News – Page 2218 – EEJournal

D-Tools, Inc. Announces 2011 “PROJECT: Success” Design Awards Contest Call for Entries

May 9, 2011

CONCORD, CA— MAY 06, 2010 — D-Tools, Inc., the worldwide leader in system integration software, today announced call for entries for their annual contest PROJECT: Success Design Awards. D-Tools is pursuing SI5.5 user’s greatest success stories and project designs that display how the software has positively affected their business and ROI. Winning success stories submitted by some of most distinguished System Integrators will be selected from the D-Tools user base. The contest is sponsored by D-Tools MVP Partners Atlantic … Read More → "D-Tools, Inc. Announces 2011 “PROJECT: Success” Design Awards Contest Call for Entries"

Power Modules with Additional Low Inductive Current Path

May 9, 2011

May 6th 2011 – Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path.

The first results of the new idea to separate the current paths into a static low resistive screw contact and in a transient low inductive PCB-based connection are promising. The limit for … Read More → "Power Modules with Additional Low Inductive Current Path"

New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains

May 9, 2011

SANTA CLARA, Calif., May 4, 2011 – Intel Corporation today announced a significant breakthrough in the evolution of the transistor, the microscopic building block of modern electronics. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional structure will be put into high-volume manufacturing. Intel will introduce a revolutionary 3-D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer (nm) node in an Intel chip codenamed “Ivy Bridge.” A nanometer is one-billionth of a meter.

The three-dimensional Tri-Gate transistors represent a … Read More → "New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains"

LDRA Implements Homeland Security’s Secure Programming Guidelines

May 6, 2011

San Bruno, CA, May 3, 2011. LDRA, the leading provider of automated software verification, source code analysis, and test tools, has achieved Common Weakness Enumeration (CWE) Compatibility for the LDRA tool suite. The CWE project aims to better understand flaws in software … Read More → "LDRA Implements Homeland Security’s Secure Programming Guidelines"

Realtek Semiconductor Corp. Selects Forte’s SystemC High-Level Synthesis, Floating Point IP Software for SoC Design

May 6, 2011

SAN JOSE, CALIF. –– May 5, 2011 –– Realtek Semiconductor Corp. of Hsinchu, Taiwan, has selected high-level synthesis (HLS) software and floating point intellectual property (IP) from Forte Design Systems™ for the design and development of systems on chip (SoCs) for communications network, computer peripheral and multimedia applications.

Forte’s Cynthesizer™ SystemC high-level synthesis software and CellMath™ were purchased after a thorough evaluation because they improved overall quality of results (QoR) and turnaround time ( … Read More → "Realtek Semiconductor Corp. Selects Forte’s SystemC High-Level Synthesis, Floating Point IP Software for SoC Design"

Neonode announces collaboration with Texas Instruments enabling next-generation touch screen devices

May 6, 2011

SANTA CLARA, Calif. – May 3, 2011 – Neonode, Inc. (NEON.OB), a leading optical touch screen technology company, today announced a collaboration with Texas Instruments Incorporated (TI) to further develop and improve the functionality, performance and cost advantage of zForce^®, Neonode’s patented optical touch screen technology.

Neonode and TI are working together on several commercial projects which use TI’s series of ultra-low-power MSP430™ microcontrollers. By further co-development of zForce^® and TI’s 16-bit microcontrollers, OEM’s can touch enable any surface at a low cost, independent … Read More → "Neonode announces collaboration with Texas Instruments enabling next-generation touch screen devices"

Expansion Modules Address SBC Form Factor Fragmentation

May 6, 2011

San Jose, Calif. — May 2, 2011 — Diamond Systems Corporation, a leading global supplier of compact, rugged, embedded computing solutions for real-world applications in a broad range of markets, today unveiled a new family of I/O expansion modules for systems based on single-board computers (SBCs) that expand using either PCI/104-Express, PC/104-Plus, or SUMIT-ISM. The modules implement identical analog and digital I/O feature-sets on all three formats, letting companies choose their favorite expansion format now, while reserving the option of migrating to an alternate format in the future without major rework … Read More → "Expansion Modules Address SBC Form Factor Fragmentation"

Atmel New Evaluation Kits Target Wireless ZigBee PRO and RF4CE Applications

May 6, 2011

ESC Silicon Valley, San Jose, CA, May 4, 2011 – Atmel^®Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, today announced the availability of the ZigBee RF4CE wireless evaluation kit designed for ZigBee PRO and ZigBee RF4CE application development and prototyping. Atmel is also launching the REB231ED-EK evaluation kit with antenna diversity support for the Atmel AT86RF231 device.

The kits support ZigBee application profiles such as Smart Energy, Home and Building Automation, Remote Control, as well as IEEE 802.15.4 and proprietary wireless applications. ZigBee-compliant software stacks are available … Read More → "Atmel New Evaluation Kits Target Wireless ZigBee PRO and RF4CE Applications"

Synopsys’ DesignWare SuperSpeed USB 3.0 xHCI Host Controller IP Receives USB-IF Certification

May 6, 2011

MOUNTAIN VIEW, Calif., May 5, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that its DesignWare® SuperSpeed USB 3.0 xHCI (Extensible Host Controller Interface) IP has successfully passed the USB Implementers Forum (USB-IF) SuperSpeed USB certification. The xHCI specification provides a standardized method for SuperSpeed USB (USB 3.0) host controllers to communicate with the USB 3.0 software stack. To achieve certification, the IP must support the new U1 and U2 power modes as … Read More → "Synopsys’ DesignWare SuperSpeed USB 3.0 xHCI Host Controller IP Receives USB-IF Certification"

Digi-Key Corporation and Peregrine Semiconductor Ink Global Distribution Agreement

May 6, 2011

Thursday, May 5, 2011 – THIEF RIVER FALLS, Minnesota, and San Diego, California, USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation and Peregrine Semiconductor Ink Global Distribution Agreement"