Navitas Unveils 5th Generation SiC Trench-Assisted Planar (TAP) Technology
February 12, 2026
TORRANCE, CA – February 12th, 2026 — … Read More → "Navitas Unveils 5th Generation SiC Trench-Assisted Planar (TAP) Technology"
EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026
February 11, 2026
Oxfordshire, United Kingdom – February 11, 2026: EnSilica, a fabless supplier of mixed-signal and digital ASICs and a European design and manufacturing services partner, will showcase its turnkey custom silicon capabilities at embedded world 2026, taking place from March 10 – 12 at the Nürnberg Messe, Germany. EnSilica designs and delivers custom ASICs to OEMs and system houses, managing the full journey from concept through to volume manufacture, and drawing on a broad portfolio of proven core IP.
At the show, EnSilica will demonstrate how complex system requirements are translated into production-ready ASICs, covering system architecture, mixed-signal and RF design, verification, test, qualification … Read More → "EnSilica to highlight turnkey ASIC expertise and European supply resilience at embedded world 2026"
Vishay Intertechnology Standard Thick Film Chip Resistors Combine Sulfur Resistance With Long Term Stability
February 11, 2026
MALVERN, Pa. — Feb. 11, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified standard thick film chip resistors. The RCA-SR e3 series combines proven sulfur resistance with long term stability in five compact case sizes for automotive, industrial, and telecommunications applications.
Designed for use in sulfur-containing environments, the resistors released today provide a sulfur withstand capability in accordance with ASTM B809-25, demonstrating a maximum resistance drift of 1 % after 1000 h at 60 °C. Competing devices are tested at the same temperature for shorter duration. In addition, the RCA-SR e3 series ensures high stability across challenging … Read More → "Vishay Intertechnology Standard Thick Film Chip Resistors Combine Sulfur Resistance With Long Term Stability"
Infineon’s Silicon Carbide Power Semiconductors Selected for TOYOTA’s New “bZ4X”
February 11, 2026
Munich, Germany and Tokyo, Japan – 9 February 2026 – Infineon Technologies (FSE: IFX / OTCQX: IFNNY) today announced that CoolSiC™ MOSFETs (silicon carbide (SiC) power MOSFETs) have been adopted in the new bZ4X model from Toyota, the world’s largest automaker. Integrated into the on-board charger (OBC) and DC/DC converter, the SiC MOSFETs leverage the material’s advantages of low losses, high thermal resistance, and high voltage capability to help extend driving range and reduce charging time.
“We are very proud that … Read More → "Infineon’s Silicon Carbide Power Semiconductors Selected for TOYOTA’s New “bZ4X”"
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
February 11, 2026
ROCKVILLE, MD., – February 10, 2026 – The explosive growth of IoT and smart home markets is driving demand for highly integrated, power-efficient connectivity solutions that simplify design and accelerate time-to-market. Addressing this need, Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that Renesas Electronics Corporation has integrated Read More → "Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home"
Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance
February 11, 2026
MILPITAS, Calif. – February 10, 2026 – Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The Read More → "Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance"
Same Sky Adds Slide Potentiometers to Potentiometers Product Line
February 10, 2026
LAKE OSWEGO, Ore. — February 10, 2026 — Same Sky’s Motion and … Read More → "Same Sky Adds Slide Potentiometers to Potentiometers Product Line"
Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making
February 10, 2026
Chandler, Ariz., February 10, 2026 — A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks. Microchip Technology (Nasdaq: MCHP) has extended its edge AI offering with full-stack solutions that streamline development of production-ready applications using its microcontrollers (MCUs) and microprocessors (MPUs) – the devices that are located closest to the many sensors at the edge that gather sensor data, control motors, trigger alarms and actuators, and more.</ … Read More → "Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making"
TDK presents DC link capacitors for up to +125 °C in demanding automotive and industrial applications
February 10, 2026
February 10, 2026
TDK Corporation (TSE: 6762) announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable energy buffering even in tightly packed inverter environments. This performance is particularly relevant for xEV traction inverters, onboard chargers, and DC-DC converters, where elevated ambient temperatures and continuous ripple loads are common.
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May 6, 2026
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