News – Page 1990 – EEJournal

Cadence Encounter RTL-to-GDSII Flow Enables Sharp to Achieve 2X Improvement in Turnaround Time

July 17, 2012

SAN JOSE, CA–(Marketwire – July 17, 2012) – “Once we switched to the Cadence Encounter RTL-to-GDSII flow, we saw dramatic improvements in turnaround time and better quality designs,” said Naoya Fujita, division deputy general manager and department general manager of the Product Planning Department, Sensing Device Division in Sharp’s Electronic Components and Devices Group. “We exceeded our design requirements and expectations, and look forward to continued collaboration with Cadence to meet the growing demand for high-quality CMOS images sensors.”Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader … Read More → "Cadence Encounter RTL-to-GDSII Flow Enables Sharp to Achieve 2X Improvement in Turnaround Time"

Green Hills Software Announces Optimized Tools for Renesas Electronics’ New-Generation RH850 Microcontroller

July 17, 2012

SANTA BARBARA, CA and TOKYO, JAPAN — July 17, 2012 — Green Hills Software, the largest independent vendor of embedded software solutions, today announced its collaboration with Renesas Electronics Corporation, a premier provider of advanced high performance semiconductor solutions, for the development of the best-of-class automotive solution for Renesas’ new RH850 family of automotive microcontrollers (MCU). Green Hills Software’s MULTI® multicore debugger, optimizing compiler, TimeMachine™ suite and processor probes will target the advanced capabilities of the new RH850 core, including its high-speed floating-point unit (FPU), enhanced peripherals, and multicore debug and high-speed processor trace interfaces.

TI introduces ultra-small boost power module for smartphones and tablets

July 17, 2012

DALLAS (July 17, 2012) – Texas Instruments Incorporated (TI) (NASDAQ:TXN) today introduced the industry’s smallest integrated step-up (boost) DC/DC power module for smartphones, tablets and other portable electronics. The new, efficient TPS81256 MicroSiP™ converter integrates the inductor and input/output capacitors to achieve a solution less than 9-mm² and sub-1 mm height, simplifying design and saving up to 50-percent more board space versus competing solutions. For more information, samples and evaluation module, visit: www.ti.com/tps81256-pr.

Smallest integrated boost converter</ … Read More → "TI introduces ultra-small boost power module for smartphones and tablets"

Xilinx Ships First Artix-7 FPGAs – Raising the Performance Bar for Portable and Small Form Factor Applications at the ‘Edge

July 17, 2012

SAN JOSE, Calif., July 17, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced first shipments of its Artix™-7 Field Programmable Gate Array (FPGA) family. The new devices extend the reach of FPGA technology to applications requiring performance capabilities traditionally served by Virtex® FPGAs, but the form factor of small, low-cost programmable devices. Makers of portable medical, hand-held radio, and small cellular base stations – and a host of other professional grade applications that sit at the edge of their respective technology infrastructures – … Read More → "Xilinx Ships First Artix-7 FPGAs – Raising the Performance Bar for Portable and Small Form Factor Applications at the ‘Edge"

Xilinx Demonstrates Value of Programmable Systems Integration at ESC India 2012

July 16, 2012

BANGALORE, India, July 15, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will demonstrate its Zynq™-7000 Extensible Processing Platform (EPP) and new Vivado™ Design Suite, as well as presenting two conference papers on FPGA design for software developers and System-on-Chip (SoC) integration at ESC India 2012 from July 18-20, 2012. Xilinx will show visitors how its All Programmable technologies enable flexible, scalable embedded designs for achieving increased system performance and accelerated design productivity.

Xilinx’s All Programmable technologies comprise of FPGAs, 3D ICs and SoCs featuring programmable hardware, software and … Read More → "Xilinx Demonstrates Value of Programmable Systems Integration at ESC India 2012"

Buffalo’s 802.11ac Wireless Solutions Launch In EMEA

July 16, 2012

Buffalo Technology, a global leader in the design, development and manufacturing of wired and wireless networking and network and direct attached storage solutions, today announced that the AirStation™ 1750 Wireless 802.11n+11ac Gigabit Dual Band Router WZR-D1800H-EU and AirStation™ 1300 Wireless 802.11n+11ac Gigabit Dual Band Media Bridge WLI-H4-D1300-EU wireless media bridge are now available for purchase from select online partners. Based on Broadcom’s 5G WiFi chips and first unveiled on the show floor at the 2012 International Consumer Electronics Show (CES) in Las Vegas, WZR-D1800H-EU and WLI-H4 … Read More → "Buffalo’s 802.11ac Wireless Solutions Launch In EMEA"

Renesas Electronics 7th-Generation 650 V and 1250 V IGBT Series sets a new technology benchmark enabling high efficiency solutions in Industrial Applications such as Inverters for Solar Power and Industrial Motors

July 16, 2012

Dusseldorf, July 11, 2012 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced 13 new products in its 7th-generation Insulated Gate Bipolar Transistor (IGBT) lineup with industry-leading high performance. The new IGBTs include the RJH/RJP65S series for 650 V and RJP1CS series for 1250 V. The new IGBTs are power semiconductor devices used in systems that convert DC into AC power, and are designed for applications that handle high voltages and large currents, such as power conditioners (power converters) for solar power generators and industrial motors. The 7th-generation … Read More → "Renesas Electronics 7th-Generation 650 V and 1250 V IGBT Series sets a new technology benchmark enabling high efficiency solutions in Industrial Applications such as Inverters for Solar Power and Industrial Motors"

Bruker Announces Three Next-Generation Semiconductor Metrology Products

July 16, 2012

SAN FRANCISCO, CA–July 10, 2012–Today at SEMICON West 2012, Bruker announced three new 450mm X-Ray and AFM semiconductor metrology products to support the industry’s transition to larger wafer production. These new products include the InSight-450 3DAFM from Bruker’s Nano Surfaces division and both the next generation of the D8 FABLINE and the new S8 FABLINE-T X-ray systems from Bruker’s AXS division. All three metrology systems are designed to meet the industry roadmap challenges at future technology nodes on the larger 450mm wafer size, enabling both greater product capability and reliability for semi development and production facilities.</ … Read More → "Bruker Announces Three Next-Generation Semiconductor Metrology Products"

Industry’s Quietest Modular Power Supplies from Excelsys

July 16, 2012

Excelsys Technologies, leaders in high efficiency modular power supply design, announces the release of the first Ultra-Quiet products from their market leading Xgen platform of user configurable power supplies.

The Excelsys Xgen Ultra-Quiet family is comprised of four models offering up to 400W output power. With only 37.3dBA of acoustic noise over all load conditions, … Read More → "Industry’s Quietest Modular Power Supplies from Excelsys"

Avnet Electronics Marketing Opens Americas-based Light Lab for LED Measurement and Testing

July 16, 2012

PHOENIX— July 16, 2012 — Avnet Electronics Marketing Americas, a business region of Avnet, … Read More → "Avnet Electronics Marketing Opens Americas-based Light Lab for LED Measurement and Testing"