News – Page 33 – EEJournal

NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset

October 30, 2025

NXP unveils industry-first, battery management system (BMS) chipset with built-in Electrochemical Impedance Spectroscopy (EIS) using precise hardware-based synchronization of all battery cell measurements within a single high-voltage battery pack
Brings lab-grade diagnostics into vehicles, enhancing battery health insights and expanding NXP’s electrification portfolio with advanced monitoring capabilities
Simplified and cost-efficient battery cell monitoring allows automakers track battery health, improve electric vehicle (EV) safety, and support fast charging

EINDHOVEN, The Netherlands, October 29, 2025 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced its industry-first Electrochemical Impedance Spectroscopy (EIS) battery … Read More → "NXP Improves Battery Health Monitoring with EIS Capable Battery Management Chipset"

Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications

October 29, 2025

Munich, Germany – 29 October – Industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies operate under harsh conditions and fluctuating load profiles. These systems demand high efficiency, robust power cycling capability and long lifetime. To meet these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching EasyPACK™ C, the next generation of its EasyPACK package family. The first products in this new package are silicon carbide (SiC) power modules that integrate Infineon’ … Read More → "Silicon carbide power modules in new EasyPACK™ C package enhance efficiency and lifetime of industrial applications"

New High Current Pogo Pin Models Boast Ratings up to 25 Amps

October 29, 2025

LAKE OSWEGO, Ore. — October 29, 2025 — Same Sky’s Interconnect Group today announced the continued expansion of its Read More → "New High Current Pogo Pin Models Boast Ratings up to 25 Amps"

New QSMP-23 module offers cost-optimised STM32 MPU platform to boost machine learning edge computing

QFN-style 27mm2 SoM features dual ARM Cortex-A35, NPU, VPU & GPU to combine ML edge processing with powerful multimedia capabilities

October 29, 2025

Oxfordshire, UK, October 2025: Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and support development for cost-optimised ML edge computing applications with Read More → "New QSMP-23 module offers cost-optimised STM32 MPU platform to boost machine learning edge computing"

Alpha Data unveils industry-first COTS solutions built on AMD Versal™ RF adaptive SoCs

Accelerating Mission-Ready System Deployment Across Aerospace, Defense, and Communications.

October 29, 2025

ALPHA DATA, a leader in high-performance FPGA-based Commercial Off-The-Shelf (COTS) solutions, today announced the launch of three groundbreaking products leveraging AMD Versal™ RF Series adaptive SoCs.

These are the first deployable solutions based on the Versal RF adaptive SoCs, offering unprecedented integration and performance from a single chip, for system developers in aerospace, defense, communications, test and measurement, and space ground-segment applications.

The new product range includes:

ADA-PA310 – PCIe® deployment card for workstation and server-class computing
ADA-SA320 – Stand-alone solution for prototyping and rack-mounted environments
< … Read More → "Alpha Data unveils industry-first COTS solutions built on AMD Versal™ RF adaptive SoCs"

Curtiss-Wright Expands NVIDIA-Accelerated GPU Family with 6U VPX Module for AI at the Edge

New VPX6-731 adds dual NVIDIA RTX PRO 5000 Blackwell GPUs and Fabric100™ high-speed interconnects to industry’s leading SOSA® aligned 6U portfolio

October 29, 2025

ASHBURN, VA. – October 28, 2025 – Read More →

Curtiss-Wright Introduces New PacStar 431 Edge AI Module Accelerated by NVIDIA IGX Thor

PacStar 400-Series-based small-form-factor solution delivers real-time AI inferencing and sensor fusion at the edge

October 29, 2025

ASHBURN, VA. – Oct. 28, 2025 – Read More →

Samtec Expands Offering of Slim, High-Density AcceleRate® HD Array Connectors

AcceleRate HD slim, high-density array connectors now available with 16 mm stack heights and up to 400 total positions.

October 28, 2025

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces expanded stack heights and pin counts of its AcceleRate^® HD product line. … Read More → "Samtec Expands Offering of Slim, High-Density AcceleRate® HD Array Connectors"

EIZO Announces Development of NVIDIA Jetson Thor 3U VPX SBC

October 28, 2025

The SOSA^® aligned 3U VPX SBCs are designed for low-latency video ingest, multi-sensor processing, and … Read More → "EIZO Announces Development of NVIDIA Jetson Thor 3U VPX SBC"

Ruggedized 6 Watt DC/DC Converters with Ultra-Wide 8:1 Inputs

October 28, 2025

San José, Calif. – October 27, 2025: TRACO Power is proud to announce the release of the new TEC 6UI series of ruggedized 6 Watt DC/DC converters.

The TEC 6UI series comprises isolated DC/DC converters featuring an ultra-wide input range. These next-generation converters are engineered to seamlessly replace and serve as an alternative to existing 2:1 and 4:1 input converter series – delivering uncompromised performance and cost-efficiency. With an input voltage range of 9 to 75 VDC, the TEC 6UI supports a broad spectrum of standard bus voltages, reducing the need for multiple model variants within a single … Read More → "Ruggedized 6 Watt DC/DC Converters with Ultra-Wide 8:1 Inputs"