News – Page 1995 – EEJournal

New IC-output optocouplers from Renesas Electronics with extra-long creepage distance of 14.5 mm

May 16, 2012

Dusseldorf, May 16, 2012 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the availability of two IC-output optocouplers with long-creepage-distance for applications such as industrial equipment employing the maximum commercial power supply voltage of 690 V or solar power generation systems employing high voltages of up to 1,000 V. The PS9924 is a high-speed optocoupler supporting internal system communication speeds of 10 Mb/s and the PS9905 is an optically coupled 2.5 A IGBT driver featuring high speed switching performance and reduced output voltage drop due to MOSFET-MOSFET output form.

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Molex Unveils Two New Versions in its Premo-Flex™ Line of Jumpers

May 15, 2012

LISLE, IL – May 15, 2012 – Molex Incorporated announced today the addition of two new products in its Premo-Flex™ line of flat flex cable (FFC) and etched polyimide jumpers. Both products provide ultra-flexible, durable PCB connections … Read More → "Molex Unveils Two New Versions in its Premo-Flex™ Line of Jumpers"

NLT Technologies Introduces High-Resolution Multi-View 2D/3D Display with HxDP Technology for Enhanced Stereoscopic Viewing Experience

May 15, 2012

KAWASAKI, JAPAN, DUSSELDORF, Germany, May 14, 2012 — NLT Technologies (NLT), together with its sales and marketing channel in Europe, Renesas Electronics Europe GmbH, today announced the successful development of a new autostereoscopic multi-view display with HxDP (Horizontally x times-Density Pixels) technology. The low-temperature polysilicon thin-film-transistor (TFT) color liquid crystal display (LCD) 2D/3D module prototype features a wide quarter video graphics array (WQVGA) resolution that enables autostereoscopic images.

Incorporating NLT’s proprietary HxDP pixel array, the 3.1-inch (79 millimeters diagonal), six-view display prototype enables users to view … Read More → "NLT Technologies Introduces High-Resolution Multi-View 2D/3D Display with HxDP Technology for Enhanced Stereoscopic Viewing Experience"

Ubidyne’s new micro radio delivers scalable output power performance for small and macro cell active antennas

May 15, 2012

May 15th 2012 – Ubidyne, a leading developer of dynamic digital active antenna technology for wireless communications, is showcasing its unique chip-based power amplifier solution for active antenna design at the LTE Summit later this month in Barcelona. Ubidyne’s new P-Chip is at the heart of its latest micro radio transceiver and delivers scalable output power solutions for both small-cell and macro-cell active antennas. This means that radio equipment vendors and mobile network operators can benefit from economies of scale by using the same micro radio technology for any size … Read More → "Ubidyne’s new micro radio delivers scalable output power performance for small and macro cell active antennas"

Kilopass NVM IP Cores First to Deliver Footprint and Pin Compatibility Across Eight Top-Tier Silicon Foundries for the 130/110nm Process Node

May 15, 2012

ANTA CLARA, Calif., May 15, 2012 – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that SoC designers can select any hard IP core—IP supplied as GDSII hard macro—from the entire library of Kilopass XPM (eXtra Permanent Memory) and Gusto NVM IP, drop it into a design for fabrication at any of eight top-tier foundries at the 130/110nm node. Kilopass’ NVM IP common implementation for the eight top-tier silicon foundries at the 130/110nm process node … Read More → "Kilopass NVM IP Cores First to Deliver Footprint and Pin Compatibility Across Eight Top-Tier Silicon Foundries for the 130/110nm Process Node"

EVE’s ZEMI-3 Methodology Used by Fujitsu Microelectronics Solutions to Implement Integrated Algorithm-to-Emulation Flow

May 15, 2012

SAN JOSE, CALIF. –– May 15, 2012 –– EVE, the leader in hardware/software co-verification, today announced that its ZeBu hardware-assisted verification platform and ZEMI-3 transaction-level modeling methodology have been adopted by Fujitsu Microelectronics Solutions Limited of Kanagawa< … Read More → "EVE’s ZEMI-3 Methodology Used by Fujitsu Microelectronics Solutions to Implement Integrated Algorithm-to-Emulation Flow"

QNAP Targets the High-end SMBs with Two 16-Drive Turbo NAS Models Featuring the Intel Xeon Processor and the Intel Core i3 Processors, 10GbE Networking Option, and Ultra Reliable Chassis Design

May 15, 2012

Taipei, Taiwan, May 14, 2012 – QNAP^® Systems, Inc. today announced its new additions for the high-end SMB market segment with two 16-drive 3U rackmount Turbo NAS models with up to 64TB storage capacity using 4 TB drives. The TS-EC1679U-RP and TS-1679U-RP, powered by the Intel^® Xeon^® processor and the Intel^® Core^™ i3 processor respectively, are the highest capacity and highest performing NAS products ever developed by QNAP. Both models feature optional 10GbE networking and 6Gb/sec SATA interfaces, achieving incredible 2,000 MB/sec and 200,000 IOPS throughput; delivering sustained ultra-high performance suitable … Read More → "QNAP Targets the High-end SMBs with Two 16-Drive Turbo NAS Models Featuring the Intel Xeon Processor and the Intel Core i3 Processors, 10GbE Networking Option, and Ultra Reliable Chassis Design"

Forte’s SystemC High-Level Synthesis Licensed by HighIP Design Company

May 15, 2012

SAN JOSE, CALIF. –– May 15, 2012 –– Forte Design Systems™, a leading provider of software products that enable design at a higher level of abstraction and improve design results, today announced High-IP Design Company, a SystemC intellectual property (IP) provider, has licensed Forte’s Cynthesizer™ SystemC high-level synthesis (HLS).

As part of the licensing agreement, Forte will resell a high-level, re-targetable USB 2.0 device and embedded host controller … Read More → "Forte’s SystemC High-Level Synthesis Licensed by HighIP Design Company"

Digi-Key Corporation and T-Global Technology Sign Global Distribution Agreement

May 15, 2012

Thief River Falls, Minnesota, USA and Taoyuan City, Taoyuan County, Taiwan – Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection … Read More → "Digi-Key Corporation and T-Global Technology Sign Global Distribution Agreement"

Cadence Expands System and SoC Verification Offerings to Accelerate System Integration and Reduce Time to Market

May 15, 2012

SAN JOSE, CA–(Marketwire – May 15, 2012) – “The inefficiencies and performance limitations introduced by traditionally disconnected development platforms combined with verification IP applicability being limited to simulation-only approaches are posing a threat to customers designing systems and SoCs for consumer and wireless electronics being able to deliver products on time,” said Nimish Modi, senior vice president, System and Software Realization Group at Cadence. “With the new in-circuit acceleration deliverables in the System Development Suite and the extension our Verification IP Catalog to acceleration and emulation, Cadence is taking another significant step forward towards its vision to enable open, connected and scalable … Read More → "Cadence Expands System and SoC Verification Offerings to Accelerate System Integration and Reduce Time to Market"