News – Page 2266 – EEJournal

HDR Video Camera Development Kit and Evaluation Reference Design Now Available For LatticeECP3 FPGA Family

February 22, 2011

HILLSBORO, OR -FEBRUARY 22, 2011-Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the release of the Lattice HDR-60 Video Camera Development Kit, a production-ready High Definition (HD) video camera development system based on the LatticeECP3™ FPGA family. Pre-loaded with a plug and play evaluation Image Signal Processing (ISP) pipeline based on Intellectual Property (IP) Cores from Lattice partner Helion GmbH, the Kit works right out of the box. The IP is capable of delivering 1080p performance at 60 frames per second with 2D noise reduction and High Dynamic Range (HDR). Designed with a form factor to … Read More → "HDR Video Camera Development Kit and Evaluation Reference Design Now Available For LatticeECP3 FPGA Family"

Digi-Key Corporation Expands Product Line with TT electronics

February 22, 2011

Tuesday, February 22, 2011 – THIEF RIVER FALLS, Minnesota, USA –Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Expands Product Line with TT electronics"

Second Generation High Voltage Battery Stack Monitor Advances Hybrid/Electric Vehicle Battery Management Systems

February 22, 2011

MILPITAS, CA – February 22, 2011 – Linear Technology announces the LTC®6803, a second generation high voltage battery monitor for hybrid/electric vehicle (HEVs), electric vehicles (EVs) and other high voltage, high performance battery systems. The LTC6803 is a complete battery measuring IC that includes a 12-bit ADC, a precision voltage reference, a high voltage … Read More → "Second Generation High Voltage Battery Stack Monitor Advances Hybrid/Electric Vehicle Battery Management Systems"

S2C to Exhibit at DVCon

February 22, 2011

Who/What

S2C Inc. will be demonstrating its rapid SoC/ASIC prototyping system in booth 1003 at DVCon. S2C supports both Altera and Xilinx flows and is used in designing leading-edge SoCs and ASICs. The system includes TAI Logic Modules, TAI Player Pro Software, and a broad array of Prototype ReadyTM IP, accessories, and platforms.

Synopsys Announces Immediate Availability of Silicon-Proven DesignWare Data Converter IP in SMIC 65-nm LL Process Technology

February 22, 2011

MOUNTAIN VIEW, Calif., Feb. 22, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the immediate availability of the silicon-proven DesignWare™ Data Converter IP for SMIC’s popular 65-nanometer (nm) Low Leakage (LL) process technology, enabling designers to improve their chips’ power efficiency and ease their integration efforts. Synopsys is the first IP provider to offer a comprehensive portfolio of high-performance data converter IP solutions consisting of analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) in this high density, low leakage process technology. The DesignWare Data Converter IP is … Read More → "Synopsys Announces Immediate Availability of Silicon-Proven DesignWare Data Converter IP in SMIC 65-nm LL Process Technology"

Swissbit announces INDUSTRIAL 2GB & 4GB DDR3 SODIMMs with Heat Spreader and / or Conformal Coating

February 21, 2011

Bronschhofen, Switzerland – February 21, 2011 – Swissbit announces new variations of its INDUSTRIAL family of DDR3 SODIMMs. In order to increase the heat dissipation and to avoid thermal hot spots on the memory modules in systems with difficult cooling, Swissbit can add an aluminum heat spreader to the existing portfolio of DDR3 SODIMMs. The dual sided heat spreader is attached with a thermally conductive tape and increases the heat dissipating area, thus reducing the critical high case temperatures which otherwise might lead to failing bits. … Read More → "Swissbit announces INDUSTRIAL 2GB & 4GB DDR3 SODIMMs with Heat Spreader and / or Conformal Coating"

RFMD® Unveils Power Platform for Entry-Level 3G Handsets

February 21, 2011

Barcelona, Spain, February 14, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the expansion of the Company’s 3G product portfolio to include a complete power platform for entry-level 3G handsets. The RF323x power platform, comprised of the RF323x and RF72xx product families, provides handset manufacturers a complete reference design for the implementation of multi-region multimode 3G handset platforms.

First Qseven Module with NVIDIA Tegra290 ARM CPU

February 21, 2011

Stutensee, Germany – With the MSC Q7-NT2, MSC Vertriebs GmbH presents its first ARM^® processor based Qseven™ module. The compact module consumes only 5 W typical and is specified for an extended ambient temperature range from -40°C to +85°C. The excellent graphics performance of the embedded module allows playback of HD videos and is, among other applications, ideally suited for digital signage.

Microsoft^® Windows^® CE operating system and support for the open source, free Linux is currently offered for … Read More → "First Qseven Module with NVIDIA Tegra290 ARM CPU"

Advantech Announces New ATCA Platform Integration Services To Accelerate Network Solutions Development

February 21, 2011

Irvine, California, February 18, 2011 – Advantech, a global manufacturer of telecom computing blades and multi-core network processor platforms, today announced new ATCA Platform Integration Services at Mobile World Congress 2011 and RSA 2011. With these services, Advantech can create customized ATCA platforms to meet the application-specific needs of Telecom Equipment Manufacturers and Network Solution Providers. The Advantech ATCA Platform Integration Service delivers cost-optimized platform solutions utilizing blade and platform technology from Advantech as well as 3^rd party hardware and software.

“Advantech& … Read More → "Advantech Announces New ATCA Platform Integration Services To Accelerate Network Solutions Development"

Space-saving socket option for energy friendly microcontrollers

February 21, 2011

Oslo, Norway, February 21, 2011 – Energy Micro, the energy friendly microcontroller company, has announced it is making its EFM32 Gecko and Tiny Gecko product lines available in the space-saving QFP48 package. The smaller 48-pin ARM® Cortex(TM)-M3 based microcontroller options will enable manufacturers to take device footprint down to 7mm x 7mm at a pin pitch of 0.5mm.

The QFP48 Gecko product offers the same range of low energy peripherals as its larger QFP100 packaged variant, including a multiple … Read More → "Space-saving socket option for energy friendly microcontrollers"