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Tensilica and VWorks Partner to Provide Virtual Prototyping Platforms

May 8, 2012

SAN DIEGO, Calif.  – May 8, 2012 – Tensilica®, the leader in dataplane processor IP cores, and VWorks, leader in virtual prototyping and system simulation, today announced a partnership to provide virtual platforms based on Tensilica’s Xtensa® dataplane processors (DPUs), dramatically reducing customers’ embedded software development time. 

As part of the collaboration, Tensilica’s DPU models are integrated with the VLAB™ virtual platform simulation environment from VWorks, providing early access, high performance and direct software debug capability. Software and services are provided by VWorks and its service partner ASTC.

“We see virtual platforms as increasingly important … Read More → "Tensilica and VWorks Partner to Provide Virtual Prototyping Platforms"

Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide

May 8, 2012

SAN JOSE, CA — (Marketwire – May 08, 2012) – “We continue to expand our use of the Cadence Chip Planning System at Fujitsu Semiconductor for one key reason — it helps us build better chips faster,” said Mutsuaki Kai, vice president of Environmental Technology Development and Products Engineering Division, Fujitsu Semiconductor Limited. “The latest enhancements to the technology have increased its value to us, and the combination of the technology and the support from Cadence has made this chip planning system a significant factor in our efforts to stay ahead of our competitors.”Cadence Design Systems, Inc. (NASDAQ: Read More → "Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide"

Simplified Design and Lower Total Cost of Ownership Highlight Xilinx 7 Series FPGAs at Interop 2012

May 7, 2012

SAN JOSE, Calif., May 7, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at the Interop IT Expo and Conference in Las Vegas, from May 8-10, at the Mandalay Bay Convention Center, Booth #2158. At the conference, attendees will see the Virtex®-7 X690T FPGA , the first chip in the Xilinx® 7 series FPGA family highlighting advanced high-performance networking applications that require low power and a highly integrated, single-chip implementation. Xilinx experts will also show 40 Gbps transfer over a PCI Express® Gen 3 x8 link that … Read More → "Simplified Design and Lower Total Cost of Ownership Highlight Xilinx 7 Series FPGAs at Interop 2012"

Cymbet Teams with Micross to Supply New Embedded Energy Solutions

May 7, 2012

Minneapolis, May 7, 2012 – Cymbet Corporation announced today that they are teaming with Micross Components to distribute and package Cymbet’s entire family of EnerChip™ Smart Solid State Batteries and ultra low power management IC solutions in bare die form.  Cymbet’s EnerChips are constructed on silicon wafers using semiconductor processing techniques which make them perfect for co-packaging with other Integrated Circuits carried on the Micross line card.   Energy storage can now be embedded directly into a single miniature multi-chip package. Embedded energy opens up new innovative product capabilities that previously could not be realized with legacy energy storage devices.</ … Read More → "Cymbet Teams with Micross to Supply New Embedded Energy Solutions"

CEA-Leti and III-V lab reports significant results after one year of collaborative research programme

May 7, 2012

GRENOBLE, France –May 7, 2012 – CEA-Leti and III-V lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA Leti, today reports successful results after the first year of their collaborative research programme. The enlarged partnership in the III-V lab is developing researches for applications in telecoms, industrial control, environmental testing, defence, security. The new public-private partnership combines the advantages of III-V semiconductor and silicon technologies to open up new research perspectives and applications.

In an effort to bring the performance benefits of III-V components on to silicon CMOS platforms, the partnership leverages the different … Read More → "CEA-Leti and III-V lab reports significant results after one year of collaborative research programme"

Micron Announces Its First Fully Functional DDR4 DRAM Module

May 7, 2012

BOISE, Idaho, 2012-05-07 14:00 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), one of the world’s leading providers of advanced semiconductor solutions, today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.

It is expected that the enterprise and micro-server markets will take full advantage of the new features and specifications designed into DDR4, accelerating early adoption of the technology. In addition, the fast-growing ultrathin client and tablet markets will also benefit from new opportunities enabled … Read More → "Micron Announces Its First Fully Functional DDR4 DRAM Module"

Jasper Design Automation Releases JasperGold® Apps to Solve Tough Challenges and Improve Productivity Throughout the Design and Verification Flow

May 7, 2012

May 07, 2012 – MOUNTAIN VIEW, CA – Jasper Design Automation, the leading provider of verification solutions based on formal technology, has announced the availability of its JasperGold® Apps products. JasperGold Apps help customers achieve substantial productivity gains in design and verification through individual Apps within a shared interactive environment that fit into existing verification flows.  The JasperGold Apps helps solve engineers’ toughest problems, addressing an array of design and verification functionality issues throughout the flow, such as:

eSOL’s eCROS Platform with eT-Kernel Multi-Core Edition RTOS to Support Xilinx Zynq-7000 EPP

May 7, 2012

Tokyo, Japan. May 7, 2012 — eSOL, a leading developer of real-time embedded software solutions, announced today that its eCROS real-time OS-based integrated software platform now supports the Xilinx(R) Zynq(TM)-7000 Extensible Processing Platform (EPP). eCROS for Zynq-7000 EPP consists of the eT-Kernel Multi-Core Edition real-time OS, tightly integrated eBinder development tools, middleware, and professional services. Zynq-7000 EPP, which combines the ARM Cortex-A9 multi-core processor and Xilinx FPGA technology, provides high performance and scalability.

eSOL will demonstrate eCROS for Zynq-7000 EPP at eSOL booth #West 6-14 at the Embedded Systems Expo May 9-11 at Tokyo … Read More → "eSOL’s eCROS Platform with eT-Kernel Multi-Core Edition RTOS to Support Xilinx Zynq-7000 EPP"

High Accuracy Temperature & Dual Voltage Monitor Provides Flexible Alert Outputs

May 7, 2012

MILPITAS, CA – May 7, 2012 – Linear Technology Corporation introduces the LTC2995 high accuracy temperature sensor and dual supply monitor for low voltage systems. The LTC2995 measures a remote diode’s temperature with ±1°C accuracy and its own die temperature with ±2°C accuracy, while rejecting errors due to noise and series resistance. Two voltage rails, one of which is required to be between 2.25V and 5.5V to power the device, are monitored … Read More → "High Accuracy Temperature & Dual Voltage Monitor Provides Flexible Alert Outputs"

Lattice Announces Revolutionary Power Management Architecture

May 7, 2012

HILLSBORO, OR – MAY 7, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced a scalable, in-system upgradable, star topology power management architecture that can be used across a wide range of circuit boards requiring more than 12 power supply rails.  Lattice has simultaneously made available two new application notes for its award winning Platform Manager™ devices that will enable customers to quickly adopt the new architecture. 

“The number of power supply rails in a circuit board has been steadily increasing,” said Shakeel Peera, Director of Strategic Marketing for Lattice Semiconductor.  “ … Read More → "Lattice Announces Revolutionary Power Management Architecture"

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