Alchimer Discloses Major TSV Barrier Film Advance; 100 Percent Step Coverage Boosts Fill Speed and Quality
TAIPEI, Taiwan – A new film-deposition technology advance from Alchimer S.A. promises to cut fill deposition times and provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production.
Alchimer today disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform, guaranteed 100 percent step coverage over complex silicon topography, including high-aspect-ratio vias with scalloped walls. The barrier layer is one of the bottom-most elements in the TSV film stack. Alchimer’s unprecedented coverage capability means that subsequent depositions can … Read More → "Alchimer Discloses Major TSV Barrier Film Advance; 100 Percent Step Coverage Boosts Fill Speed and Quality"

