News – Page 2180 – EEJournal

Extensive Range of MIL Spec Power Modules available from Powerstax

September 9, 2011

Powerstax, one of Europe’s leading application-rich power solutions specialists, announces the availability of its PX range of competitively priced, high reliability MIL standard DC:DC converters and pre-regulator, filter and hold-up modules.

Tim Worley, CEO of Powerstax comments; “ Our PX range of power modules offers designers one stop shop for complete board level power solutions.”

The Powerstax PX range of DC:DC converters contains more than 40 products including single, dual and triple output versions with output power up to 30W. All models have an ultra-wide DC input range of 16-40V … Read More → "Extensive Range of MIL Spec Power Modules available from Powerstax"

TI’s integrated three-phase brushless motor pre-driver reduces board space up to 60 percent while driving up to 60-A FETs

September 9, 2011

DALLAS (Sept. 9, 2011) – Texas Instruments Incorporated (TI) (NYSE:TXN) today introduced the first in a new line of integrated three-phase brushless motor pre-drivers. The DRV8301 is the most highly integrated pre-driver available today, reducing board space as much as 60 percent compared to the next closest integrated solution. It can drive sub-10-A to 60-A external FETs, providing current scalability, improved thermal performance and greater efficiency in brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) applications, such as ventilation pumps, medical pumps, commercial refrigeration cooling systems, robotics, power tools, e-bikes and other high-torque industrial motor … Read More → "TI’s integrated three-phase brushless motor pre-driver reduces board space up to 60 percent while driving up to 60-A FETs"

Renesas Electronics Introduces SuperH Microcontrollers that Combine Connectivity Functions Such as USB and System Control Capabilities on a Single Chip

September 9, 2011

Dusseldorf, September 8, 2011 – Renesas Electronics , a premier provider of advanced semiconductor solutions, today announced the availability of the company’s 6 new 32-bit microcontrollers (MCU), the SH726A and SH726B. The new MCUs are designed to lower the system … Read More → "Renesas Electronics Introduces SuperH Microcontrollers that Combine Connectivity Functions Such as USB and System Control Capabilities on a Single Chip"

ADLINK Technology Presents Feature-rich 3U CompactPCI® PlusIO Compatible Blade with IPMI and TPM support

September 9, 2011

September, 2011, San Jose, CA – ADLINK Technology Inc. (TAIEX: 6166), a leading supplier of industrial building blocks, introduces the cPCI-3970 Series, the first 3U CompactPCI PlusIO compatible processor blade in its product lineup that supports high-speed serial point-to-point connections. The ADLINK cPCI-3970 Series is equipped with the latest quad and dual core 2nd Generation Intel® Core™ i7/i5 processor?also known as Sandy Bridge?with ECC memory support, and the Intel® QM67 Platform Controller Hub (PCH). It is a high performance solution for applications in industrial control and automation, transportation, and medical segments that require enhanced graphics … Read More → "ADLINK Technology Presents Feature-rich 3U CompactPCI® PlusIO Compatible Blade with IPMI and TPM support"

JTAG Technologies Targets Functional Testers

September 9, 2011

DALLAS (Sept. 8, 2011) – Texas Instruments Incorporated (TI) (NYSE: TXN) today expanded its 1.8-V, rail-to-rail input and output, general purpose operational amplifier (op amp) portfolio with the first in a new line of op amps for low-voltage, battery-powered, cost-sensitive industrial, consumer and medical applications. The dual OPA2314 op amp provides the best combination of power and performance, with low quiescent current, low noise and a wide 1.8-V to 5.5V supply range. The device uses up to 40 percent less quiescent current compared to its closest competitor to extend the battery life of smoke and carbon monoxide detectors, portable media players, … Read More → "JTAG Technologies Targets Functional Testers"

Mercury Computer Systems Commends Successful ACB-12 Aegis SPY-1 Radar System Live Aircraft Test Flight

September 8, 2011

CHELMSFORD, Mass. – September 7, 2011 – Mercury Computer Systems Inc., (NASDAQ: MRCY, www.mc.com), a trusted provider of commercially developed ISR subsystems, applauds the successful performance of Lockheed Martin’s multi-mission signal processor (MMSP), which identified and tracked numerous live targets in a recent live aircraft test. Part of the ACB-12 Aegis SPY-1 radar system, … Read More → "Mercury Computer Systems Commends Successful ACB-12 Aegis SPY-1 Radar System Live Aircraft Test Flight"

Pickering Interfaces Introduces new High Density PXI RF SPDT Switches

September 8, 2011

Clacton on Sea, UK, September 2011 – Pickering Interfaces is expanding its range of PXI RF switches with the introduction of the 40-754 SPDT switch module.

The 40-754 supports up to 17 off SPDT RF switches in a single module and is available in two different versions based on a common switch design.

The high density version occupies just one slot of a 3U PXI chassis … Read More → "Pickering Interfaces Introduces new High Density PXI RF SPDT Switches"

Canon launches the FPA-5510iV, Canon’s first back-end semiconductor lithography tool for 3D Packaging

September 8, 2011

San Jose, CA, September 8, 2011 – Canon U.S.A., Inc., a leader in digital imaging, has announced its entry into the semiconductor back-end manufacturing tool market with the launch of the FPA-5510iV semiconductor lithography tool for next-generation semiconductor packaging.

As smart phones, tablet PCs and other electronic devices become progressively smaller and more intelligent, the demand for integration and shrinkage on semiconductor devices continues to increase. One way to realize such integration is to employ a three-dimensional layout of chips, layering multiple semiconductor chips vertically and interconnecting the chips to configure a single device. To facilitate this … Read More → "Canon launches the FPA-5510iV, Canon’s first back-end semiconductor lithography tool for 3D Packaging"

QNAP Announces the Availability of QMobile V1.0.5 for Android

September 8, 2011

Taipei, Taiwan, September 7, 2011 – QNAP^® Systems, Inc. today announced that QMobile V1.0.5 is available for download in Android Market.

What’s new in QMobile V1.0.5

1. Added Simplified Chinese localization;

2. Added transverse view support;

3. Added multilingual system warning messages;

4. Enhanced playback performance of the Music Player.

Availability

QMobile is available for … Read More → "QNAP Announces the Availability of QMobile V1.0.5 for Android"

Xilinx Accelerates Broadcast Industry Adoption of Video over IP at IBC 2011

September 8, 2011

AMSTERDAM, Sept. 8, 2011 – Today, at the IBC 2011 Conference (Hall 10, Stand #10.D25), Xilinx, Inc. (NASDAQ: XLNX) announced the availability of its SMPTE 2022-5/-6 intellectual property core, the company’s newest building block for broadcast equipment developers delivering the internet protocol (IP) -based systems needed to cut the high cost of transporting raw, high-bit video from remote events, to studios, to post editing houses, and other points along the production process. The core brings Forward Error Correction (FEC) for video over IP to Xilinx’s Broadcast Real-Time Video Engine Targeted Design Platform so developers can quickly build flexible, high-bandwidth … Read More → "Xilinx Accelerates Broadcast Industry Adoption of Video over IP at IBC 2011"

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