News – Page 2104 – EEJournal

Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs

January 17, 2012

SAN JOSE, CA–(Marketwire – January 17, 2012) – “With the march toward greater design complexity showing no sign of abating, comprehensive verification is essential for a company to achieve its profitability goals,” said Hao Fang, IP design manager at LSI. “‘Advanced Verification Topics’ will be an important reference book for teams responsible for verifying complex mixed-signal IP and SoCs that utilize low-power, verification IP (VIP), transaction-level models (TLM), acceleration, and similar techniques to reduce risk while getting end products into working silicon faster.”Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs"

MoSys, Inc. Earns ISO 9001:2008 Certification

January 17, 2012

SANTA CLARA, Calif., January 17, 2011 – MoSys (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, today announced that it has earned ISO 9001:2008 certification from TUV America.

The ISO 9000 series standards are internationally recognized quality management system requirements developed by the International Organization for Standardization (ISO). ISO 9001, the most comprehensive standard in the ISO 9000 series, covers design, development … Read More → "MoSys, Inc. Earns ISO 9001:2008 Certification"

Synchronous Step-Down DC/DC Controller Delivers Up to 95% Efficiency with 2MHz Operating Frequency

January 17, 2012

MILPITAS, CA – January 17, 2012 – Linear Technology Corporation introduces the LTC3839, a high frequency controlled on-time single output dual phase synchronous step-down DC/DC controller that can achieve up to 95% efficiency with a 25A output when operating at 2MHz. The operating frequency is selectable from 200kHz to 2MHz or can be synchronized to an external clock. … Read More → "Synchronous Step-Down DC/DC Controller Delivers Up to 95% Efficiency with 2MHz Operating Frequency"

Avnet Tech Games Registration Opens for Spring Virtual Competition and Onsite Games

January 17, 2012

PHOENIX—January 17, 2012 — Avnet, Inc. (NYSE:AVT), a leading global technology distributor, has announced that registration is now open for college students across the nation to compete in both the Arizona Onsite and Spring Virtual Read More → "Avnet Tech Games Registration Opens for Spring Virtual Competition and Onsite Games"

Baolab announces evaluation kits for its award winning NanoEMS MEMS – available to customers

January 16, 2012

Barcelona, Spain – 16 January 2012. Baolab Microsystems has announced that it will have evaluation kits of its recently announced 3D NanoCompass™ available at the end of February 2012. This electronic 3-axis CMOS MEMS NanoCompass technology uses Baolab’s patented, award winning NanoEMS™ technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer.

“We are now producing NanoEMS sensors in volume in a standard CMOS production line.” said Dave Doyle, Baolab’s CEO. “The move from lab to fab is a significant milestone for the company, proving that … Read More → "Baolab announces evaluation kits for its award winning NanoEMS MEMS – available to customers"

Kistler Introduces Miniature PiezoBeam® TEDS Accelerometers for Multi-Channel Modal Testing

January 16, 2012

January 15, 2012, Novi, Michigan, USA – Kistler North America (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced a new family of single axis and triaxial lightweight, miniature PiezoBeam® IEPE accelerometers with optional TEDS, designed for the multi-channel modal and structural analysis of small or thin-walled structures, components and subsystems, as well as full vehicle testing within automotive, aerospace, commercial aviation and general laboratory testing environments.

The single axis Kistler Type 8640A … Read More → "Kistler Introduces Miniature PiezoBeam® TEDS Accelerometers for Multi-Channel Modal Testing"

Microchip’s USB to SPI Protocol Converter Provides the Simplest, Smallest and Most Cost-Effective Way to Add USB to Existing Designs

January 16, 2012

CHANDLER, Ariz., Jan. 16, 2012 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced the HID-class MCP2210 USB to SPI protocol converter—the simplest, smallest-footprint and most cost-effective option for adding USB-Certified connectivity to SPI-based systems. Microchip also provides free downloads of supporting software drivers, DLLs and a PC configuration tool, in addition to an evaluation board, to make it fast and simple for … Read More → "Microchip’s USB to SPI Protocol Converter Provides the Simplest, Smallest and Most Cost-Effective Way to Add USB to Existing Designs"

Digi-Key Corporation Signs Global Distribution Agreement with Dynastream Innovations, Inc.

January 16, 2012

Monday, January 16, 2012 – THIEF RIVER FALLS, Minn., USA, and Cochrane, Alberta, Canada– Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Signs Global Distribution Agreement with Dynastream Innovations, Inc."

2E mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring

January 16, 2012

Florence, Ky., Sulzbach, Germany, Shanghai, PR China, Jan. 12, 2012 – 2E mechatronic GmbH & Co. KG of Germany has designed a 3-D molded interconnect device (MID) flow sensor for air conditioning systems that uses Vectra^® E840i LDS, a liquid crystal polymer (LCP) specially developed by Ticona for electronic circuits on 3-D injection moldings produced with a Laser Direct Structuring (LDS) process.

Ticona will showcase its Vectra LCP specialty grades for electrical and electronic components at Ticona Booth #218 as part of its DesignCon 2012 exhibit of engineering polymers and halogen-free solutions for Green … Read More → "2E mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring"

CAST Shipping New CAN Bus Controller IP Core

January 16, 2012

Woodcliff Lake, NJ, January 16, 2012 — A new core from semiconductor intellectual property (IP) provider CAST, Inc. adds new capabilities to the company’s long-time support for the Controller Area Network (CAN) Bus Protocol.

Sourced from partner Fraunhofer IPMS and available now, the CAN-CTRL CAN Bus Controller IP Core conforms to the latest, 2.0B CAN Bus Protocol and ISO ISO 11898-1 Data Link Layer specifications. … Read More → "CAST Shipping New CAN Bus Controller IP Core"