AI

Oxford, UK – September 8, 2025 – Living Optics, a leader in hyperspectral imaging (HSI), today announced its latest real-time blood perfusion demonstration, built on the NVIDIA Jetson platform, offering a glimpse into the future of edge AI for healthcare, life sciences, and precision imaging.

The live demo showcases how Living Optics’ spectral vision technology can distinguish between oxygenated and deoxygenated blood in real-time, providing critical insights that can enhance surgical planning, triage, and patient monitoring. Initially developed for use in a scientific environment, the company’s breakthrough approach now brings high-resolution hyperspectral capabilities to compact, deployable systems at the edge … Read More → "Living Optics Showcases Real-Time Hyperspectral Imaging on NVIDIA Jetson, Demonstrating Blood Perfusion Breakthrough for Edge AI"

d-Matrix Announces JetStream I/O Accelerators Enabling Ultra-Low Latency for AI Inference at Scale

SANTA CLARA, Calif., Sept. 8, 2025 – d-Matrix® today announced the expansion of its AI product portfolio with d-Matrix JetStream™, a custom I/O card designed from the ground up to deliver industry-leading, data center–scale AI inference.

With millions of people now using AI services – and the rise of agentic AI, reasoning, and multi-modal interactive content – the industry’s focus is quickly shifting from model training to deploying AI at ultra-low latency across multiple users.

When combined with d-Matrix Corsair™ accelerators and d-Matrix Aviator™ software, JetStream I/O accelerators can scale … Read More → "d-Matrix Announces JetStream I/O Accelerators Enabling Ultra-Low Latency for AI Inference at Scale"

TDK announces that Tronics enters the machine and asset health monitoring market with vibration sensor solutions

  • TDK’s subsidiary, Tronics Microsystems, expands into vibration sensor solutions, targeting process and asset monitoring to support predictive maintenance and industrial IoT applications
  • Building on two decades of MEMS expertise, the company leverages its legacy in inertial sensors to engineer high-precision vibration sensor solutions
  • Strategic evolution aligns with Tronics’ mission and vision, reinforcing its role in digitally transforming transportation, energy, and industrial sectors through smart sensing solutions
  • Live demonstrations planned at electronica India (Sept 17–19) and sps – Expo in Nuremberg (Nov 25–27), showcasing the new vibration sensor technology

September 8, 2025

Read More → "TDK announces that Tronics enters the machine and asset health monitoring market with vibration sensor solutions"

Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The VP 2200 addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical, and industrial applications. The system delivers faster reflow processing, greater flexibility, and lower maintenance costs, building on the success of ASSCON’s VP 2100 launched in 2021.
The VP 2200 was developed as a single, flexible system platform to meet customer needs for speed, flexibility, and performance while keeping costs low. … Read More → "Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly"

Study: Final Push for the Cyber Resilience Act — Nearly Two-Thirds of Companies Still Unaware

  • The new EU cybersecurity directive brings multiple challenges for companies, including reporting obligations, the creation of Software Bills of Materials, and the shift to “secure by design” products.
  • ONEKEY IoT & OT Cybersecurity Report 2025: “Time for the final push toward CRA compliance.”

Düsseldorf, September 4, 2025 — The “IoT & OT Cybersecurity Report 2025,” published by ONEKEY</ … Read More → "Study: Final Push for the Cyber Resilience Act — Nearly Two-Thirds of Companies Still Unaware"

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