News – Page 2319 – EEJournal

Agilent Technologies, Altair Semiconductor Team Up to Accelerate LTE Device and Test Equipment Maturity

February 11, 2011

SANTA CLARA, Calif., and HOD HASHARON, Israel, Feb. 10, 2010 – Agilent Technologies Inc. (NYSE: A) and Altair Semiconductor today announced they will jointly conduct interoperability testing and validation testing using Altair’s 4G LTE chipset in conjunction with the Agilent PXT wireless communications test set and Read More → "Agilent Technologies, Altair Semiconductor Team Up to Accelerate LTE Device and Test Equipment Maturity"

Ericsson energy-optimized, intermediate bus DC/DC converters offer unprecedented efficiency across a wide load range

February 11, 2011

Integral energy optimization algorithm for 96% peak efficiency and substantially flat curve from 15% to 100% load
Footprint 100% compatible with “Five-pin” intermediate bus converters in existing designs
Tightly regulated output voltage
Based on a proven family of digitally-controlled DC/DC converters launched in 2008

Based on a digital core … Read More → "Ericsson energy-optimized, intermediate bus DC/DC converters offer unprecedented efficiency across a wide load range"

IAR Systems launches complete development kit for Freescale Kinetis™ K60 family of MCUs and modular Tower System

February 10, 2011

February 10th, 2011 – Uppsala, Sweden. IAR Systems today announced availability of a new IAR KickStart Kit for Freescale Semiconductor’s ARM® Cortex™-M4 based Kinetis™ family of microcontrollers that is compatible with the Freescale Tower System development platform. This module-based kit allows rapid evaluation of and prototyping with the Kinetis microcontroller family in application areas such as industrial control, medical, and consumer electronics. It includes hardware boards, debug probe, software tools and code examples.

As part of the Tower … Read More → "IAR Systems launches complete development kit for Freescale Kinetis™ K60 family of MCUs and modular Tower System"

Synopsys and Varian Collaborate on Process Models for Advanced Logic and Memory Technologies

February 10, 2011

MOUNTAIN VIEW, Calif. and GLOUCESTER, Mass., Feb. 10, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, and Varian Semiconductor Equipment Associates, Inc. (Nasdaq: VSEA), the leading producer of ion implantation equipment used in the manufacture of semiconductors, today announced a collaboration to develop Technology CAD (TCAD) models for cryogenic ion implantation. By enabling faster optimization of the cryogenic implant process through simulation, the models derived from this collaboration will speed up process development of advanced CMOS and memory technologies and reduce process development cost and time-to-market.

Ion implantation … Read More → "Synopsys and Varian Collaborate on Process Models for Advanced Logic and Memory Technologies"

Wolfson’s DSP and software suite provides world-leading HD Audio solution and significantly improves battery performance

February 10, 2011

Edinburgh, UK, February 10 2011 – Wolfson Microelectronics plc has today announced the next step in its journey towards delivering a complete high definition (HD) audio solution by unveiling the WM0010, Wolfson’s first ever fully programmable standalone audio digital signal processor (DSP) with a selection of sound enhancement software.

The WM0010 is one of the first products of its type on the market to incorporate a low power, high performance Tensilica HiFi DSP core. Working in tandem with the application processor, it combines Wolfson’s low power audio co-processor with embedded system software, algorithms and software … Read More → "Wolfson’s DSP and software suite provides world-leading HD Audio solution and significantly improves battery performance"

SOI Industry Consortium announces FD-SOI technology offers substantial power advantages for next-generation mobile and consumer applications

February 10, 2011

Boston, MA, February 10, 2011 – The SOI Industry Consortium today announced results of an assessment and characterization of Fully-Depleted Silicon-on-Insulator (FD-SOI) technology, demonstrating that this advanced CMOS silicon technology is well suited to address the increasing low-power, high-performance requirements for mobile and consumer applications. A joint collaboration between Consortium members—ARM, GLOBALFOUNDRIES, IBM, STMicroelectronics, Soitec, and CEA-Leti—has demonstrated key benefits of planar FD-SOI technology for these applications based on an ARM processor. Planar FD-SOI technology enables substantial improvements in performance and power consumption for next-generation mobile devices, delivering high-performance applications with rich multimedia and communications functionality, … Read More → "SOI Industry Consortium announces FD-SOI technology offers substantial power advantages for next-generation mobile and consumer applications"

MIPS Technologies and 4M Wireless Demonstrate 3G/4G Multimode Protocol Stacks on MIPS® Architecture

February 10, 2011

SUNNYVALE, Calif. – February 10, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, announced today that 4M Wireless, the leading provider of LTE protocol stack software, will demonstrate 3G/4G multimode User Equipment (UE) operation on the MIPS® architecture during the 2011 Mobile World Congress, being held February 14-17, in Barcelona, Spain. 4M Wireless has ported its PS100 LTE Protocol Stack for UE terminals onto a platform based on the MIPS32® 24K® core running the Android™ operating system. The … Read More → "MIPS Technologies and 4M Wireless Demonstrate 3G/4G Multimode Protocol Stacks on MIPS® Architecture"

Digi-Key Corporation and Interlink Electronics Announce Signing of Global Distribution Agreement

February 10, 2011

Thursday, February 10, 2011 – THIEF RIVER FALLS, Minnesota, and Camarillo, California USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation and Interlink Electronics Announce Signing of Global Distribution Agreement"

New XMC Module with Configurable Spartan-6 FPGA Targets Cost-Sensitive Embedded Computing Tasks

February 10, 2011

WIXOM, Mich., Feb. 10, 2011 /PRNewswire/ — To address the need for low-cost configurable FPGA computing solutions, Acromag released new XMC-SLX mezzanine modules featuring an economical Read More → "New XMC Module with Configurable Spartan-6 FPGA Targets Cost-Sensitive Embedded Computing Tasks"

Saelig Weighs in With Smart Load Sensor

February 10, 2011

Pittsford, NY: Saelig Company, Inc. (Saelig) (www.saelig.com) announces LoadSense – an intelligent load sensor that can be integrated with a crane hook, fork lift or other handling device for intelligent feedback of loading events. It has an on-board single-chip computer for recording, analyzing and archiving readings, and wireless communications to transfer data in real … Read More → "Saelig Weighs in With Smart Load Sensor"