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Nordic Semiconductor Global Tech Tour to help embedded systems developers build connectable wireless Bluetooth Smart and ANT ‘appcessories’ in a day

August 15, 2012

Oslo, Norway – August 15, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that with the launch of its ground-breaking nRF51 Series of System-on-Chips (SoCs) it will embark on a Global Tech Tour in which a team of the company’s top wireless application technical experts will travel around the world to teach embedded systems developers in just one day how to develop their first/next generation Bluetooth Smart or ANT+ ULP wireless smartphone application accessory or ‘appcessory’ for short.

Each seminar is designed to be intensive, fun, and fully hands-on, and … Read More → "Nordic Semiconductor Global Tech Tour to help embedded systems developers build connectable wireless Bluetooth Smart and ANT ‘appcessories’ in a day"

Linear Technology Devices Power Mars Curiosity Rover

August 15, 2012

MILPITAS, CA – August 15, 2012 – Linear Technology Corporation (Nasdaq: LLTC), a leading supplier of high performance analog integrated circuits, announced today that its products are playing a key role in the Mars rover launched by NASA’s Jet Propulsion Laboratory (JPL). Linear Technology’s high performance analog semiconductors are used in the Mars Science Laboratory (Curiosity) rover to enable collection of vast amounts of data, including detailed visual images of the Martian landscape and precise readings to assist scientists in assessing the geology and history of Mars. NASA stated that the goal of the mission is to help determine whether Mars … Read More → "Linear Technology Devices Power Mars Curiosity Rover"

EMA Earns Autodesk Simulation Specialization

August 15, 2012

Rochester, NY (August 14, 2012) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced that it has earned the new Autodesk Simulation Specialization designation for VARs from Autodesk, Inc., a world leader in 3D design, engineering, and entertainment software. As an Autodesk Specialized Partner, EMA has shown that they have made a significant investment in their people, have a solid … Read More → "EMA Earns Autodesk Simulation Specialization"

RFSA2644/2654 6-Bit Serial-Controlled Digital Step Attenuators

August 14, 2012

RFMD’s new RFSA2644/2654 6-bit digital step attenuators (DSAs) feature high linearity over their entire 31.5dB gain control range with excellent step accuracy in 0.5dB steps. They are programmed via a serial mode control interface that is both 3V and 5V compatible. They also offer a rugged Class 1C HBM ESD rating via on-chip ESD circuitry. The MCM package is footprint-compatible with most 24-pin, 4mm x 4mm, QFN packages.

Features

Frequency Range

RFSA2644: 50MHz to 4000MHz
RFSA2654: 5MHz to 2000MHz

Attenuation Range and Step: 31.5 … Read More → "RFSA2644/2654 6-Bit Serial-Controlled Digital Step Attenuators"

MEMS Industry Group Showcases the Future of MEMS at MEMS Executive Congress 2012

August 14, 2012

PITTSBURGH—August 13, 2012—MEMS Industry Group (MIG) will host MEMS Executive Congress® 2012, the annual business conference and networking event for the MEMS industry, November 7-8, 2012 in Scottsdale, AZ. Keynote speakers include: Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs , who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition. Brunner, who first made his name as director of … Read More → "MEMS Industry Group Showcases the Future of MEMS at MEMS Executive Congress 2012"

Maxwell Technologies To Deliver Presentation ON Improved Solid-State Drive (SSD) Performance At Flash Memory Summit

August 14, 2012

SAN DIEGO, Calif. (August 13, 2012) – Maxwell Technologies, Inc. (Nasdaq: MXWL) announced today it will give a presentation entitled “Improve SSD Performance With Ultracapacitor Power Backup” (session 301-B) at the Flash Memory Summit on August 23, 2012 from 8:30 a.m. – 9:40 a.m. at the Santa Clara Convention Center, Santa Clara, California. Maxwell’s director of application engineering will present the latest information on improving SSD cache-to-flash applications by integrating ultracapacitor backup power.

Maxwell Technologies’ presentation will highlight how system designers can obtain DRAM … Read More → "Maxwell Technologies To Deliver Presentation ON Improved Solid-State Drive (SSD) Performance At Flash Memory Summit"

ADLINK Launches State-of-the-art cPCI Blade with Eight-Core Intel® Xeon® Processor E5-2448L

August 14, 2012

August 14, 2012 – SAN JOSE, CA – ADLINK Technology, Inc. (TAIEX: 6166), a leading provider of trusted embedded computing products, today announced availability of the cPCI-6930, a next-generation 6U dual-slot CompactPCI® (cPCI) processor blade < … Read More → "ADLINK Launches State-of-the-art cPCI Blade with Eight-Core Intel® Xeon® Processor E5-2448L"

Digi-Key Corporation Signs Global Distribution Agreement with Hittite Microwave

August 14, 2012

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection of electronic components available for immediate shipment, today announced … Read More → "Digi-Key Corporation Signs Global Distribution Agreement with Hittite Microwave"

Inband Software Offers DSP Development Services for Tensilica Customers

August 14, 2012

SANTA CLARA, Calif. USA – August 14, 2012 -Tensilica®, Inc. today announced that Inband Software has worked closely with Tensilica on several HiFi Audio/Voice DSP (digital signal processor) porting projects and is now an Authorized Software Partner in the Xtensions(TM) Network.

Inband Software can assist in algorithm development, fixed-point conversion, and optimization for Tensilica’s HiFi Audio/Voice DSPs and other architectures. Inband Software has experience in a variety of DSP applications including audio and voice codecs, image processing, and digital communications and the company collaborated with Tensilica in the development of several speech codecs, … Read More → "Inband Software Offers DSP Development Services for Tensilica Customers"

First Draft of Hybrid Memory Cube Interface Specification Released

August 14, 2012

BOISE, Idaho and SAN JOSE, Calif., 2012-08-14 14:00 CEST (GLOBE NEWSWIRE) — The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc. (Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that its developer members have released the initial draft of the Hybrid Memory Cube (HMC) interface specification to a rapidly growing number of industry adopters. Issuance of the draft puts the consortium on schedule to release the final version by the end of this year. The industry specification will enable adopters to fully develop designs that leverage HMC’s innovative technology, which has the potential to boost performance … Read More → "First Draft of Hybrid Memory Cube Interface Specification Released"