News – Page 2073 – EEJournal

Baolab announces evaluation kits for its award winning NanoEMS MEMS – available to customers

January 16, 2012

Barcelona, Spain – 16 January 2012. Baolab Microsystems has announced that it will have evaluation kits of its recently announced 3D NanoCompass™ available at the end of February 2012. This electronic 3-axis CMOS MEMS NanoCompass technology uses Baolab’s patented, award winning NanoEMS™ technology to create nanoscale MEMS (Micro Electro Mechanical Systems) within the standard metal structure of a high volume manufactured CMOS wafer.

“We are now producing NanoEMS sensors in volume in a standard CMOS production line.” said Dave Doyle, Baolab’s CEO. “The move from lab to fab is a significant milestone for the company, proving that … Read More → "Baolab announces evaluation kits for its award winning NanoEMS MEMS – available to customers"

Kistler Introduces Miniature PiezoBeam® TEDS Accelerometers for Multi-Channel Modal Testing

January 16, 2012

January 15, 2012, Novi, Michigan, USA – Kistler North America (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced a new family of single axis and triaxial lightweight, miniature PiezoBeam® IEPE accelerometers with optional TEDS, designed for the multi-channel modal and structural analysis of small or thin-walled structures, components and subsystems, as well as full vehicle testing within automotive, aerospace, commercial aviation and general laboratory testing environments.

The single axis Kistler Type 8640A … Read More → "Kistler Introduces Miniature PiezoBeam® TEDS Accelerometers for Multi-Channel Modal Testing"

Microchip’s USB to SPI Protocol Converter Provides the Simplest, Smallest and Most Cost-Effective Way to Add USB to Existing Designs

January 16, 2012

CHANDLER, Ariz., Jan. 16, 2012 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced the HID-class MCP2210 USB to SPI protocol converter—the simplest, smallest-footprint and most cost-effective option for adding USB-Certified connectivity to SPI-based systems. Microchip also provides free downloads of supporting software drivers, DLLs and a PC configuration tool, in addition to an evaluation board, to make it fast and simple for … Read More → "Microchip’s USB to SPI Protocol Converter Provides the Simplest, Smallest and Most Cost-Effective Way to Add USB to Existing Designs"

Digi-Key Corporation Signs Global Distribution Agreement with Dynastream Innovations, Inc.

January 16, 2012

Monday, January 16, 2012 – THIEF RIVER FALLS, Minn., USA, and Cochrane, Alberta, Canada– Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Signs Global Distribution Agreement with Dynastream Innovations, Inc."

2E mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring

January 16, 2012

Florence, Ky., Sulzbach, Germany, Shanghai, PR China, Jan. 12, 2012 – 2E mechatronic GmbH & Co. KG of Germany has designed a 3-D molded interconnect device (MID) flow sensor for air conditioning systems that uses Vectra^® E840i LDS, a liquid crystal polymer (LCP) specially developed by Ticona for electronic circuits on 3-D injection moldings produced with a Laser Direct Structuring (LDS) process.

Ticona will showcase its Vectra LCP specialty grades for electrical and electronic components at Ticona Booth #218 as part of its DesignCon 2012 exhibit of engineering polymers and halogen-free solutions for Green … Read More → "2E mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring"

CAST Shipping New CAN Bus Controller IP Core

January 16, 2012

Woodcliff Lake, NJ, January 16, 2012 — A new core from semiconductor intellectual property (IP) provider CAST, Inc. adds new capabilities to the company’s long-time support for the Controller Area Network (CAN) Bus Protocol.

Sourced from partner Fraunhofer IPMS and available now, the CAN-CTRL CAN Bus Controller IP Core conforms to the latest, 2.0B CAN Bus Protocol and ISO ISO 11898-1 Data Link Layer specifications. … Read More → "CAST Shipping New CAN Bus Controller IP Core"

High Voltage Surge Stopper with Current Limit Shields Sensitive Electronics from Transients Beyond 100V

January 16, 2012

MILPITAS, CA – January 16, 2012 – Linear Technology Corporation introduces the LT4363, an overvoltage protection controller that provides overvoltage and overcurrent protection to high-availability electronic systems. Supply voltages surge whenever currents flowing through long inductive power buses change abruptly. Also, automotive batteries experience a condition known as load-dump, where the voltage can stay elevated for many milliseconds. Traditional protection circuitry … Read More → "High Voltage Surge Stopper with Current Limit Shields Sensitive Electronics from Transients Beyond 100V"

NXP Demonstrates Groundbreaking Solar Street Lighting Solution at CES 2012

January 13, 2012

EINDHOVEN, THE NETHERLANDS and LAS VEGAS, NV–(Marketwire – Jan 12, 2012) – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that it has developed an innovative, sustainable and highly efficient solar-powered street lighting solution, together with Philips Lighting. The groundbreaking Solar Gen2 solution, which NXP is demonstrating this week at CES 2012 (booth CP8), could have a major impact on energy consumption in urban areas at night. By charging street lamps during daylight hours, the new solar-powered solution from Philips Lighting and NXP can supplement the capacity of the conventional … Read More → "NXP Demonstrates Groundbreaking Solar Street Lighting Solution at CES 2012"

VIA Labs USB 3.0 Active Optical Cable Solution Demonstrated at CES 2012

January 13, 2012

Taipei, Taiwan, January 13, 2012 – VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced the VIA Labs VO510 5-Gigabit Optical Transceiver which is being showcased at CES 2012. The VIA Labs V0510 Optical Transceiver is used in USB 3.0 Active Optical Cables (AOC) which enables rapid data transfers and high-definition multimedia across distances of over 100 meters. Developed in collaboration with FOCI, PCL, OpTarget and UMEC, USB 3.0 AOC solutions offer exciting new possibilities in the use of USB 3.0 technology.

“This USB 3.0 AOC was designed to be fully compliant with … Read More → "VIA Labs USB 3.0 Active Optical Cable Solution Demonstrated at CES 2012"

Young U.S. Electrotechnology Professionals Sought for Prominent International Standardization Program

January 13, 2012

New York, NY, January 13, 2012: The U.S. National Committee (USNC) to the International Electrotechnical Commission (IEC) is seeking nominations for young professionals at the start of their electrotechnology careers to participate in the Young Professionals 2012 Workshop, to be held in conjunction with the 76^th IEC General Meeting (GM) in Oslo, Norway, on October 1-5, 2012.

The Young Professionals Workshop brings together international candidates selected from IEC National Committees around the globe who are at the start of their careers in electrotechnical standardization and … Read More → "Young U.S. Electrotechnology Professionals Sought for Prominent International Standardization Program"