Texas Instruments Selects IDT Serial RapidIO Gen2 IP for Wireless-Optimized DSP

SAN JOSE, Calif.–(BUSINESS WIRE)–IDT® (Integrated Device Technology, Inc.) (NASDAQ:IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced its Serial RapidIO® Gen2 program consisting of a comprehensive portfolio of IP, switches, evaluation platforms and tools. At the same time, IDT announced its Serial RapidIO Gen2 endpoint Intellectual Property (IP) has been selected by Texas Instruments (TI) for use in its wireless optimized digital signal processors (DSPs). The combination of the IDT Serial … Read More → "IDT Introduces Serial RapidIO Gen2 Development Program"

SOI Test Chip Results Detailed at IEEE Conference

CAMBRIDGE, England–(BUSINESS WIRE)–ARM [(LSE:ARM); (Nasdaq:ARMH)] announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176™ processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditional bulk process technology when designing low-power processors for high-performance consumer devices and mobile … Read More → "ARM Announces 45nm SOI Test Chip Results That Demonstrate Potential 40 Percent Power Savings Over Bulk Process"

UPDM 1.0 given final sign-off as a formal OMG standard

Washington DC, USA and Cheltenham, UK – 7th October 2009. Artisan® Software Tools, the world’s largest independent supplier of industrial-grade, collaborative modeling tools for complex, mission and safety-critical systems and software, has announced that it has helped successfully steer UPDM (the Unified Profile for DoDAF/MODAF) to OMG standardization approval. The content definition and preparation of the UPDM 1.0 specification was led by Artisan and No-Magic as co-chairs of the UPDM Group, drawing on the extensive experience of Artisan’s … Read More → "Artisan helps steer UPDM through OMG standardization in record time"

High quality DesignWare IP speeds time-to-market for STM32 Connectivity Line of SoCs

MOUNTAIN VIEW, Calif. – October 7, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that STMicroelectronics (ST) has achieved first-pass silicon success for its STM32 Connectivity Line of system-on-chips (SoCs) utilising the Synopsys DesignWare(r) USB 2.0 On-The-Go (OTG) and Ethernet digital controllers. ST, a global leader in developing and delivering SoC and semiconductor solutions, evaluated several IP vendors and selected Synopsys DesignWare IP solutions because they are high-quality, include the right feature set, and have … Read More → "Synopsys DesignWare USB 2.0 and Ethernet IP enables first-pass silicon success for STMicroelectronics"

Improved collaboration, lifecycle management and measurement capabilities target semiconductor, photovoltaic and thin film MEMs sectors

Dortmund, Germany – 6th October 2009 – Process Relations has today launched the latest version of its XperiDesk Process Development Execution System (PDES) software. XperiDesk 2009.2 delivers a new module, XperiSim, that provides a generic simulation and calculation interface, together with the management of simulation and calculation modules. These additional tools combined with the core capabilities of the XperiDesk system, give engineers even more time to focus on tackling the technical challenges involved with what-if process development, rather than data collection and management.

ASQED 2010, August 2-3, Penang, Malaysia

SAN JOSE, CA, PENANG, Malaysia – October 6, 2010 – The International Society for Quality Electronic Design (ISQED) today announced that its 2nd annual Asia Symposium on Quality Electronic Design (ASQED) will be held in Penang, Malaysia on August 2-3, 2010. Recipients of the ASQED 2009 Best Research Papers awards included Taiwan’s National Chiao Tung University, the Indian Institute of Science, and Texas Instruments (India).

ASQED 2009 in Kuala Lumpur, Malaysia attracted over 350 foreign and local participants, and featured five keynote speeches, two tutorials and over 80 technical presentations. It was the … Read More → "The International Society for Quality Electronic Design (ISQED) Announces 2010 Asia Symposium on Quality Electronic Design (ASQED), 2009 Award Recipients"

SANTA CLARA, Calif., Oct. 5, 2009 — Agilent Technologies Inc. (NYSE: A) today introduced 200-MHz and 800-MHz, high-voltage differential probes. The differential probes provide superior general-purpose differential signal measurements required for today’s high-speed power measurements, vehicle bus measurements and digital system designs.

The Agilent N2792A and N2793A differential probes offer 10:1 attenuation, allowing them to be used for a broad range of applications. The probe comes with various probe tip accessories for use with small and large components in tight places.

The differential probes have an input resistance of 1 M? (for N2792A) and 200 … Read More → "Agilent Technologies Introduces Probes for General-Purpose Differential Signal Measurements"

MOUNTAIN VIEW, Calif. – October 6, 2009 – Synopsys, Inc. (NASDAQ: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that the U.S. Department of Energy’s National Renewable Energy … Read More → "Synopsys’ Sentaurus TCAD used to simulate solar cell performance characteristics at NREL Simulation provides key insights in the design and optimisation of solar cells"

KAWASAKI (Japan), DUESSELDORF (Germany), PUNE (India), SANTA CLARA, Calif. (USA), October 6, 2009 – NEC Electronics Corporation (TSE:6723) and KPIT Cummins (BSE: 532400; NSE: KPIT), today announced the availability of an AUTOSAR 3.0-compatible software package for various hardware platforms. This … Read More → "NEC Electronics and KPIT Cummins Collaborate on New AUTOSAR 3.0-Compatible Solution"

SANTA CLARA, Calif., Oct. 5, 2009 — Agilent Technologies Inc. (NYSE: A) today announced that SystemVue version 2009.08 is now available for download. It features a number of new capabilities including an automated link that unlocks RF-DSP co-design and a fully … Read More → "Agilent Technologies’ SystemVue 2009.08 Unlocks RF-DSP Co-design, Custom Flow for “Model-Based Design”"