PHOENIX—September 14, 2011 — Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), announced today the instant availability to check order status and Read More → "Android Users Now Have Access to Supply Chain Central from Avnet Electronics Marketing Americas — Right in the Palm of Their Hands"
Clacton on Sea, UK, September 12th, 2011 –Pickering Interfaces is expanding its range of 6U PXI matrices with the introduction of the 45-541 and 45-542 high density matrices.
The 45-541 is a reed relay matrix occupying one slot of a 6U PXI chassis which provides a 132×8 matrix that supports 0.5A switching and up to 10W hot switch capacity. User connections are provided through easy to use 50 way D Type connectors. The module includes BIRST ( … Read More → "Pickering Interfaces Introduces new 6U PXI Switch Matrices"
Dusseldorf, September 14, 2011 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, today announced that it has received VDE (the German Association for Electrical, Electronic & Information Technologies) certification for its IEC60335-compliant self-test software for the RX600 and RL78 microcontroller (MCU) families. The latest self-test CPU software routines developed for the RX600 and … Read More → "Renesas Electronics Europe Releases Free-of-Charge VDE Certified Self-Test MCU Software for IEC60730/60335 Safety Compliance"
WILSONVILLE, Ore., September 14, 2011—Mentor Graphics Corporation (NASDAQ: MENT) today announced a collaboration with TSMC to support SmartFill functionality in the Calibre® YieldEnhancer product for TSMC’s manufacturing processes starting at 65nm. The analysis and automatic filling capabilities of the SmartFill solution allow designers to achieve IC fill constraints with minimal impact on circuit performance in a single pass without manual customization or modification.
“We have worked closely with Mentor to create an effective fill solution for advanced nodes. SmartFill is designed to handle the new fill requirements of our most advanced process technologies,& … Read More → "Mentor Graphics and TSMC Address Advanced Node Fill Requirements Using Calibre SmartFill"
TAIPEI, Taiwan – A new film-deposition technology advance from Alchimer S.A. promises to cut fill deposition times and provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production.
Alchimer today disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform, guaranteed 100 percent step coverage over complex silicon topography, including high-aspect-ratio vias with scalloped walls. The barrier layer is one of the bottom-most elements in the TSV film stack. Alchimer’s unprecedented coverage capability means that subsequent depositions can … Read More → "Alchimer Discloses Major TSV Barrier Film Advance; 100 Percent Step Coverage Boosts Fill Speed and Quality"
MSFT BUILD, Anaheim, CA, September 14, 2011 – Today at the BUILD conference, Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch solutions, announced that the Atmel maXTouch® mXT1386 is the first touch controller to enable touch performance with Microsoft® Corp.’s new touch-centric operating system, Windows® 8. The mXT1386 controller is used in the Samsung® Windows Developer Preview PC. Leveraging Atmel’s proven maXTouch technology, the mXT1386 is the first device in Atmel’s maXTouch family that will support Windows 8 for touchscreens in a variety of sizes.
Touch interfaces have had explosive growth and … Read More → "Atmel Industry-Leading maXTouch Controllers Support Windows 8"
SAN FRANCISCO, Sept. 13, 2011 /PRNewswire/ — (Intel Developer Forum) – Eurotech, a leading supplier of embedded technologies, products and systems, announces today they have launched Release 1.4 of the Everyware™ Software Framework to offer developers more options to get their products to market faster with an integrated hardware and software infrastructure. Read More → "Eurotech Updates Everyware™ Software Framework to Further Simplify Embedded Development"
Taipei, Taiwan, September 14, 2011 – VIA Labs, Inc., a leading supplier of SuperSpeed USB (USB 3.0) integrated chip controllers, today announced that the VIA Labs VL800 4-port and VL801 2-port SuperSpeed USB Host controllers have achieved SuperSpeed USB certification by the USB Implementers Forum (USB-IF). As SuperSpeed USB adoption rapidly gains momentum throughout the industry, the growing number of USB-IF certified products continues to drive a competitive and innovative ecosystem.
“VIA Labs has been a leader in developing a full spectrum of SuperSpeed USB products,” said Dr. Daniel Lin, President, … Read More → "VIA Labs USB 3.0 Host Controllers Receive USB-IF Certification"
XP Power today announced an addition to its ECS family of ultra compact single output industrial and medical AC-DC power supplies. Believed to be the smallest 60 W unit currently available on the market, the ECS60 extends the power density benchmark already set by the ECS series. Measuring just 2 x 3 x 1.05 inches (50.8 x 76.2 x 26.7 mm), the ECS60 unit takes up 25% less space than the current industry 2 x 4 inch footprint.
Featuring a no load power of less than 0.5 W, this highly efficient convection cooled unit, typically between 87% – 89%, helps customer’s end-product comply with internationally recognized energy efficiency standards. The … Read More → "XP Power delivers 60 Watts from ultra compact 2″ x 3″ format"
BOISE, Idaho and GLASGOW, United Kingdom, 2011-09-13 14:03 CEST (GLOBE NEWSWIRE) — Crucial, a leading global brand of memory and storage upgrades, announced today at Intel® Developer Forum (IDF) its plans to launch Crucial Load-Reduced DIMM (LRDIMM) modules in support of the forthcoming Intel Xeon processor E5 family. As companies grow, IT managers and systems administrators are constantly struggling to meet the needs of new and demanding applications. In recognition of these challenges, Crucial will be making available LRDIMM server memory which will support higher memory densities than standard DDR3 RDIMMs, and allow the addition of … Read More → "Crucial to Support Next-Generation Intel(R) Server Platform With New Server Memory"
