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European project reaches milestone bidirectional communication for thin-film RFIDs, enabling item-level RFID tags

San Francisco, Calif., – February 22, 2012 – Imec, Holst Centre and their partners in the EU FP7 project ORICLA have fabricated the world’s first RFID (radio frequency identification) circuit made in low-temperature thin-film technology that allows reader-talks-first communication. The technology behind this prototype is indispensable to create RFID tags that are cheap enough and have enough performance to be used as intelligent item-level tags on the packaging of retail consumer goods. Such tags can be used to provide buyers with information on e.g. price, characteristics, or freshness, or to allow vendors to implement automated billing and … Read More → "European project reaches milestone bidirectional communication for thin-film RFIDs, enabling item-level RFID tags"

6WIND and BroadWeb Announce Integrated Software Solution for Intrusion Prevention Systems

PARIS, France and HSINCHU, Taiwan, February 24, 2012 — 6WIND, the gold standard for software-defined networks and BroadWeb, a market leader in network content security technology, today announced a partnership to provide pre-integrated software solutions for Intrusion Prevention Systems (IPS), accelerating OEMs’ time-to-market while delivering industry-leading performance. 6WIND and BroadWeb will feature these solutions at the RSA Conference in San Francisco from February 27th through March 2nd (6WIND: booth 242, BroadWeb: booth 2133).

The proliferation of network applications such as gaming and peer-to-peer file sharing has created business-critical challenges for network administrators and service providers. Networks must be constantly … Read More → "6WIND and BroadWeb Announce Integrated Software Solution for Intrusion Prevention Systems"

High-end hybrid-cooled embedded system, also for environments subject to dust

Munich, February 2012 – DSM Computer presents at the embedded world in Hall 1, Booth 254, the first member of its new ARCTIS™ IPC family the A1-QM67 which, despite its extremely high computing and graphic power, is designed for operation in dusty environments. This is achieved with an innovative hybrid cooling concept that avoids the need for air exchange from the exterior to the interior of the device. 

To ensure the optimum cooling of the system, two heat pipes conduct the heat generated by the CPU with integrated graphic directly to two large heat sinks … Read More → "High-end hybrid-cooled embedded system, also for environments subject to dust"

VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

Taipei, Taiwan–February 24, 2012 -VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announcedthe latest VIA COMe-8X90 module, featuring a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage. 

Measuring 95mm x 125mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate … Read More → "VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90"

Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers

Leuven, Belgium and Tokyo, Japan, February 22, 2012 – At this week’s International Solid-State Circuit Conference (ISSCC2012), imec and Renesas Electronics Corporation (TSE: 6723) report an innovative SAR (successive-approximation register) ADC (analog to digital converter) with a spectacular improvement in power efficiency and speed, targeting wireless receivers for next-generation high-bandwidth standards such as LTE-advanced and the emerging generation of Wi-Fi (IEEE802.11ac).

SAR ADCs provide high power efficiencies as well as a small form factor, making this architecture attractive for a wide variety of wireless applications. SAR ADCs are frequently the preferred architecture for applications … Read More → "Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers"

Synopsys Completes Acquisition of Magma Design Automation

MOUNTAIN VIEW, Calif., Feb. 22, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, has completed its acquisition of Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software headquartered in San Jose, California. The combination of Synopsys and Magma will enable the company to more rapidly meet the needs of leading-edge semiconductor designers for ever more sophisticated design tools.

The value of the transaction is approximately $523 million net of cash acquired, or $7.35 per Magma share in cash, which … Read More → "Synopsys Completes Acquisition of Magma Design Automation"

TI establishes new benchmark for evaluating high-speed data converters with industry’s highest-performance, lowest-cost evaluation boards

DALLAS (Feb. 23, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s highest-performance and lowest-cost evaluation boards for evaluating high-speed data converters. The TSW1400EVM data capture and pattern generation board evaluates up to 16-bit analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). It costs 75-percent less than the previous generation, while providing twice the memory. Additionally, the TSW1405EVM for pattern capture and the TSW1406EVM for pattern generation are the lowest-cost solutions of their kind by up to 80 percent, providing simple and ultra-low cost platforms for quick evaluation of TI data converters. For … Read More → "TI establishes new benchmark for evaluating high-speed data converters with industry’s highest-performance, lowest-cost evaluation boards"

Saelig Introduces Tiny DIP Oscilloscope Module

Pittsford, NY, USA: Saelig Company, Inc. (www.saelig.com) has introduced Xminilab – an amazingly sophisticated miniature combination of three electronic instruments: a mixed signal oscilloscope, an arbitrary waveform generator, and a protocol sniffer. Measuring only 3.3″ x 1.75″, it can be mounted directly on a breadboard or pcb for in situ testing and verification. A graphic 2.4″ 128×64 pixel OLED display is mounted on the … Read More → "Saelig Introduces Tiny DIP Oscilloscope Module"

Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products

San Jose, California – February 22, 2012- Arasan Chip Systems, Inc. (“Arasan”),a leading provider of Total Semiconductor IP Solutions, announced today that it is experiencing rapid growth in its MIPI IP product line.   “Our MIPI product line experienced 3x growth in 2 years”, stated, Andrew Haines VP of marketing. “We see a more diverse mix of customers buying a broader selection of MIPI interfaces including CSI-2, DSI, D-PHY, M-PHY SLIMbus and RFFE.”    

The momentum in the MIPI IP market … Read More → "Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products"

Agilent Technologies Announces GS-8800 LTE Conformance Platform; Meets Test Platform Approval Criteria on Band 13

SANTA CLARA, Calif., Feb. 22, 2012 – Agilent Technologies Inc. (NYSE: A) today announced that its U1901A GS-8800 LTE conformance test platform, registered with the Global Certification Forum, has met the Test Platform Approval Criteria (TPAC) for Band 13. In addition, the GS-8800 design verification system now has the ability to do TDD LTE RF measurements.

TPAC certification means the Agilent GS-8800 LTE conformance test platform … Read More → "Agilent Technologies Announces GS-8800 LTE Conformance Platform; Meets Test Platform Approval Criteria on Band 13"

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