News – Page 51 – EEJournal

Bee-Sting Inspired Microneedles from Chung-Ang University Could Revolutionize Drug Delivery

Researchers develop new wearable microneedles that improve drug absorption while reducing pain in long-term delivery

September 12, 2025

Patients who suffer from chronic conditions often require continuous injections of drugs, which is quite painful and often inconvenient. To address this, researchers from South Korea have developed new wearable microneedles which are inspired by bee stings. These electrospun web microneedles (EW-MNs) deliver drugs continuously through the skin without causing discomfort. In animal models, the system enhanced drug absorption while ensuring comfort—offering a safer and convenient alternative to conventional needle systems.

Neurological diseases affect millions worldwide, and the need for long-term patient-friendly treatments has never been greater. While needle-based injections are the standard … Read More → "Bee-Sting Inspired Microneedles from Chung-Ang University Could Revolutionize Drug Delivery"

Silicon Catalyst Startups Fast-Track Chip Development with Synopsys Cloud

Long-term In-Kind Partnership relationship now includes Cloud-based EDA & IP

September 11, 2025

Silicon Valley, Calif., September 8, 2025 – Silicon Catalyst, the only incubator + accelerator focused on the global semiconductor industry, including Chips, Chiplets, Materials, IP and Silicon fabrication-based Photonics, MEMS, Sensors, Life Science and Quantum, today announced that companies in its 24-month program will have access to Synopsys Cloud, expanding and simplifying their ability to leverage industry-leading Electronic Design Automation (EDA) software and IP for accelerated chip design and innovation.

NeuReality Unveils AI-SuperNIC and UEC Compliance, Delivers Ideal Architecture for Scale Out AI Infrastructure

Breakthrough 1.6 Tbps NR2 AI-SuperNIC and UEC-compliant networking will set a new standard for scalable AI training and inference

September 11, 2025

Santa Clara, California – Sept. 9, 2025 – Today at AI Infrastructure Summit, Read More → "NeuReality Unveils AI-SuperNIC and UEC Compliance, Delivers Ideal Architecture for Scale Out AI Infrastructure"

Advantest Introduces Advanced Mask CD-SEM “E3660”

2nm Node-Ready System with Enhanced Reproducibility, Throughput, and Curvilinear Pattern Measurement

September 11, 2025

TOKYO, Sept. 09, 2025 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced the release of its next-generation CD-SEM* E3660, engineered for the dimensional metrology of photomasks and EUV masks used in cutting-edge semiconductor manufacturing. Compared to the previous generation’s Read More → "Advantest Introduces Advanced Mask CD-SEM “E3660”"

DVCon Europe 2025 to Feature Broad Technical Program and New Applications

Highlights include Medicine, SystemC, AI and Open Source

September 11, 2025

Munich, Germany – 9^th September 2025- The Design and Verification Conference & Exhibition Europe (DVCon Europe), sponsored by Accellera Systems Initiative, has announced an extensive technical program, with industry leading keynotes and an in-depth technical panel session. The program is broad, covering UVM, SystemC, Open Source and AI and touching on new application areas. DVCon Europe 2025 runs on 14^th and 15^{… Read More → "DVCon Europe 2025 to Feature Broad Technical Program and New Applications"}

Eaton delivers edge-based innovation to help mitigate the impact of AI power bursting on both data centers and the grid

September 11, 2025

Industry-first solution helps customers detect AI load spikes to enhance resiliency of critical data center and grid infrastructure

New solution furthers Eaton’s grid-to-chip strategy, using power management innovation to meet critical data center energy challenges

CLEVELAND – Intelligent power management company Eaton today announced that it has achieved an industry-first solution for identifying large fluctuations in energy demanded by artificial intelligence (AI) computing infrastructure, known as AI power bursts. Eaton’s new edge-based solution, available via a firmware update for its Read More → "Eaton delivers edge-based innovation to help mitigate the impact of AI power bursting on both data centers and the grid"

Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers

GN1834D enables emerging 1.6T optical interconnect market while GN1818 offers up to 20% power reduction for enhanced 800G efficiency

September 11, 2025

SHENZHEN, China and CAMARILLO, Calif., September 8, 2025 – Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (“IoT”) systems and cloud connectivity service solutions, today announced two new FiberEdge® transimpedance amplifiers (TIAs) designed to address power efficiency challenges in AI infrastructure scaling. The new TIAs expand Semtech’s industry-leading signal integrity portfolio and further enhance power efficiency for continued 800G deployment optimization.

As AI workloads drive exponential bandwidth growth toward 1.6T infrastructure, power consumption has become a critical constraint in data center scaling. Semtech’s latest FiberEdge innovations directly address this challenge, with the GN1834 … Read More → "Semtech Unveils High-Performance TIAs for 1.6T AI Data Centers"

Semtech Launches 2.5G FTTR Chipset for Next-Generation PON Networks

Comprehensive 2.5G symmetric FTTR chipset delivers cost efficiency breakthroughs for expanding fiber-to-premises deployments

September 11, 2025

SHENZHEN, China and CAMARILLO, Calif., September 9, 2025 – Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (“IoT”) systems and cloud connectivity service solutions, today announced its comprehensive 2.5G symmetric Fiber to the Room (FTTR) chipset designed to accelerate global Passive Optical Network (PON) deployments. The integrated solution addresses critical cost and performance challenges as the FTTR market prepares for significant growth driven … Read More → "Semtech Launches 2.5G FTTR Chipset for Next-Generation PON Networks"

eSOL Enhances Its SDx Solutions with eMCOS® POSIX Achieving ISO 26262 ASIL D Automotive Safety Certification

Based on OS Technology, Realizing Software-First from Platforms to Applications

September 10, 2025

Tokyo, Japan, 9 September 2025 – eSOL, a leading developer of real-time embedded software solutions for the automotive and mobility industry, is pleased to announce that the core OS product eMCOS POSIX ver3.0, included in the eMCOS SDK software development kit, has been certified up to ASIL D as a SEooC (Safety Element out of Context) according to the ISO 26262:2018 functional safety standard for automotive applications by SGS-TÜV Saar, a certification body which provides third-party conformity assessment.

This marks the world’s first certification of a commercial real-time operating system (RTOS) based on a multikernel architecture. Its high and … Read More → "eSOL Enhances Its SDx Solutions with eMCOS® POSIX Achieving ISO 26262 ASIL D Automotive Safety Certification"

Avia Launches World’s First Apple HomeKit Smart Sash Fastener in the U.S. Market

New device alerts Apple users when sash windows are opened or closed, combining heritage style with smart security

September 10, 2025

SAN FRANCISCO, Sept. 09, 2025 (GLOBE NEWSWIRE) — Avia, the smart home security brand from Mighton Products, today announced the U.S. launch of the Avia Smart Sash Fastener, the world’s … Read More → "Avia Launches World’s First Apple HomeKit Smart Sash Fastener in the U.S. Market"