Canon launches the FPA-5510iV, Canon’s first back-end semiconductor lithography tool for 3D Packaging
San Jose, CA, September 8, 2011 – Canon U.S.A., Inc., a leader in digital imaging, has announced its entry into the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV semiconductor lithography tool for next-generation semiconductor packaging.
As smart phones, tablet PCs and other electronic devices become progressively smaller and more intelligent, the demand for integration and shrinkage on semiconductor devices continues to increase. One way to realize such integration is to employ a three-dimensional layout of chips, layering multiple semiconductor chips vertically and interconnecting the chips to configure a single device. To facilitate this … Read More → "Canon launches the FPA-5510iV, Canon’s first back-end semiconductor lithography tool for 3D Packaging"

