News – Page 2213 – EEJournal

New U.S Export Regulations Reclassify Linear Technology’s 12-bit 200Msps, 14-bit 125Msps and 16-bit 10Msps ADCs for Export to China & Russia

July 12, 2011

MILPITAS, CA – July 12, 2011 – Linear Technology Corporation is pleased to announce new Export Classification Control Numbers (ECCN) for their families of high performance, high speed ADCs with sample rates of up to 200Msps at 12-bit, 125Msps at 14-bits and 10Msps at 16-bit resolutions. New U.S. Export Administration Regulations have allowed these devices to be reclassified from ECCN# 3A001 to the less stringent ECCN# 3A991. This new classification provides engineers with the capability to use Linear ADCs to develop and export high performance products that can compete freely on the world market.

Linear Technology offers a … Read More → "New U.S Export Regulations Reclassify Linear Technology’s 12-bit 200Msps, 14-bit 125Msps and 16-bit 10Msps ADCs for Export to China & Russia"

Honeywell Introduces TruStability® NSC Series, Uncompensated/Unamplified Board Mount Pressure Sensors

July 12, 2011

MINNEAPOLIS, July 12, 2011 – Honeywell (NYSE: HON) today introduced the Honeywell TruStability® NCS Series, Uncompensated/Unamplified Board Mount Pressure Sensors. The TruStability® NSC Series offers customers the flexibility of self-calibration, combined with industry-leading stability, accuracy and repeatability, making these sensors ideal for precise and efficient performance in a variety of potential industrial and medical applications.

The TruStability® NSC … Read More → "Honeywell Introduces TruStability® NSC Series, Uncompensated/Unamplified Board Mount Pressure Sensors"

Green Hills Software to Present and Exhibit at The Imaging Channel Managed Print Summit and World Expo in Las Vegas

July 12, 2011

SANTA BARBARA, CA — July 12, 2011 — Green Hills Software, the largest independent vendor of embedded software solutions, will deliver a technology presentation and participate in a panel discussion at the Imaging Channel Managed Print Summit, July 19, 2011, and World Expo, July 20-21, 2011. Green Hills Software will also demonstrate its latest embedded software solutions.

Presentation

Topic: IT Security for Devices and Networks
When: Tuesday, July 19, 2011, 10:00 am — 10:30 am
Where: The Imaging Channel Managed Print Summit, Mandalay Bay, Las Vegas, NV
Who: Gordon Jones, Vice President, Green Hills Software

Synopsis:</ … Read More → "Green Hills Software to Present and Exhibit at The Imaging Channel Managed Print Summit and World Expo in Las Vegas"

ORBexpress Extends Support to QNX Neutrino RTOS 6.5

July 12, 2011

HERNDON, VA – July 11, 2011 – Objective Interface Systems, Inc. (OIS), the world’s leading provider of high-performance, real-time and embedded communications middleware solutions, today announced that its ORBexpress^® product supports the QNX^® Neutrino^® Realtime Operating System (RTOS) 6.5. OIS is a long-time partner of QNX Software Systems Limited, and the ORBexpress communications middleware framework supports the QNX Neutrino RTOS on a variety of ARM, Power and x86 processors.

The QNX Neutrino RTOS is a full-featured and robust … Read More → "ORBexpress Extends Support to QNX Neutrino RTOS 6.5"

Imec achieves breakthroughs in enabling future DRAM and RRAM

July 11, 2011

Leuven, Belgium – July 11, 2011 – In the frame of its research on future memory architectures, imec has made breakthroughs for both DRAM and RRAM memories. For DRAM, MIMcap (metal-insulator-metal capacitor) was established as a clear candidate for 1X DRAM scaling. Imec demonstrated a record low leakage current and was able to explain the mechanism for leakage reduction, showing the path for further potential improvement. For Resistive RAM (RRAM), imec built a model to understand the properties of the filaments that result in a stable RRAM operation. Such fundamental understanding of … Read More → "Imec achieves breakthroughs in enabling future DRAM and RRAM"

Imec demonstrates implant-free quantum-well SiGe pFETs for future high-performance CMOS architectures

July 11, 2011

Leuven, Belgium – July 11, 2011 – Imec announces that it has successfully fabricated implant-free quantum-well (IF-QW) pFETs with an embedded silicon-germanium (SiGe) source/drain. These devices show an excellent short channel control and a record logic performance. A benchmark against various competing technologies showed competitive results. Finally, the device performance was also demonstrated at low operating voltages. These results prove that this device architecture is a viable option for the 16nm technology node and beyond.

Next-generation multimedia applications will … Read More → "Imec demonstrates implant-free quantum-well SiGe pFETs for future high-performance CMOS architectures"

Synopsys Announces Critical Milestone in 20-nm Design Enablement Collaboration with Samsung Electronics

July 11, 2011

MOUNTAIN VIEW, Calif., July 11, 2011— Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced that its design enablement collaboration with Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, has achieved a critical milestone with the successful tapeout of the first 20-nanometer (nm) test chip based on Samsung’s High-k metal gate (HKMG) process technology. The test chip was implemented using Synopsys’ Galaxy^™ Implementation Platform, including the Design Compiler^® synthesis, IC Compiler place-and-route, In-Design physical verification with IC … Read More → "Synopsys Announces Critical Milestone in 20-nm Design Enablement Collaboration with Samsung Electronics"

Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications

July 11, 2011

Leuven, Belgium – July 11, 2011 – Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.

The 3D stack resembles as close as possible to future commercial chips. It consists of imec’s … Read More → "Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications"

Temperature-to-Voltage Converter Measures Remote Diodes with 1°C Accuracy

July 11, 2011

MILPITAS, CA – July 11, 2011 – Linear Technology Corporation introduces the LTC2997, a high accuracy temperature-to-voltage converter with built-in series resistance cancellation for 2.5V to 5.5V systems. Many low voltage systems today rely on temperature to assess overall system health and reliability. Traditional implementations require a series of filters, a precise reference and a current source, resulting in … Read More → "Temperature-to-Voltage Converter Measures Remote Diodes with 1°C Accuracy"

Synopsys Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation Support

July 11, 2011

?MOUNTAIN VIEW, Calif., July 11, 2011—Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced IC Compiler-Advanced Geometry, a new configuration of its market-leading IC Compiler physical design product. IC Compiler-Advanced Geometry targets design support for double-patterning technology (DPT), which has emerged as a key requirement for the next generation of silicon technology at 20 nanometers (nm) and imposes strict constraints on placement, routing and physical verification. As industry leaders in IC design and manufacturing race to prepare for 20nm technology, Synopsys has successfully collaborated with foundry partners as well as major … Read More → "Synopsys Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation Support"

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