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Embedd promises freedom from MCU supplier lock-in with AI-enabled cross-vendor MCU configuration tool

September 23, 2025
  • Graphical MCU Configurator forms part of ambitious plan to remove hardware dependencies in embedded software
  • The new vendor-independent tool empowers OEMs to decouple hardware from software, accelerate go-to-market, and strengthen supply chain resilience.
 
Amsterdam, The Netherlands, 23 September – Embedd.it, a creator of embedded development tools, today released its cross-vendor Graphical MCU Configurator. The launch removes a major barrier to hardware decoupling, enabling electronics manufacturers to achieve vendor independence, accelerate development and boost supply chain resilience.

Sfera Labs Introduces SuperCaps UPS Expansion Board for Strato Pi Max

Ensuring Continuous Operation: Sfera Labs Launches New SuperCaps UPS Expansion Board for Strato Pi Max
September 23, 2025
Milan, Italy – September, 23 2025 – Sfera Labs has released the new SuperCaps UPS X2-Series Expansion Board, bringing integrated, supercapacitor-based backup power to its Strato Pi Max XL and XS servers.

The Strato Pi Max is already an incredibly compact and versatile industrial controller, based on the Raspberry Pi Compute Module 4 or 5, with a wide range of swappable expansion boards that adapt it to countless applications. With the addition of the SuperCaps UPS, the platform now gains built-in protection against power interruptions, ensuring continuous operation and safeguarding critical data.

The SuperCaps UPS expansion board integrates seamlessly with … Read More → "Sfera Labs Introduces SuperCaps UPS Expansion Board for Strato Pi Max"

Taoglas Expands Comet Antenna Series with Compact Screw-Mount Solutions Engineered for Metal Enclosures

September 23, 2025
San Diego, CA, 23 September 2025 – Taoglas®, a trusted provider of advanced RF and antenna solutions, today announced the expansion of its Comet Series with the new MA58x family of compact, discrete, screw- or through-hole mount puck antennas. Metal structures or flat surfaces, such as cabinets, can affect antenna performance and change the electrical groundplane. The Read More → "Taoglas Expands Comet Antenna Series with Compact Screw-Mount Solutions Engineered for Metal Enclosures"

Samtec Launches 800-Position AcceleRate® HP High-Performance Array Connectors

AcceleRate® HP high-performance array connectors feature 112 Gbps PAM4 performance, a flexible open pin field design, and a highly reliable Solder Column Termination.
September 23, 2025

New Albany, IN: Samtec, Inc., a global leader in high-performance interconnect solutions and a service leader in the industry, announces the expansion of its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5mm stack height.

Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635mm pitch. These connectors are optimized for high-throughput applications such as High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.

Key features include:

Avnet and Toradex announce global distribution partnership for SOMs built with NXP’s i.MX applications processors

September 23, 2025

PHOENIX – Sept. 23, 2025 – Avnet, Inc. (NASDAQ: AVT) and Toradex have entered into a global distribution agreement to provide customers worldwide with access to the company’s full portfolio of system on modules (SoMs), Single Board Computers (SBCs), and software tools.

The partnership expands Avnet’s embedded and edge computing offerings and gives engineers broader access to Toradex’s secure, scalable solutions. Through the addition … Read More → "Avnet and Toradex announce global distribution partnership for SOMs built with NXP’s i.MX applications processors"

Leankon NFC Antenna Solutions for Future Connectivity

September 22, 2025

Leankon, a global leader in innovative antenna solutions, is dedicated to simplifying antenna technologies for customers worldwide. We are proud to introduce our latest advancements in NFC antenna solutions LK1860xxx series, offering a diverse range of options to meet the needs of various applications across industries. 

Key Benefits of NFC Antenna Solutions for Industry:

STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

September 22, 2025

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that Rias Al-Kadi, General Manager of the Company’s Range and Connectivity Division, has joined the board of directors of the FiRa® Consortium, the industry body dedicated to advancing secured fine ranging and positioning ultra-wideband (UWB) technology.

ST is actively driving the development the IEEE 802.15.4ab amendment, building upon previous UWB enhancements to further improve system performance and expand UWB’s application scope. The ongoing evolution … Read More → "STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption"

EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications

September 22, 2025
Oxfordshire, United Kingdom and Munich, Germany, – September 22, 2025: EnSilica, a fabless supplier of mixed-signal and digital ASICs, and Codasip, a provider of functionally-safe and cyber-resilient RISC-V CPUs, announces a strategic partnership to enable custom ASICs incorporating CHERI ( … Read More → "EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications"
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