News – Page 2077 – EEJournal

MAZeT appears at the academix in Erfurt

January 5, 2012

Jena (Germany), January 5, 2012 – along with more than 80 other exhibitors, MAZeT GmbH participated in the “academix Thüringen” (www.academix-thueringen.de), which took place for the first time in Erfurt’s exhibition centre on December 14, 2011. The academix is Thuringia’s first state-wide careers fair for students, graduates and young professionals and was promoted throughout Germany. At MAZeT, various offers were showcased for traineeships, MA theses and permanent employment. The academix was organised and given its thematic direction by the Thuringian Agency for Specialist Recruitment (Thüringer … Read More → "MAZeT appears at the academix in Erfurt"

High-performance thin film boost for electronics research

January 5, 2012

[Tsukuba, 4 January 2012] The announcement of this breakthrough comes from a research group led by MANA Scientist Dr. Minoru Osada and Principal Investigator Dr. Takayoshi Sasaki of the International Center for Materials Nanoarchitectonics (MANA) at the National Institute for Material Science (NIMS) in Japan.

Good insulating, high-k nanofilms are expected to be key to future applications as predicted by the International Technology Roadmap for Semiconductors (ITRS).

Minoru Osada and colleagues created thin films based on titanium-niobate nanosheets (TiNbO₅, Ti₂NbO₇, Ti₅NbO< … Read More → "High-performance thin film boost for electronics research"

Combining of two Successful Modular Standards

January 4, 2012

Northwich, Cheshire, 3^rd January 2012 – Kane Computing Ltd (KCL) today reported the availability of a new prototyping platform that enables developers to combine D.Module DSP and FPGA boards with Ansi Vita S7 compliant FMC modules.

The D2-Base-FMC from D.SignT is a prototyping and evaluation platform for the D.Module2 family of DSP and FPGA boards. An Ansi Vita 57 compliant FMC LPC IO site allows it to be used with industry-standard mezzanine boards (A/D and D/A data acquisition, Video and Camera interfaces, Digital Radio frontends etc.).

EnSilica announces new design centre in India focusing on verification

January 4, 2012

Wokingham, UK – 4^th January 2012. EnSilica, a leading independent provider of IC design services and system solutions, has opened a new design centre in India (Bangalore), to complement its existing design facilities in the UK. The new design centre will be a centre of excellence for the advanced verification of complex semiconductor products and IP. Verification services will be provided for both European and local customers based on a range of methodologies but with a particular focus on UVM (the Unified Verification Methodology) and SystemVerilog.

Invensense® Showcases The Latest Motion Interface Innovations and Solutions At CES 2012

January 4, 2012

SUNNYVALE, California, January 3, 2012 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking^™ devices for consumer electronics, will showcase the company’s latest motion interface innovations for smartphones, tablets, game controllers, smart TVs, and wearable sensors at the CES 2012 tradeshow. InvenSense will also demonstrate the IDG-2020/IXZ-2020 family of gyroscopes which has been … Read More → "Invensense® Showcases The Latest Motion Interface Innovations and Solutions At CES 2012"

DiSTI’s Replic8™ is Now Available for Download

January 4, 2012

Orlando, FL (January 4, 2012) – The DiSTI Corporation, a leading provider of advanced graphical interface technology, announces the availability of trial downloads for Replic8. As a groundbreaking new software tool, Replic8 allows users to easily produce compelling 3D interactive training content from Autodesk’s 3D Studio Max files in less time than it takes to make a video. Replic8 based training will revolutionize the way people learn by enabling highly effective training applications that increase student involvement, retention, throughput and safety.

Replic8 works directly with 3D Studio Max, forming a cohesive transition of static 3D models into … Read More → "DiSTI’s Replic8™ is Now Available for Download"

CEVA Announces Availability of CEVA-MM3101, a Programmable, Low Power Imaging and Vision Platform for Camera-Enabled Devices

January 4, 2012

MOUNTAIN VIEW, Calif. – January 04, 2012 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores today announced the availability of the first imaging and vision platform based on its CEVA-MM3000™ architecture framework. CEVA-MM3101™ is a fully programmable, low power platform developed to meet the advanced image and vision processing use-cases in camera-enabled devices, including smartphones, tablets and smart TVs.

The CEVA-MM3101 … Read More → "CEVA Announces Availability of CEVA-MM3101, a Programmable, Low Power Imaging and Vision Platform for Camera-Enabled Devices"

Linear Technology Acquisition of Dust Networks Extends Wireless Sensor Networking Capabilities

January 4, 2012

MILPITAS, CA – December 20, 2011 – Linear Technology Corporation (NASDAQ: LLTC), a leader in high performance analog integrated circuits, today announced the acquisition of Dust Networks, Inc., a leading provider of low power wireless sensor network (WSN) technology. The acquisition of Dust Networks, based in Hayward, CA, will enable Linear to offer a complete high performance wireless sensor networking solution. Dust Networks’ low power radio and software technology complements Linear’s strengths in industrial instrumentation, power management and energy harvesting technology.

Dust Networks’ proven, low power wireless sensor network technology extends Linear’s product … Read More → "Linear Technology Acquisition of Dust Networks Extends Wireless Sensor Networking Capabilities"

Cavium to Collaborate With Intel on Providing Best-in-Class Wireless Display Consumer Experience

January 4, 2012

SAN JOSE, CA–(Marketwire – January 04, 2012) – “Intel® WiDi-based laptops have enjoyed a very rapid adoption in the market during the past two years, expected to pass the 20Mu mark by the end of 2011,” said Kerry Forell, Product Manager at Intel Corporation. “Through this collaboration with Cavium, we expect our customers to be able to offer products with a broader range of wireless display capabilities, which in turn should translate to more choices and enhanced experience for consumers.”Cavium, Inc. (NASDAQ: CAVM), a leading … Read More → "Cavium to Collaborate With Intel on Providing Best-in-Class Wireless Display Consumer Experience"

RFSA3013 and RFSA3023 CATV Voltage-Controlled Attenuators

January 4, 2012

RFMD’s new RFSA3013 and RFSA3023 are fully monolithic analog voltage-controlled attenuators (VCAs) featuring exceptional linearity over a 30dB minimum gain control range. These VCAs also feature internal temperature compensation that provides an attenuation profile highly insensitive to temperature changes. Each VCA is controlled by a single positive control voltage with on-chip DC conditioning circuitry. The slope of the control voltage versus gain is selectable. These VCAs have been characterized for 75Ω CATV applications over the full attenuation and frequency ranges with no external matching components required. The components are offered in a compact 3mm x 3mm QFN … Read More → "RFSA3013 and RFSA3023 CATV Voltage-Controlled Attenuators"