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Renesas Electronics Announces New RL78 Microcontrollers (MCUs) with Enhanced Analog Functionality

November 16, 2011

Dusseldorf, November 16, 2011 –  Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced the expansion of the RL78 Family with the introduction of the new RL78/G1A Group of microcontrollers (MCUs). The RL78/G1A 16-bit MCUs integrate enhanced analog technology with industry-leading power-efficient technology of the RL78 Family to deliver excellent processing performance.  The RL78/G1A Group of MCUs are ideal for a number of applications including industrial automation sensors, white goods, home automation and medical applications. Renesas has equipped the … Read More → "Renesas Electronics Announces New RL78 Microcontrollers (MCUs) with Enhanced Analog Functionality"

Latest Synopsys FPGA-Based Prototyping Tool Releases Improve Speed and Turnaround Time

November 16, 2011

MOUNTAIN VIEW, Calif., Nov. 16, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, today announced updates to its Identify® and Certify® FPGA-based prototyping tools. Algorithm advancements in the latest Certify software release produce up to 30 percent faster FPGA-to-FPGA transmission performance using High-Speed Time Domain Multiplexing (HSTDM), which results in higher … Read More → "Latest Synopsys FPGA-Based Prototyping Tool Releases Improve Speed and Turnaround Time"

SCC1300 Combined Sensor Improves Positioning Accuracy in Map-Matching Applications

November 16, 2011

According to research carried out by Tampere University of Technology in Finland, it is possible to improve the positioning accuracy and reliability of navigation systems by using digital road maps in addition to the main navigation system. For maximum reliability, a high performance gyroscope is needed. In this case, the combined sensor SCC1300 designed by VTI Technologies was used to improve the positioning results. 

The numerical probabilistic map-matching algorithm was developed and demonstrated by a group of researchers at the Department of Computer Systems of Tampere University of Technology (Finland), already well known and … Read More → "SCC1300 Combined Sensor Improves Positioning Accuracy in Map-Matching Applications"

CEVA-TeakLite-III DSP Offers First IP Core Approved for Dolby MS11 Multistream Decoder

November 16, 2011

MOUNTAIN VIEW, Calif. – November 15, 2011 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that the CEVA-TeakLite-III DSP has become the industry’s first IP core approved by Dolby for the MS11 Multistream Decoder – the latest Dolby® audio technology for enabling multi-format world-wide broadcast in home entertainment products. The fully-optimized implementation of the sophisticated MS11 decoder represents a significant milestone for CEVA, and extends the company’s leadership in developing and implementing high-performance HD audio platforms for next-generation connected, home entertainment SoC designs. … Read More → "CEVA-TeakLite-III DSP Offers First IP Core Approved for Dolby MS11 Multistream Decoder"

LSI Begins Shipping 28nm Custom Silicon for Datacenter and Mobile Network Applications

November 16, 2011

ACCELERATING INNOVATION SUMMIT, MILPITAS, Calif., November 16, 2011 – LSI Corporation (NYSE: LSI) today announced that the company is now shipping 28nm custom silicon solutions for next-generation datacenter, cloud and mobile networking applications. The design platform combines a broad portfolio of silicon-proven IP with an advanced design methodology, enabling OEMs to create highly differentiated solutions for critical infrastructure such as servers, storage systems, routers, switches and mobile base stations.

The explosion of data traffic and the increase in connected devices such as smartphones, tablets and ultrabooks is driving the need for high-port count, high-bandwidth intelligent systems. OEMs require custom … Read More → "LSI Begins Shipping 28nm Custom Silicon for Datacenter and Mobile Network Applications"

Elliptic Technologies To Showcase Security Solutions At The Embedded Technology 2011 Conference In Yokohama, Japan

November 15, 2011

November 14, 2011 – OTTAWA, CANADA: Elliptic Technologies, a leading supplier of mobile and network security IP and solutions, today announced that it will exhibit at the Embedded Technology 2011 Conference to be held on November 16-18 at the PACIFICO YOKOHAM in Yokohama, Japan. Elliptic will demonstrate its latest DRM and Content Protection technology including DTCP-IP running on an Android platform at Booth # D-41.

Digital media is being rapidly adopted as the primary consumer electronic distribution medium.  The technical demands of the digital home and the need to deliver and protect rich video and audio content have increased … Read More → "Elliptic Technologies To Showcase Security Solutions At The Embedded Technology 2011 Conference In Yokohama, Japan"

LSI and Fujitsu Collaborate on New High-Performance SPARC64 IXfx Processor for Highly Scalable Technical Computing

November 15, 2011

ACCELERATING INNOVATION SUMMIT, MILPITAS, Calif., November 15, 2011 – LSI Corporation (NYSE: LSI) today announced that the company collaborated with Fujitsu to design the new multi-core SPARC64TM IXfx processor for highly scalable supercomputing applications. The new SPARC64 IXfx processor, which features a significant performance boost over the previous generation, couples Fujitsu’s multi-generational expertise in high-performance computing and LSI’s industry-leading custom silicon capability, featuring a proven technology platform, broad IP portfolio and automated design flow.

Fujitsu’s longstanding solutions for the high-performance computing market provide customers with an ideal platform to handle supercomputing … Read More → "LSI and Fujitsu Collaborate on New High-Performance SPARC64 IXfx Processor for Highly Scalable Technical Computing"

ZMDI Introduces 4 New Products for Signal Conditioning of Piezo-Resistive Bridge Sensors in Automotive and Industrial Applications

November 15, 2011

Dresden, Germany, November 15, 2011 – ZMD AG (ZMDI), a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, and medical applications, today introduced four smart sensor signal conditioner ICs. ZMDI designed the ZSSC3131, ZSSC3135, ZSSC3136 and ZSSC3138 for the signal conditioning of resistive bridge sensing elements, like silicon or ceramic-based piezo-resistive transducers or thin-/thick-film or gauge-type sensor elements. The devices are ideal for automotive and industrial pressure sensing applications such as HVAC, cooling, pneumatic brakes and other hydraulic systems.

“Sensor system designers can select among four pin-compatible products to obtain the best fit … Read More → "ZMDI Introduces 4 New Products for Signal Conditioning of Piezo-Resistive Bridge Sensors in Automotive and Industrial Applications"

SVTC Technologies and SUSS MicroTec Partnership

November 15, 2011

SVTC Technologies, the premier innovation partner for accelerating nanotechnology development and commercialization, announced today it is partnering with SUSS MicroTec, a leading equipment supplier for MEMS and advanced 3D IC integration. This collaboration is targeted at supporting wafer-level processing for MEMS and 3D IC integration with focus on the newest bonding applications needed for next-generation electronics.  The partnership with SUSS MicroTec continues an ongoing SVTC strategy to provide an ecosystem of partners all geared towards providing comprehensive value-added solutions to customers.

“As a leading research and development company, the partnership with SVTC provides complementary expertise … Read More → "SVTC Technologies and SUSS MicroTec Partnership"

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