congatec’s smart cooling pipes pave the way for unlimited performance growth for COM Express modules
Nuremberg, Embedded World, 28 February 2012 * * * congatec AG, a leading manufacturer of embedded computer modules, announces a new cooling system based on cooling pipes which are integrated in the standardized heatspreader of the COM Express specification. With this solution it becomes possible to cool next generation high-performance processors with a power dissipation of well over 35W TDP.
“The real problem lies with hot spots around the processor and chipset,” states congatec product manager Martin Danzer. “Our improved cooling concept results in a lower processor temperature, which is essential for a more frequent activation of Turbo Boost 2 … Read More → "congatec’s smart cooling pipes pave the way for unlimited performance growth for COM Express modules"

