News – Page 2058 – EEJournal

Embedded Graphics: Imagination Technologies Supplies More GPU IP Than All Others Combined According to Latest Report from Jon Peddie Research

March 23, 2012

TIBURON, CA-March 22, 2012 -Jon Peddie Research (JPR), the industry’s research and consulting firm for graphics and multimedia, announced estimated mobile devices graphics chip shipments for 2011. Mobile devices include smartphones, tablets, cameras, vehicles, and game consoles

The market for smart mobile devices is soaring. Mobile devices are not necessarily replacing the PC, but they are outselling PCs. Increasingly mobile devices have a graphics processor and those processors are integrated in the device’s system on a chip (SoC) application processor.

The application processors are made by a dozen plus semiconductor manufacturers including Broadcom, Intel, Marvell, … Read More → "Embedded Graphics: Imagination Technologies Supplies More GPU IP Than All Others Combined According to Latest Report from Jon Peddie Research"

Extremely reliable: the new Swissbit C-400 series CompactFlashTM card

March 23, 2012

Bronschhhofen, Switzerland – March 7, 2012 – The new C-400 series CompactFlash^TM card from Swissbit offers the highest possible level of reliability that is currently available for non-volatile memory. This is achieved through well designed wear leveling, read disturb management and the BCH-ECC (Bose-Chaudhuri-Hocquenghem-Codes) unit, which can correct up to 24 bits per 1024 bytes using a tried-and-tested procedure. The S.M.A.R.T. values enable 100% transparency while reducing field problems to a minimum in combination with other monitoring methods. The “Power Fail” secure C-400 series with optimized TCO (Total Cost of Ownership) is the … Read More → "Extremely reliable: the new Swissbit C-400 series CompactFlashTM card"

element14 partners with PCB Assembly Express to provide quick-turn prototype PCB assembly for prototype and low-volume production needs

March 22, 2012

CHICAGO – March 22, 2012 – Newark’s element14, the first collaborative community and electronics store for design engineers and electronics enthusiasts, today announced a partnership with PCB Assembly Express to provide its quick design and assembly prototyping services to North American customers.

Through this partnership, design engineers can easily access PCB Assembly Express’ high-quality services through the Knode on element14,& … Read More → "element14 partners with PCB Assembly Express to provide quick-turn prototype PCB assembly for prototype and low-volume production needs"

Renesas Electronics America Announces Eclipse-Based Integrated Development Environment

March 22, 2012

Santa Clara, Calif. March 21, 2012 – Renesas Electronics America, a leading supplier of advanced semiconductor solutions, today announced an Eclipse-based integrated development environment, the Eclipse Embedded studio, also known as e²studio, designed to provide a flexible development platform for its market-leading microcontrollers (MCUs). The e²studio IDE will be demonstrated at Renesas’ booth at the DESIGN West Conference in San Jose, Calif. At the same event, Renesas’ tool partner Micrium Inc. will also hold courses on their µC/TCP-IP Ethernet stack as well as their µC/OS-III … Read More → "Renesas Electronics America Announces Eclipse-Based Integrated Development Environment"

Mouser Collaborates with Texas Instruments to Present Sensors in Design Tool Swap Event at Design West 2012

March 22, 2012

March 21, 2012 – Mouser Electronics, Inc., regarded as one of the industry’s top design engineering resource and global distributor for semiconductors and electronic components, today announces that, together with Texas Instruments, it will host the “Sensors Tool Swap Event” on Wednesday, March 28th at 4:45 pm in the Sensors in Design Theater (co-located with ESC at DESIGN West 2012 at McEnery Convention … Read More → "Mouser Collaborates with Texas Instruments to Present Sensors in Design Tool Swap Event at Design West 2012"

Lattice Semiconductor, Acal BFi Sign Distribution Agreement

March 22, 2012

HILLSBORO, OR – MARCH 22, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) and Acal BFi, a division of Acal plc (FTSE: ACL), today announced they have signed a distribution agreement. Under the terms of the agreement, Acal Technology is authorized to sell Lattice’s complete portfolio of innovative low power, low cost FPGA, PLD and programmable power management design solutions across France.

“This agreement represents a unique opportunity for Acal BFi France to provide additional design and logistic services to our customers … Read More → "Lattice Semiconductor, Acal BFi Sign Distribution Agreement"

Keithley Introduces High Voltage System SourceMeter® Instrument Optimized for High Power Semiconductor Test

March 22, 2012

Cleveland, Ohio, March 22, 2012 * * * Keithley Instruments, Inc., a world leader in advanced electrical testinstruments and systems, today introduced the Model 2657A High Power System SourceMeter^® instrument. The Model 2657A adds high voltage to the company’s Series 2600A System SourceMeter^® family of high speed, precision source measurement units. Together, these instruments allow Keithley’s customers to characterize an even broader range of … Read More → "Keithley Introduces High Voltage System SourceMeter® Instrument Optimized for High Power Semiconductor Test"

Artila Releases ARM9 DIN Rail Programmable Automation Controller

March 22, 2012

Taipei, Taiwan – March, 2012 — Artila Electronics, the leading designer and manufacturer of Linux-ready ARM9 industrial PC, is proud to announce the launch of PAC-4070, Artila’s</ … Read More → "Artila Releases ARM9 DIN Rail Programmable Automation Controller"

VIA Announces Two New System-on-Module Solutions to the Growing VIA Modular Solutions Portfolio

March 22, 2012

Taipei, Taiwan–March 22, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial … Read More → "VIA Announces Two New System-on-Module Solutions to the Growing VIA Modular Solutions Portfolio"

Get Hands-On Experience and See Zynq-7000 EPP in Action at DESIGN West ESC Silicon Valley 2012

March 22, 2012

SAN JOSE, Calif., March 22, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that ESC Silicon Valley 2012 attendees will have the opportunity to gain hands-on experience through workshops as well as see Zynq™-7000 extensible processing platforms at work. During the conference, visitors will learn how to design optimal embedded systems through activities such as design workshops targeted for software and hardware engineers alike, a presentation on how to optimize system performance through the use of coprocessor accelerators in an Open Source framework, … Read More → "Get Hands-On Experience and See Zynq-7000 EPP in Action at DESIGN West ESC Silicon Valley 2012"