SANTA CLARA, Calif., Oct. 18, 2010 — Agilent Technologies Inc. (NYSE: A) today announced that its N7309A chipset software now supports  RF IC and MxFEs (mixed signal front ends) converters from Analog Devices, including the ADF4602 and AD9963.

The new devices address the high-volume manufacturing test needs of Percello’s Aquilo Femtocell System-on-a-Chip (SoC) product line. The N7309A chipset software … Read More → "Agilent Technologies Adds New Devices to Chipset Software, Expands Percello’s Femtocell SoC Capabilities"

Uppsala,Sweden, 19th October 2010. IAR Systems today announced its strategy to strengthen the development of its power debugging technology introduced in 2010. The ability to correlate source code with power consumption, which enables power savings, has created significant interest from customers and partners. Based on this there will be several new product additions that span across the technology chain.

New analysis features will be added to IAR Embedded Workbench to help developers better understand how the software impacts system power consumption. Most importantly, power debugging will be made available for more target architectures, the first to be revealed … Read More → "IAR Systems extends development of power debugging technology"

MOUNTAIN VIEW, Calif., Oct. 19 /PRNewswire/ — The Interoperable PDK Libraries (IPL) Alliance announced today that STMicroelectronics has joined the Alliance as the first semiconductor board member. STMicroelectronics brings years of experience in multi-vendor analog/mixed-signal design flows to further the IPL Alliance’s efforts in creating and promoting interoperable process design kit (iPDK) standards.

The IPL Alliance is an industry-wide collaborative effort to develop an interoperable ecosystem for custom design. Its current focus is on PDK standards. The IPL Alliance released IPL 1.0, the semiconductor industry’s first open standard for interoperable process design kits, in February 2010. Semiconductor companies … Read More → "STMicroelectronics Joins the IPL Alliance as the First Semiconductor Board Member"

MOUNTAIN VIEW, Calif. – October 19, 2010 – CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today introduced the CEVA-XC323™, the industry’s first high performance vector DSP for 4G wireless infrastructure applications. The CEVA-XC323 delivers up to 4x performance improvement in wireless infrastructure applications compared to incumbent infrastructure VLIW DSPs, such as those offered by Texas Instruments, and lowers the overall bill-of-materials by significantly reducing the number of processors and hardware accelerators required. The CEVA-XC323 is already in design with a wireless infrastructure vendor for 4G Software Defined Radio ( … Read More → "CEVA Expands into 4G Wireless Infrastructure Market with Industry-first Vector DSP for Software Defined Radio Platforms"

MOUNTAIN VIEW, Calif., Oct. 18 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that its 23rd Electronic Design Automation (EDA) Interoperability Forum will expand its focus to include system-level design interoperability topics, in addition to verification and analog design updates. A special live Conversation Central session will focus on the importance of system-level design tools interoperability in the wireless supply chain, with Synopsys host Karen Bartleson interviewing Will Strauss, principal analyst at … Read More → "Synopsys’ 23rd EDA Interoperability Forum to Feature System-Level Design Tool Interoperability Focus"

Unterpremstaetten, Austria (October 18, 2010) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has announced the AS8650 smart power management System Basis Chip (SBC) which is the first to combine a DC-DC converter and a high-speed transceiver on one chip. The AS8650 features high efficiency of 85 % minimum over all operation use-cases, while high integration reduces cost, space and development time for engine control units (ECU) with a high-speed CAN interface.

The AS8650 SBC includes three LDOs (low-drop-out voltage regulators) with programmable outputs from 1.8 V to 3.3 V. Each LDO is powered by the embedded … Read More → "austriamicrosystems unveils the AS8650 SBC for automotive applications, the industry’s first with integrated DC-DC converter & CAN interface"

SANTA CLARA, Calif., Oct. 15, 2010 — Agilent Technologies Inc. (NYSE:A – News) today introduced the Agilent 53200 RF and universal frequency counter/timer series, the first frequency counters with LXI Class C compliance.

The 53200 series, featuring industry-leading performance and usability, is built with standard computing I/O for ease of connectivity and data collection. The combination of high-speed … Read More → "Agilent Technologies Introduces Industry’s First LXI RF and Universal Frequency Counter/Timers"

Campbell, CA – October 14, 2010 – Silicon Frontline Technology, Inc. (SFT) an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that its software has been used to accurately verify over 250 electronic designs to date. The company now has over 25 customers, who use its software to analyze power devices, nanometer and Analog Mixed Signal (A/MS) designs. This list includes 10 of the world’s top 30 semiconductor companies. In addition, leading foundries have validated Silicon Frontline’s products … Read More → "Silicon Frontline Continues on Path to Success, Verifies Hundreds of Designs with Its Post-Layout EDA Software"

WILSONVILLE, Ore., October 15, 2010—Mentor Graphics Corporation (NASDAQ: MENT) today announced that NVIDIA has adopted the Olympus-SoC™ product for multi-corner, multi-mode (MCMM) design closure of their high performance graphics processors. The Olympus-SoC system significantly reduces time to market while improving quality of results with advanced design closure capabilities like synchronized optimization, interconnect re-synthesis and physical SDC, in addition to MCMM closure for very large designs.

“We build some of the world’s largest and highest performance ICs and it’s crucial for us to maintain design schedules in the face of increasing IC … Read More → "NVIDIA Uses Mentor’s Olympus-SoC Place and Route System for Leading-Edge Graphics Processors"

San Francisco, October, 14 2010 – EE Times Group, a UBM company and the daily source of essential business and technical information for the electronics industry’s decision makers, today announced the conference program for DesignCon, historically the season opening event for the electronics design community. The annual conference and trade show begins January 31st at the Santa Clara Convention Center, Santa Clara, CA, and runs through February 2nd, with the companion Exhibition running February 2nd and 3rd. Agilent Technology has been named the event’s Host Sponsor, and will be holding a half-day educational forum on January 31st … Read More → "Calling all Chipheads: DesignCon Announces 2011 Program"