EEJournal

industry news archive
Subscribe Now

Tenstorrent and CoreLab partner to develop “Atlantis,” an open-architecture computing platform for robotics and automotive edge applications

September 25, 2025

SINGAPORE — September 25, 2025 — Tenstorrent, a leader in high-performance RISC-V CPUs and AI, and CoreLab Technology, a leader in custom processor IP and silicon solutions, are announcing a strategic partnership to deliver an industry-first open-architecture computing platform tailored for the fast-evolving … Read More → "Tenstorrent and CoreLab partner to develop “Atlantis,” an open-architecture computing platform for robotics and automotive edge applications"

Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West

September 24, 2025
  • Set to revolutionize semiconductor manufacturing operations, paving the way for self-healing factories and resilient supply chains
  • Demos of Via Connect and Via Co-Pilot available during SEMICON West October 7 to October 9 in Booth #7438
  • Via Automation “Developing Explainable Digital Twins and Connecting to Via CoPilot Agents for Autonomous Tool Operations” at Smart Manufacturing Theater

FREMONT, CALIF.––September 23, 2025––Via AutomationRead More → "Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West"

Bourns Introduces Semi-Shielded Power Inductor Series with Polarity Control for Optimized EMI Suppression

New automotive grade, AEC-Q200 compliant SRN5040TA-P Series meets stringent temperature and reliability requirements for advanced automotive systems
September 24, 2025

RIVERSIDE, Calif., September 24, 2025 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its SRN5040TA-P Series of Semi-Shielded Power … Read More → "Bourns Introduces Semi-Shielded Power Inductor Series with Polarity Control for Optimized EMI Suppression"

Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025

A typical 100K-instances data center can save up to 70 GWh in annual energy with ultrafast transient response, core voltage optimization and true vertical power delivery for kilowatt-class AI processors
September 24, 2025

SAN JOSE, Calif., Sept. 24, 2025 (GLOBE NEWSWIRE) — Empower Semiconductor, the world leader in powering AI-class processors, announced today that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025. With a combination of 20x faster transient response, 2x lower voltage droop and positioning under or near the processor, the Crescendo chipset enables gigawatt-hours (GWh) in energy savings for a typical AI data center. The breakthrough platform will be showcased at the Read More → "Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025"

MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM

A-PHY chipset installed in Geely Auto Group vehicles continues a series of design wins with automotive OEMs
September 24, 2025

BRIDGEWATER, N.J., Sept. 22, 2025 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced the first installation of an automotive-grade SerDes chipset based on the industry-leading Read More → "MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM"

Bringing Intelligence to Embedded Devices: Bittium Launches Embedded AI Offering and Announces Collaboration with Qualcomm

September 24, 2025

Bittium announces the launch of new Embedded AI offering, delivering intelligent on-device solutions for the telecommunication, IoT, defense, and satellite communication markets. This significant step ensures that Bittium’s turnkey product development services are AI-enabled, empowering customers with smarter, faster, and continuously evolving technology at the edge.

The Embedded AI offering marks a new step in Bittium’s growth strategy by combining expertise, technology, and partnerships to equip Bittium and its customers with intelligent, business-focused solutions that set the pace for the next generation of innovation.

As part of this initiative, Bittium is collaborating with … Read More → "Bringing Intelligence to Embedded Devices: Bittium Launches Embedded AI Offering and Announces Collaboration with Qualcomm"

Infineon CoolGaN™ technology boosts power performance in network PoE applications of Universal Microelectronics

September 24, 2025

Munich, Germany – 23 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides CoolGaN™ power transistors to Universal Microelectronics Co., Ltd. (UMEC) for the company’s new 250 W adapter for networking Power over Ethernet (PoE) applications. Infineon´s CoolGaN transistors enable reliable, high-performance solutions and help UMEC develop safer and energy-efficient technology to address modern power system challenges. These solutions are ideal for power electronics across various industries, including telecommunications, industrial electronics, medical technology, and consumer electronics.

GaN-based power devices provide … Read More → "Infineon CoolGaN™ technology boosts power performance in network PoE applications of Universal Microelectronics"

Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2

Global Availability of Development Boards and Next-Gen Evaluation Platform Set to Disrupt the IoT Landscape
September 24, 2025

AMSTERDAM, The Things Conference – Sept. 23, 2025 – Morse Micro, the world’s leading provider of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC).This milestone represents a major leap-forward for Wi-Fi HaLow, bringing unparalleled data throughput at range, which will enable the next generation of IoT and edge AI solutions.

“The MM8108 and … Read More → "Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2"

featured blogs
Everything You Ever Wanted to Know About Gyroscopic Precession (But Were Too Afraid to Ask)
Jan 29, 2026
Most of the materials you read and see about gyroscopic precession explain WHAT happens, not WHY it happens....
More from Max's Cool Beans...