eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms
SUNNYVALE, CA – October 7, 2011 – eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), and MIPS Technologies (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores, announced the tapeout of a high-performance, three-way microprocessor cluster on GLOBALFOUNDRIES’ leading-edge, low-power 28nm-SLP process technology. Wafers are currently running in GLOBALFOUNDRIES’ Fab 1 in Dresden, Germany, with silicon expected in early 2012. SoC designs can start immediately. MIPS provided the RTL based on its leading-edge MIPS32® 1074Kf™ Coherent Processing System (CPS), and eSilicon performed the synthesis and timing-driven layout, optimizing the design to achieve true worst-case … Read More → "eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms"

