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C‑BATT and UCF Team Up to Unlock the Full Potential of Next‑Gen Anode

Matching grant connects University expertise with industry innovation
October 1, 2025

Orlando, FL (Oct. 1, 2025) – C-BATT is teaming up with the University of Central Florida (UCF) to unlock new insights that will lead to higher-performing, longer-lasting batteries.

The Florida-based developer of an advanced anode material is working with UCF researchers to study in detail how its innovative material Obsidia™ performs while charging inside lithium-ion batteries. Testing shows longer cycle life, and the partnership will help optimize and unlock the full potential of Obsidia™.

“This partnership gives us a unique view of Obsidia in action—insight that speeds engineering decisions and reduces risk as we scale,” said Bill … Read More → "C‑BATT and UCF Team Up to Unlock the Full Potential of Next‑Gen Anode"

Vishay Intertechnology Power Metal Strip® Resistor Delivers Power to 5 W in Compact 1206 Case Size

Offering High Power Density of > 650 W/in2, Space-Saving Device Provides Low Resistance Down to 0.3 mΩ to Increase Efficiency
October 1, 2025

MALVERN, Pa. — Oct. 1, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new surface-mount Power Metal Strip® current sense resistor that combines a high power rating up to 5 W, TCR down to ± 75 ppm/°C, and extremely low resistance values down to 0.3 mΩ in the compact 1206 case size.

With power ratings 20 times higher than standard resistors in the 1206 footprint, the Vishay Dale WSLF1206 provides a power density of > 650 W/in², allowing designers to save board space in high power circuits by utilizing the smallest resistor possible without the need to parallel resistance elements. The device’s low TCR … Read More → "Vishay Intertechnology Power Metal Strip® Resistor Delivers Power to 5 W in Compact 1206 Case Size"

Molex Unveils New Design Engineering Report, Exploring Technology Innovations, Trends and Career Opportunities in Aerospace and Defense

September 30, 2025
  • Rapid adoption of artificial intelligence (AI) and mandates for open standards are reshaping the industry, creating both risks and rewards for engineering teams
  • AI-assisted decision making, cost reductions and extreme environments expected to have biggest impact on aerospace and defense design engineering in next decade
  • Aerospace and defense offers a demanding yet rewarding career path with strong job satisfaction and opportunities for continuous learning

 

LISLE, IL – September 30, 2025 – Read More → "Molex Unveils New Design Engineering Report, Exploring Technology Innovations, Trends and Career Opportunities in Aerospace and Defense"

Elma and TEWS Form Strategic Partnership to Facilitate Open Standards Innovation in Embedded Systems

Improved access to leading edge system integration support
September 30, 2025
Highlights
  • Expanded support for critical embedded systems developers
  • Joint expertise accelerates development cycles and reduces integration risk
  • Strengthens the open standards ecosystem

FREMONT, Calif., September 2025 – Elma Electronic has formed a strategic partnership with global embedded solutions provider, TEWS Technologies. Through collaboration and shared expertise, the two companies … Read More → "Elma and TEWS Form Strategic Partnership to Facilitate Open Standards Innovation in Embedded Systems"

Demand increases for low-voltage, high-power connectors as industrial and commercial transportation OEMs opt for electrified vehicles with a 48V mild hybrid system

TE Connectivity’s HALVONEX connectors portfolio provides a high current capacity, low voltage solution for use across systems ranging from 12V to 48V
September 30, 2025
BERYWN, Pa. – Sept. 30, 2025 – To increase fuel efficiency of internal combustion engines and mitigate CO2 emissions, manufacturers are rapidly electrifying on- and off-highway vehicles. While various electrification choices exist, many manufacturers are choosing to use a 48-volt mild-hybrid system, where a 48V battery is added alongside the traditional 12V battery, rather than a full-hybrid powertrain. To meet the needs of this architecture shift, Read More → "Demand increases for low-voltage, high-power connectors as industrial and commercial transportation OEMs opt for electrified vehicles with a 48V mild hybrid system"

Newark’s new supplier agreement with Altech expands access to industrial automation components

September 30, 2025

Phoenix – September 30, 2025: Newark, an Avnet company, has signed a new supplier agreement with Altech, a leading U.S.-based manufacturer of high-quality industrial automation and control components. The partnership brings Altech’s competitively priced, UL approved products to Newark’s customers across North America.

With over 40 years of industry experience, Altech, delivers reliable, high-performance components across automation, safety and medical markets. Their broad portfolio includes circuit breakers, terminal blocks, disconnect switches, power supplies, cord grips, and enclosures, all of which are now available through Newark.

This partnership … Read More → "Newark’s new supplier agreement with Altech expands access to industrial automation components"

Infineon introduces OptiMOS™ 7 application-optimized MOSFETs for industrial and consumer applications

September 29, 2025

Munich, Germany – 26 September 2025 – The rapid growth of power-hungry applications across various industries is placing unprecedented demands on power electronics in terms of power density, efficiency and reliability. Discrete power MOSFETs play a pivotal role in that context. An application-optimized approach opens new possibilities to further improve already highly advanced MOSFET technologies. Leveraging this use-case centric approach, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the OptiMOS™ 7 power MOSFET family for industrial and consumer markets, extending the already existing OptiMOS 7 automotive portfolio. Designed … Read More → "Infineon introduces OptiMOS™ 7 application-optimized MOSFETs for industrial and consumer applications"

Alchip and Ayar Labs Unveil Co-Packaged Optics for AI Datacenter Scale-Up

Joint innovation enables ultra-high bandwidth, low latency, high radix, and energy efficiency for multi-rack AI clusters
September 29, 2025

SAN JOSE, Calif. — Sept. 26, 2025 — At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Alchip Technologies, the high-performance ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, unveiled a CPO solution that is designed to efficiently extend scale-up network connectivity beyond traditional rack boundaries.

This joint offering aims to address data movement bottlenecks that are slowing AI infrastructure by effectively reducing system stall times and enabling next-gen, large, high-performance AI clusters.

As AI models and cluster sizes continue to grow, … Read More → "Alchip and Ayar Labs Unveil Co-Packaged Optics for AI Datacenter Scale-Up"

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