Teradyne Unveils Titan HP
Breakthrough system level test solution for cloud infrastructure and artificial intelligence devices
October 2, 2025
NORTH READING, Mass., Oct. 2, 2025 – Read More → "Teradyne Unveils Titan HP"
Altera Expands Agilex FPGA Portfolio and Streamlines Developer Experience
October 2, 2025
Key News Highlights:
- As the largest pure-play FPGA solutions provider, Altera is fueling growth by simplifying FPGA development and scaling programmable solutions to meet the needs of FPGA developers.
- Announces production availability of all Agilex FPGA and SoC FPGA device families.
- Launches new Visual Designer Studio tool in Quartus Prime Software version 25.3 to bring a new level of ease-of-use to system design entry and integration.
- Increases logic density in Agilex 5 D-Series FPGAs and SoCs up to 2.5X to address edge AI, 4K/8K video, … Read More → "Altera Expands Agilex FPGA Portfolio and Streamlines Developer Experience"
Infineon expands CoolSiC™ portfolio with 400 V and 440 V MOSFETs for high-power and compute-intensive applications
October 2, 2025
Munich, Germany – 30 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its CoolSiC™ MOSFETs 400 V G2 portfolio with the top-side-cooled (TSC) TOLT package as well as the TO-247-3 and TO-247-4 packages. In addition, three new products in the TOLL package have been introduced, with rated voltages of 440 V (continuous) and 455 V (transient). The new CoolSiC MOSFETs deliver improved thermal performance, system efficiency, and power density. They have been specifically designed to meet the requirements of high-power and … Read More → "Infineon expands CoolSiC™ portfolio with 400 V and 440 V MOSFETs for high-power and compute-intensive applications"
11th Annual ISS National Lab and NSF Announce Funding Opportunity for Physical Science Research on Space Station
October 2, 2025
KENNEDY SPACE CENTER (FL), September 30, 2025 – The U.S. National Science Foundation (NSF) and the International Space Station (ISS) National Laboratory are proud to announce up to $3.6 million in total funding available for multiple projects to advance transport phenomena research using the orbiting laboratory.
NLM Photonics Validates Silicon-Organic Hybrid Performance at 200G and Beyond in Third-Party Multi-Channel Testing
October 2, 2025
SEATTLE, WA — September 30, 2025 — NLM Photonics, a leader in hybrid organic electro-optic (OEO) technology, today announced breakthrough validation results from third-party testing of multi-channel silicon-organic hybrid (SOH) photonic integrated circuits (PICs) capable of 1.6 terabit (1.6T) and 3.2 terabit (3.2T) performance. In addition to record-breaking modulation efficiency and bandwidth, NLM’s 1.6T SOH PIC achieved 224Gbit/s per channel data transmission in tests. These results represent real-world improvements in 200G performance and pave the way for 400G in a commercially available silicon photonics platform.
NLM’s testing confirmed multiple industry firsts, including a world record SOH modulation efficiency of 0.31 V-mm … Read More → "NLM Photonics Validates Silicon-Organic Hybrid Performance at 200G and Beyond in Third-Party Multi-Channel Testing"
ROHM Develops New Smart Switches Optimized for Zonal Controllers
October 2, 2025
Santa Clara, CA and Kyoto, Japan, Sept. 30, 2025 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced the release of six new high-side smart switches (IPDs: Intelligent < … Read More → "ROHM Develops New Smart Switches Optimized for Zonal Controllers"
Enclustra Expands Global Portfolio with Launch of New Physical AI & Machine Learning Technology Line
October 1, 2025
| Zurich, Switzerland – October 1, 2025 – Enclustra, the Swiss-based leader in FPGA innovation with a strong footprint across Europe, the Americas, and Asia, today announced the launch of its new Edge AI & Physical AI Technology Line. This milestone builds on the March 2025 announcement at Embedded World, Nuremberg, of Enclustra’s strategic partnership with SiMa.ai and the joint introduction of the MLSoC Modalix System-on-Module (SoM), leveraging SiMa.ai’s 50 TOPS MLSoC device.
With industries worldwide accelerating digital transformation, Enclustra’s new product line addresses … Read More → "Enclustra Expands Global Portfolio with Launch of New Physical AI & Machine Learning Technology Line" |
Solidigm Unveils AI Central Lab, Home to Highest-Performing and Most Dense Storage Test Clusters
October 1, 2025
Rancho Cordova, Calif., Oct. 1, 2025 – Solidigm, a pioneer in enterprise data storage, today announced … Read More → "Solidigm Unveils AI Central Lab, Home to Highest-Performing and Most Dense Storage Test Clusters"
Infineon presents first high-density trans-inductance voltage regulator (TLVR) power modules optimized for AI data centers
October 1, 2025
Munich, Germany – 01 October 2025 – As a result of the rapid growth of cloud-based services, particularly those enabling artificial intelligence (AI), data centers are now responsible for more than two percent of global energy consumption. This figure is expected to rise further, with exponential growth of 165 percent predicted between 2023 and 2030. Continuously improving efficiency, power density, and signal integrity of power conversion from the grid to the core is therefore critical to advancing computing performance while reducing total cost of ownership (TCO). To … Read More → "Infineon presents first high-density trans-inductance voltage regulator (TLVR) power modules optimized for AI data centers"
W-Cube mission complete: Kuva Space achieves first 75 GHz signal in orbit, paving the way for faster satellite connectivity
October 1, 2025
Helsinki, Finland | October 1st, 2025 — Finnish hyperspectral microsatellite and AI-powered insights company Kuva Space today announced the conclusion of its W-Cube mission, a 3U CubeSat that became … Read More → "W-Cube mission complete: Kuva Space achieves first 75 GHz signal in orbit, paving the way for faster satellite connectivity"
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Jan 29, 2026
Most of the materials you read and see about gyroscopic precession explain WHAT happens, not WHY it happens....