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Cadence Adds Powerful New Capabilities to Its PCI Express Verification IP Including PIPE4 Support

PCI-SIG® DEVELOPERS CONFERENCE — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced powerful new capabilities in its PCI Express® Verification IP (PCIe® VIP) which result in more in-depth verification of the most current PCI Express specification at both the block and system-on-chip (SoC) levels. The comprehensive Cadence technology includes … Read More → "Cadence Adds Powerful New Capabilities to Its PCI Express Verification IP Including PIPE4 Support"

InvenSense Sets a New Industry Benchmark with the World’s Smallest Six-axis Integrated MotionTracking Device

SUNNYVALE, California, July 10, 2012 – InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking devices for consumer electronics, today introduced the MPU-6500, the company’s second-generation 6-axis MotionTracking device for smartphones, tablets, wearable sensors, and other consumer markets. The MPU-6500, delivered in … Read More → "InvenSense Sets a New Industry Benchmark with the World’s Smallest Six-axis Integrated MotionTracking Device"

Vicor Delivers First Direct 48V-to-Processor, Intel x86-compliant Solution for Datacenter and Telecom Applications

Tokyo, Japan – July 11, 2012 – Vicor Corporation (NASDAQ: VICR) today announced at the Techno-Frontier conference in Tokyo its direct 48V-to-processor power conversion solution for the datacenter, cloud computing and telecom markets. Vicor’s Factorized Power solution complies with Intel’s x86 VR12.0 voltage regulation specification.  Vicor’s current multiplication from 48V directly to a 1V microprocessor load enables more efficient power distribution and eliminates duplicate conversion stages found in traditional 48V to 12V to 1V power systems, yielding more than 5% greater overall efficiency in a package size that’s 3X smaller than competing offerings.

With increasing demands on datacenter … Read More → "Vicor Delivers First Direct 48V-to-Processor, Intel x86-compliant Solution for Datacenter and Telecom Applications"

Infinite Power Solutions Launches Self-Powered Wireless Environmental Sensor Eval Kit

Littleton, Colo., July 10, 2012? – (IPS), an industry leader in solid-state, rechargeable, thin-film battery solutions today announced the availability of the IPS-EVAL-EH-02 Wireless Environmental Sensor Energy Harvesting Evaluation Kit. The new evaluation kit is a complete wireless sensor reference design that includes a microcontroller and radio module from Microchip Technology and multiple indoor environmental sensors. … Read More → "Infinite Power Solutions Launches Self-Powered Wireless Environmental Sensor Eval Kit"

CUI’s ac-dc modules deliver up to 2 Watts from 0.8 in3 space-saving package

TUALATIN, Ore. – July 10, 2012 – CUI Inc announces 12 new ac-dc encapsulated power modules for space-constrained applications. The 1 W VSK-S1 series and 2 W VSK-S2 series feature ultra-compact 0.8 in3 packages measuring 1.32” x 0.87” x 0.70” (33.7 x 22.2 x 18 mm). With industry-leading no-load power consumption of 100 mW, the modules are ideal for primary or auxiliary power conversion in a variety of ITE, consumer electronics, and industrial control applications.

An input range of 85~305 Vac makes these ac-dc modules suitable for lighting and smart building systems that operate from 277 Vac. Up to 78% efficient, with an operating temperature range of -25 to 70 degrees C, the … Read More → "CUI’s ac-dc modules deliver up to 2 Watts from 0.8 in3 space-saving package"

Maxim‘s Highly Integrated Optical Sensors Measure RGB, Ambient Light, Proximity Motion, Infrared, and Temperature

San Jose, CA—July 10, 2012—Maxim Integrated Products (NASDAQ: MXIM) announces four, new digital optical sensors that advance analog integration with sensor fusion.

The MAX44004/05/06/08 measure red/green/blue (RGB) light levels, ambient visible light (ALS), proximity to the sensor, ambient infrared (IR) levels, and temperature. As many as seven sensors are integrated into one … Read More → "Maxim‘s Highly Integrated Optical Sensors Measure RGB, Ambient Light, Proximity Motion, Infrared, and Temperature"

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments

HENDERSON, Nevada – July 10, 2012 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions, worked with Agilent Technologies to deliver a new co-simulation interface between the latest version of Riviera-PRO™, Aldec’s popular design simulation and verification platform used by FPGA, ASIC, and SoC development teams, and SystemVue, Agilent’s ESL design and signal processing environment used by system architects and algorithm developers in physical layer designs of wireless, RF and DSP applications. The new solution enables users to … Read More → "Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments"

Honeywell Introduces NBP Series Basic Board Mount Pressure Sensors

MINNEAPOLIS, July 10, 2012 – Honeywell (NYSE: HON) announced today the release of its new Basic Board Mount Pressure Sensors, NBP Series, the newest offering in its board mount pressure sensor product portfolio. These are a cost-effective, basic performance, mV output, unamplified, uncompensated, high quality and high resolution solution for customers seeking high-volume, economical board mount pressure sensors.

Honeywell’s NBP Series is ideal for customers who want to do their own compensation, calibration, and amplification to make use of the maximum resolution of the bare sensor output, leveraging a custom … Read More → "Honeywell Introduces NBP Series Basic Board Mount Pressure Sensors"

Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments

HENDERSON, Nevada – July 10, 2012 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions, worked with Agilent Technologies to deliver a new co-simulation interface between the latest version of Riviera-PRO™, Aldec’s popular design simulation and verification platform used by FPGA, ASIC, and SoC development teams, and SystemVue, Agilent’s ESL design and signal processing environment used by system architects and algorithm developers in physical layer designs of wireless, RF and DSP applications. The new solution enables users to … Read More → "Aldec and Agilent Technologies Bridge the Gap Between ESL and RTL by Linking Simulation Environments"

Assembler Optimised Software Libraries for Texas Instruments DSPs

July 2012, Northwich, Cheshire. Kane Computing Ltd (KCL) today announced the release of new versions of the well-established GDD range of hand coded libraries to support the latest multi-core processors from Texas Instruments.

This family of assembler optimised products includes a DSP Vector Library; an ECC LINPACK Library, an EISPACK Library and an ECC BLAS Level 1/2/3 Library.

The latest versions now supports TI’s KeyStone-based TMS320C66x multicore DSP generation, including the TMS320C665x and TMS320C667x DSPs, as well as the TMS320C674x single core DSPs. The software also supports Sitara< … Read More → "Assembler Optimised Software Libraries for Texas Instruments DSPs"

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