News – Page 52 – EEJournal

TI unveils the industry’s most sensitive in-plane Hall-effect switch, enabling lower design costs

In-plane Hall-effect switch from TI can replace incumbent position sensors that are more expensive and difficult to manufacture

September 10, 2025

What’s new

Texas Instruments (TI) today introduced the industry’s most sensitive in-plane Hall-effect switch for position sensing, offering engineers a cost-effective, user-friendly alternative to magnetoresistive sensors. TI’s TMAG5134 Hall-effect switch features an integrated a magnetic concentrator, enabling it to detect magnetic fields as weak as 1mT in applications such as door and window sensors, personal electronics, home appliances, and more. This level of sensitivity allows for the use of smaller magnets, further reducing system-level costs. Additionally, the TMAG5134’s in-plane sensing capability enables it to detect magnetic fields parallel or horizontal to … Read More → "TI unveils the industry’s most sensitive in-plane Hall-effect switch, enabling lower design costs"

Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity  

Smarter automation, deeper integration, and cloud-enabled collaboration simplify complex workflows

September 10, 2025

MUNICH, GERMANY and WESTFORD, MA, USA, September 9, 2025 – Zuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.

The new release focuses on minimizing repetitive tasks, improving data integrity, and accelerating project timelines—particularly for designs involving complex variants, large component libraries, or integrated 2D/3D workflows. Key additions will include the E3.CloudViewer for browser-based project access and integrated online documentation, enabling more efficient collaboration and accessibility for distributed engineering teams. The release will be available in … Read More → "Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity  "

Axelera AI Boosts LLMs at the edge by 2x with Metis M.2 Max introduction

First of its kind performance for LLMs and VLMs for low power, embedded devices.

September 10, 2025

Eindhoven, NL – September 8, 2025 – Axelera AI, the leading provider of purpose-built AI hardware acceleration technology, today announced Metis® M.2 Max, a new addition to the company’s class-leading Metis AI processor unit (AIPU) family. Delivering the performance of a PCIe card in the M.2 form factor, Metis M.2 Max is designed for the most compute-intensive AI inference applications at the edge, including better performance for large language … Read More → "Axelera AI Boosts LLMs at the edge by 2x with Metis M.2 Max introduction"

An Internet Exchange in the Stars: DE-CIX Charts Next Frontier of Orbital Interconnectivity

From laser links to the prospect of orbital Internet Exchanges, DE-CIX is exploring new ways to optimize space-based communications – reducing latency, boosting resilience, and laying the groundwork for high-speed orbital interconnectivity.

September 10, 2025

YOTTA Conference, Las Vegas and New York, USA 9 September 2025 – DE-CIX, the world’s leading Internet Exchange (IX) operator, is expanding its vision of interconnection beyond terrestrial boundaries. Through its Space-IX initiative, DE-CIX is preparing for this future and already considering what … Read More → "An Internet Exchange in the Stars: DE-CIX Charts Next Frontier of Orbital Interconnectivity"

Mouser Electronics Explores the 3D Printing Revolution and Its Impact on Design, Engineering, and Manufacturing

September 10, 2025

September 9, 2025 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today released its latest installment of the Empowering Innovation Together (EIT) technology series, entitled, That’s 3D Printed? This installment explores how the foundational principles of 3D printing, also known as additive manufacturing, have advanced to transform design, engineering, and manufacturing through novel materials, artificial intelligence (AI), accelerated production cycles, and unparalleled design precision.

The ingenuity of 3D printing lies in its ability to fabricate highly complex geometries and intricate internal structures, a feat often unachievable with conventional subtractive methods. … Read More → "Mouser Electronics Explores the 3D Printing Revolution and Its Impact on Design, Engineering, and Manufacturing"

Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems

With unique interposer design and advanced signal routing techniques to minimize crosstalk.

September 9, 2025

Palo Alto, CA. September 8, 2025. Sarcina Technology, a pioneer in semiconductor and photonic package design, has announced the development of patented methodologies for the UCIe-A (Universal Chiplet Interconnect Express-Advanced) and UCIe-S (Standard) protocols. The company’s latest innovations include an optimized RDL (redistribution layer) interposer design for die-to-die interconnections, supporting data rates up to 32 gigabits transfers per second (GT/s) whilst optimizing signal routing architecture to minimize crosstalk and maximize signal integrity.

As AI workloads continue to expand at an unprecedented pace, the semiconductor industry faces the dual challenge of performance and manufacturability. Traditional … Read More → "Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems"

Newark powers up with extensive portfolio of new Nexperia products

September 9, 2025

Phoenix – September 9, 2025: Each year, Nexperia adds about 800 new product types to its range. In 2024, more than 70 new parts for analogue and power management applications alone were released. To support Nexperia’s product expansion, Newark has expanded its SKU range in line with the growing portfolio to better serve engineers worldwide.

Nexperia is renowned for its quality and reliability in discrete components, power, and logic ICs and has made a substantial investment in manufacturing. This includes a $200 million commitment to SiC and GaN technology at its Hamburg, Germany facility. The investment is now yielding … Read More → "Newark powers up with extensive portfolio of new Nexperia products"

STMicroelectronics sets 20-year availability for popular automotive microcontrollers

September 9, 2025

• SPC58 family of 7 product lines to be available until at least 2038-2041, strengthening assurance for new automotive-system design starts
• Devices target communication-gateway and powertrain, chassis, and body applications

STMicroelectronics has extended the ongoing longevity program for its widely deployed SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years, ensuring availability of general-purpose and high-performance product lines until at least 2038. Among the general-purpose lines, the Read More → "STMicroelectronics sets 20-year availability for popular automotive microcontrollers"

New Sugar-Based Stabilizer Keeps Sweat Sensors Working Under Acidic Conditions

Adding sucrose monolaurate preserves 80% of enzyme activity in sweat, enabling more accurate lactic acid measurements

September 9, 2025

The composition of sweat makes it a valuable diagnostic fluid. While it is mostly water, the small fraction containing electrolytes, metabolic byproducts, and chemical traces can reveal important information about a person’s health. Today, commercial sweat-based sensors can already track dehydration, electrolyte loss, and more. One emerging application is the measurement of lactic acid in sweat.

Lactic acid, or more precisely L-lactate, is a byproduct of metabolism produced mainly in muscle cells when glucose is broken down for energy under low-oxygen conditions, such as during intense physical activity. Athletes and trainers use lactate … Read More → "New Sugar-Based Stabilizer Keeps Sweat Sensors Working Under Acidic Conditions"

Siemens Joins the CHERI Alliance: a United Front for Cutting-Edge Cybersecurity

September 9, 2025

Cambridge, UK – 8 September 2025 – The CHERI Alliance announces that the Electronic Design Automation segment of Siemens Digital Industries Software has joined the non-profit organisation as a member to promote and enable a new level of cybersecurity in the EDA industry. This collaboration marks a significant milestone in CHERI’s mission to advance technological innovations and bolster security measures in the digital landscape.

The CHERI Alliance is a global consortium that unites a diverse range of … Read More → "Siemens Joins the CHERI Alliance: a United Front for Cutting-Edge Cybersecurity"

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