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STMicroelectronics extends STM32Cube.AI development tool with support for deeply quantized neural networks

July 21, 2022

STMicroelectronics has released STM32Cube.AI version 7.2.0, the first artificial-intelligence (AI) development tool by an MCU (microcontroller) vendor to support ultra-efficient deeply quantized neural networks.

STM32Cube.AI converts pretrained neural networks into optimized C code for Read More → "STMicroelectronics extends STM32Cube.AI development tool with support for deeply quantized neural networks"

Toposens launches world’s first industrial grade 3D Ultrasonic Collision Avoidance Sensor

Munich-based high-tech startup Toposens is releasing its 3D Ultrasonic Echolocation Sensor ECHO ONE®
July 20, 2022

Munich, July 20, 2022 — The Munich based high-tech startup Toposens (https://toposens.com) is announcing the market launch of its first commercial Toposens 3D COLLISION AVOIDANCE SYSTEM for mobile robots based on the proprietary Toposens 3D ultrasonic echolocation technology. This represents a key milestone for the company following more than seven years of R&D and product commercialization.

Addressing the unmet need for higher … Read More → "Toposens launches world’s first industrial grade 3D Ultrasonic Collision Avoidance Sensor"

Newark Launches Global Women in Engineering Survey 2022

This year’s global survey will gain direct insight from all members of the industry to understand current barriers to achieving equality and how to further diminish discriminatory practices in the workplace.
July 20, 2022

Chicago – June 23, 2022: Newark, an Avnet company and global distributor of electronic components, products and solutions, has today announced the launch of the annual Global Women in Engineering Survey in partnership with the element14 Community. The survey is an opportunity for professional women in engineering to share their insights and experiences, shedding light on career development as well as the broader challenges and opportunities within the electronics engineering industry.</ … Read More → "Newark Launches Global Women in Engineering Survey 2022"

In-house software team provides Sondrel with a key advantage for its turnkey ASIC service of turning concept into silicon

Boot up ready prototype chips speed up customer chip testing
July 20, 2022

Reading, UK 19 July, 2022. When designing a new chip, the first thing a customer wants to do when receiving the initial silicon, is to “boot it up” and check it works. Sondrel’s software team, working closely with its chip designers, now enables customers to have boot up ready prototypes as soon as silicon is available so that they can be quickly evaluated, and application specific software installed, run and debugged. This is because the team has created a library of drivers and “Boot ROM” code for use in each of Sondrel’s five Architecting the Future™ IP platforms that … Read More → "In-house software team provides Sondrel with a key advantage for its turnkey ASIC service of turning concept into silicon"

Universal interface features across family of TFT displays

Family Model Series provides diverse display compatibility
July 20, 2022

Milwaukee, Wisconsin, July 19, 2022. Display solutions and embedded systems provider, Review Display Systems (RDS) has announced the introduction of a new family of TFT display modules. Display manufacturer Chefree has designed and developed the Family Model Series of compatible TFT displays that all feature a common, universal 30-pin data interface.

The Family Model Series product range implements a universal 30-pin connector which supports a 24-bit LVDS interface, enabling a color palette of up to 16.7 million colors, a 3.3v power circuit, a 12v LED backlight driver providing backlight dimming, and an EETI touch controller offering … Read More → "Universal interface features across family of TFT displays"

Advanced optical digital harness (ODH) set to unleash novel multi-element microwave antennas

Links to transfer data, clock, configuration, and even system-wide synchronization signaling marks the arrival of practical multi-element smart digital antennas
July 20, 2022

Newsworthy pointers
• Streaming sample, control & configuration data, as well as reference clock and synchronization signals via optical fibers simplifies signal distribution and reduces cable mass in complex digital radio designs
• Eliminates all copper signal wiring in future radios offering increased architectural flexibility whilst reducing crosstalk and inter-channel interference
• Concept substantiates a separation of front-end analog design from back-end digital signal processing heralding the arrival of fully digital antennas

Prototype set to demonstrate revolutionary approach to high-speed data interfacing
Grenoble, July 19th 2022, as part of its advance towards enabling … Read More → "Advanced optical digital harness (ODH) set to unleash novel multi-element microwave antennas"

NXP Collaborates with Foxconn on Next Generation Vehicle Platforms

July 20, 2022

EINDHOVEN, The Netherlands, July 20, 2022 (GLOBE NEWSWIRE) – NXP Semiconductors (NASDAQ: NXPI) today announced that it has signed a memorandum of understanding with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world’s largest electronics manufacturer and a leading technology solution provider, will leverage NXP’s portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity and safe automated driving. The collaboration builds on the company’s initial digital cockpit partnership, based on the NXP i.MX … Read More → "NXP Collaborates with Foxconn on Next Generation Vehicle Platforms"

Volkswagen’s CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles

New cooperation model: CARIAD and Volkswagen Group will enter into direct relationships with semiconductor suppliers at Tier 2 and Tier 3-level for the first time.
July 20, 2022

  • Securing Tier 3 supply: CARIAD, TSMC, and ST plan that TSMC will manufacture the system-on-chip wafers for STMicroelectronics (ST).
  • Innovative basis: The new co-developed system-on-chip (SoC) aims to complement ST’s high-performance Stellar microcontroller family.
  • Efficiency boost: The perfectly tailored SoC will be used as standard chip for all electronic control units in CARIAD’s zone architecture.

Wolfsburg, Germany and Geneva, Switzerland – July 20, 2022 – New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics (NYSE: STM), a … Read More → "Volkswagen’s CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles"

Rohde & Schwarz announces on-wafer device characterization test solution

July 19, 2022

Rohde & Schwarz now offers a test solution for full RF performance characterization of the DUT on-wafer which combines the powerful R&S ZNA vector network analyzer from Rohde & Schwarz with industry-leading engineering probe systems from FormFactor. As a result, semiconductor manufacturers can perform reliable and repeatable on-wafer device characterization in the development phase, during product qualification and in production.

5G RF front-end designers aim to ensure proper RF capabilities for frequency coverage and output power while optimizing energy efficiency. An important phase in this process is investigating the RF design, to get feedback on … Read More → "Rohde & Schwarz announces on-wafer device characterization test solution"

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