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KLA-Tencor Introduces Additions To Sensarray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions

MILPITAS, Calif., December 5, 2011—KLA-Tencor Corporation (NASDAQ: KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related industries, today introduced new additions to its SensArray portfolio of advanced wireless temperature monitoring wafers. The portfolio implements time-based, in-situ temperature monitoring to capture the effect of the process environment on production wafers, which helps integrated circuit (IC) manufacturers improve their capital equipment ROI.

Developed through collaboration with leading IC manufacturers and original equipment manufacturers (OEMs), the EtchTemp™-SE (ET-SE), … Read More → "KLA-Tencor Introduces Additions To Sensarray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions"

Cymer Reduces Chipmakers’ Operating Costs With the Next Generation Gas Lifetime eXtension – iGLX™

SAN DIEGO, Nov. 28, 2011 /PRNewswire/ — Cymer, Inc. (Nasdaq: CYMI), the world’s leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its third-generation Gas Lifetime eXtension (iGLX™) control system for Argon Fluoride (ArF) immersion light sources. An exclusive offering for chipmakers with OnPulse®, the value-added feature is an improvement over previous generations of gas management … Read More → "Cymer Reduces Chipmakers’ Operating Costs With the Next Generation Gas Lifetime eXtension – iGLX™"

Thinfilm and Polyera Partner to Bring Printed CMOS Memory to Market

OSLO, November 30 – Thin Film Electronics ASA (“Thinfilm”) today announced a partnership with Polyera – a developer and supplier of high-performance functional materials for the flexible and printed electronics industry. Thinfilm and Polyera will jointly develop organic semiconductor materials for high-volume printing of Thinfilm Addressable MemoryTM and printed integrated systems. The collaboration brings printed integrated systems, such as smart sensor tags, closer to commercial availability.

Thinfilm … Read More → "Thinfilm and Polyera Partner to Bring Printed CMOS Memory to Market"

Magma’s Latest Version of FineSim Pro Delivers 3X Faster Runtime, Allowing SPICE-Accurate Simulation of Very Large Analog/Mixed-Signal Designs

SAN JOSE, Calif., Nov. 30, 2011 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced the availability of a new version of the FineSim™ Pro full-chip circuit-level simulation product that delivers 3X faster runtime than previous versions while continuing to deliver SPICE-accurate results. As an example, FineSim Pro was able to simulate a large post-layout design containing more than 75K MOS devices and more than 2.9 million parasitic resistors and capacitors in a little over an hour. With this latest version, chip designers can better address the growing complexity of verification and increasing … Read More → "Magma’s Latest Version of FineSim Pro Delivers 3X Faster Runtime, Allowing SPICE-Accurate Simulation of Very Large Analog/Mixed-Signal Designs"

LPRS launch the IQRF Wireless Design challenge – Total prize money of $10,000 across all categories

LPRS, Europe’s leading supplier of short-range radio devices, announces the launch of the IQRF wireless design challenge. Running from 1st December 2011 to 31st March 2012 the challenge is open to all RF designers to create a new and innovative wireless communication or control solution based on the simple to use IQFR wireless mesh components with a total of $10,000 to be awarded to winning designs across all categories.

Registration is open to anyone who designs an application based on the IQRF platform. To register for the competition visit Read More → "LPRS launch the IQRF Wireless Design challenge – Total prize money of $10,000 across all categories"

Renesas Electronics Introduces Compact Lithium-ion Battery Charging Control IC Supporting USB Charging

Dusseldorf, November 30, 2011 –  Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced a charging control integrated circuit (IC), the R2A20055NS, that achieves further miniaturization and safe charging control for single-cell lithium-ion batteries used in portable devices.

Lithium-ion batteries are used in a wide range of portable equipment, from cell phones to digital still cameras, media players, personal navigation devices and tablet PCs. Lithium-ion batteries have a high energy density and can contribute to equipment miniaturization. At the same time, however, they … Read More → "Renesas Electronics Introduces Compact Lithium-ion Battery Charging Control IC Supporting USB Charging"

Amplicon launch new division – Engineering Services

Brighton, UK, 30th November 2011 – Amplicon has announced the introduction of a new division, Engineering Services. This new venture, as well as creating new employment opportunities, is to provide the market place with a trusted partner who can be viewed as an extension of the customers own team creating value that can be delivered straight to the bottom line.

Whilst Amplicon is already renowned for supplying high quality complex systems, the new Amplicon Engineering Services division combines the best engineering practice over a range of disciplines such as mechanical, electrical and electronic engineering … Read More → "Amplicon launch new division – Engineering Services"

SpringSoft Targets Chip Finishing Applications With New Laker Blitz

HSINCHU, Taiwan, November 29, 2011 – SpringSoft, Inc., a global supplier of specialized IC design software, today announced immediate availability of the Laker Blitz chip-level layout editor, a new software product targeting chip finishing applications and the latest addition to its popular family of Laker custom IC design and layout automation solutions. The Laker Blitz product enables high-speed viewing and editing of chip-level layouts to streamline tapeout-to-manufacturing operations. It is ideally suited for designs with massive data sets, such as advanced-node system-on-chip (SoC) implementations and large memory chips that are widely used in consumer& … Read More → "SpringSoft Targets Chip Finishing Applications With New Laker Blitz"

Movea’s GestureBuilder advances State of the Art for Gesture Control in Consumer Electronics

Grenoble, France – November 30, 2011 – Movea, the leader in motion sensing and motion-enabled control technologies, announced today that it is making State of the Art gesture recognition and gesture database design capabilities available to Consumer Electronic OEMs and Systems Integrators though its ground breaking GestureBuilder software.  Part of Movea’s SmartMotion® portfolio and a component of the MoveTV platform, GestureBuilder enables Touchless Gestures™ for control of Smartphones, Tablets, TV’s, Set-Top-Boxes, and Media Center PC’s running Linux, Android, and Windows 7.  Windows 8 support is also planned.

Read More → "Movea’s GestureBuilder advances State of the Art for Gesture Control in Consumer Electronics"

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