ST. PAUL, Minn., Dec. 29, 2025 /PRNewswire/ — 3M (NYSE: MMM) today announced two digital innovations that will accelerate customer design workflows:
ORLANDO, FL (December 19, 2025) – The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the Read More → "2026 IEEE Electronic Components and Technology Conference Announces Student Innovation Challenge; Result Reports Must be Submitted by January 19, 2026"
SAN JOSE, CALIF. – DECEMBER 22, 2025 – Greenliant has been sampling its high endurance, small form factor (16mm x 20mm) NVMe NANDrive™ EX Series ball grid array (BGA) solid state drives (SSDs) for a growing number of next generation industrial, aerospace and mission critical programs. Designed with Greenliant’s industry leading EnduroSLC™ Technology, GLS85LE NVMe NANDrive continues to attract strong interest due to its ability to operate in the most challenging conditions, its high performance and its focus on long-term reliability and data integrity. See NVMe NANDrive information at https://www.greenliant.com/NVMe-BGA-SSD</ … Read More → "Greenliant NVMe NANDrive™ SSDs Selected for Major Industrial, Aerospace and Mission Critical Programs"
SANTA CLARA, Calif., Dec. 22, 2025 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced in advance of CES its reaffirmed commitment to advancing the drone market with high-performance, low-power system-on-chips (SoCs) that combine industry-leading video processing with on-device artificial intelligence (AI). As drones evolve from “flying cameras” to intelligent robotic platforms with higher autonomy, Ambarella is investing in technologies that help drone makers deliver higher image quality, lower latency decision-making, and more autonomous capabilities without relying on constant cloud connectivity.
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, is expanding its software-defined vehicle (SDV) solution offerings centered around the fifth-generation (Gen 5) R-Car family. The latest device in the Gen 5 family, the R-Car X5H is the industry’s first multi-domain automotive system-on-chip (SoC) manufactured with advanced 3nm process technology. It is capable of simultaneously running vehicle functions across advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and gateway systems.
Renesas has begun sampling Gen 5 silicon and now offers full evaluation boards and the Read More → "Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform"
Munich, Germany – 16 December 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the world leader in power systems and automotive microcontrollers (MCUs), and Lenovo, a global technology powerhouse, are intensifying their collaboration to accelerate the next level of autonomous driving. Lenovo’s flagship autonomous driving domain controller units AD1 and AH1 will take advantage of Infineon’s AURIX™ family of microcontrollers to support advanced driving assistance systems (ADAS), energy efficiency and high-speed data exchange across in-vehicle networks. The collaboration aims at enabling … Read More → "Infineon and Lenovo accelerate next level of autonomous driving with high-performance computing platforms for software-defined vehicles"
| Saarbrücken and Munich, Germany, Dec. 16, 2025 – HighTec EDV Systeme, the world’s largest commercial open-source compiler vendor, and Intellias, a global software engineering and digital consulting company, present the successful integration of Rust into automotive applications within an AUTOSAR environment. This was completed through the combined use of the Intellias ECU Kit, HighTec’s compiler toolchain, and RTOS and software components from Vector Informatik. Working collaboratively and leveraging Infineon AURIX™ microcontrollers, the ecosystem partners achieved a smooth migration from legacy C/C++ to a hybrid C/C++ and Rust environment, … Read More → "HighTec and Intellias Showcase Hybrid C/C++ and Rust Integration in AUTOSAR Classic Applications" |
Bytom, Poland [16.12.2025] Designed as a drop-in, higher-bandwidth, lower-power alternative to I²C and SPI, the DI3CM-HCI brings robust performance and scalability to designs that depend on increasingly dense arrays of sensors and actuators. The IP fully conforms to MIPI I3C Basic v1.1.1 and demonstrates general compliance with the MIPI I3C HCI Specification 1.1, making it ideal for SoC teams preparing for next-generation architectures.
“We’re seeing a clear shift in the industry toward I3C as the new baseline for intelligent peripheral connectivity,”< … Read More → "DI3CM-HCI, A High-Performance MIPI I3C Host Controller IP Core for Next-Generation Embedded Designs"
Tin monosulfide (SnS) is a promising, earth-abundant material for thin-film solar cells, but device performance has long been limited by defects and unwanted reactions at the rear contact interface. Now, researchers from Korea demonstrate that inserting an ultra-thin germanium oxide layer between the molybdenum back contact and SnS region mitigates these issues. Their findings highlight how interface engineering can greatly boost power conversion efficiency, paving the way for improving performance in many such electronics and energy technologies.
As the world urgently seeks clean energy solutions, solar power stands out for its abundance and scalability compared to other … Read More → "Chonnam National University Researchers Resolve Long-Standing Limitation in Thin-Film Solar Cells"
MORRISVILLE, NC (DECEMBER 16, 2025) – Read More → "NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production"
