News – Page 1993 – EEJournal

New Power Modules Meet Increased Power and Energy Monitoring Demands

May 21, 2012

New series of Power Interface Modules deliver on promise of greater power handling
Extensive range of energy monitoring functionalities via the PMBus
New modules handle up to 20A across 36V to 75V input voltage range

Ericsson has announced an industry first with a new series of Power Interface Modules that save board space for core processing functions and enable system architects to design equipment with energy monitoring features, enabling the use of optimization algorithms to reduce overall board power consumption. The new PIM4800PI series of Power Interface Modules is … Read More → "New Power Modules Meet Increased Power and Energy Monitoring Demands"

TI introduces industry’s first SAR ADC with SPICE model

May 21, 2012

DALLAS (May 21, 2012) –Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a successive-approximation-register (SAR) analog-to-digital converter (ADC) with a downloadable TINA-TI™ SPICE model, enabling system designers to simulate and characterize the full analog signal chain in software for the first time. The model is available for the new 12-bit, 1-MSPS, 8-channel ADS8028, a highly-integrated SAR ADC featuring a low-drift internal voltage reference, wide external analog voltage reference range, wide analog and digital supply ranges, and an internal temperature sensor. For more information, visit www.ti.com/ads8028-pr.

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Tanner EDA and Aldec Deliver High-performance A/MS Solution for Mixed-signal IC Design and Verification

May 18, 2012

MONROVIA, California– May 18, 2012 –Tanner EDA, the catalyst for innovation in the design, layout and verification of analog and mixed-signal integrated circuits (ICs), and Aldec, Inc., an industry leader in mixed VHDL, Verilog and SystemVerilog simulation, have collaborated to deliver an integrated co-simulation solution for analog and mixed-signal (A/MS) design. Tanner EDA’s new HiPer Simulation A/MS offers their T-Spice analog design capture and simulation tool together with Aldec’s Riviera-PRO™ mixed language digital simulator. The solution allows both analog and digital designers to seamlessly resolve A/MS verification problems from one cohesive, integrated platform.

Cyntech seeks distributors for low-cost Raspberry Pi box

May 18, 2012

Milton Keynes, UK, May 18, 2012: Cyntech Components, a specialist supplier of electromechanical components and power supplies, has designed a compact, low-cost enclosure for the Raspberry Pi computer. The enclosure, which is available in bright pink or black, has openings for the connectors – including a recessed slot to protect audio and video connections, windows for LED indicators, non-slip rubber feet, and two slots on the back to enable the box to be … Read More → "Cyntech seeks distributors for low-cost Raspberry Pi box"

PC/104-Plus Dual Channel Gigabit Ethernet Module Connects to Embedded Networks

May 17, 2012

May 16, 2012, Arlington, TX –WinSystems, a supplier of PC/104 Single Board Computers (SBCs) and I/O modules, today announced a two channel, Gigabit Ethernet LAN module designed to offer flexible, high-performance networking connectivity for industrial embedded applications. Named the PPM-GIGE-2, it offers self-stacking I/O expansion on PC/104, EPIC, and EBX SBCs based on the industry-standard PC/104-Plus form factor. This add-in module uses standard RJ-45 connectors to plug into 10/100/1000 Mbps networks using … Read More → "PC/104-Plus Dual Channel Gigabit Ethernet Module Connects to Embedded Networks"

RFSW6131 SP3T Symmetric Switch

May 17, 2012

RFMD’s new RFSW6131 is a GaAs pHEMT Single-Pole Three-Throw (SP3T) switch designed for use in Cellular, 3G, LTE, and other high performance communications systems. It offers a symmetric topology with excellent linearity and power handling capability, while also 3V and 5V positive logic compatible.

Features

LF to 6000MHz Operation
Low Loss: 0.5dB (2GHz)
Isolation: 27dB (2GHz)
High IP3: 56dBm
P0.1dB: 31dBm (5V, 2.2GHz)
DFN, 1.5mm x 1.5mm Package

Applications

Cellular, 3G, … Read More → "RFSW6131 SP3T Symmetric Switch"

VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

May 17, 2012

Taipei, Taiwan, May 17, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.

Leveraging the digital prowess of the combined 1.0GHz VIA EdenTM X2 dual core processor and the VIA VX900H media system processor (MSP) on … Read More → "VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System"

ASSET’s two new ScanWorks controller kits tap into high-speed PCI Express bus

May 17, 2012

Richardson, TX (May 17, 2012) – Two new controller kits for the ScanWorks® platform for embedded instruments from ASSET® InterTech (www.asset-intertech.com) can accelerate test throughput by plugging into the high-speed PCI Express® (PCIe) bus in the personal computer where ScanWorks is running. ASSET is the leading supplier of tools for embedded instrumentation.

The new controller kits can apply ScanWorks non-intrusive board tests (NBT) to a circuit board. The PCIe-1000 is a single-TAP controller used for cost-effective JTAG testing. The PCIe-410 controller … Read More → "ASSET’s two new ScanWorks controller kits tap into high-speed PCI Express bus"

MEMS Industry Group Explores Product Realization at Sensors Expo & Conference 2012

May 17, 2012

PITTSBURGH—May 17, 2012—MEMS Industry Group® (MIG), the industry organization advancing micro-electromechanical systems (MEMS) across global markets, today reaffirmed its conference and exposition line-up for Sensors Expo & Conference 2012, the premier industry event in North America for designing sensors and sensor-integrated systems. Joined by leading member-companies, MIG will examine the forces behind the commercialization of MEMS through a pre-conference symposium, MEMS conference track, and MEMS Pavilion exhibition area on the show floor.

Pre-conference Symposium: MEMS in the Mainstream</ … Read More → "MEMS Industry Group Explores Product Realization at Sensors Expo & Conference 2012"

Texas Instruments low-power FPD-Link serializer offers industry’s highest resolution for tablets

May 17, 2012

DALLAS (May 16, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a low-power, FPD-Link serializer that delivers the industry’s highest screen resolution while extending battery life in tablet computers, ebooks, laptops and portable display monitors. With the industry’s highest pixel clock rate of 185-MHz, the dual LVDS DS90C187 supports WQXGA LCD panels at 30 Hz and QXGA panels at 60 Hz. The nearest competitor only reaches 174 MHz for WUXGA screen resolution. The DS90C187 also extends battery life by consuming a mere 90-mW when supporting the 1080p WUXGA screen resolution. For more information and to order samples, visit Read More → "Texas Instruments low-power FPD-Link serializer offers industry’s highest resolution for tablets"