News – Page 1975 – EEJournal

High Efficiency PoE++ PD Controllers Provide up to 90W Delivered Power

August 27, 2012

MILPITAS, CA – August 27, 2012 – Linear Technology Corporation introduces the LT4275, LTPoE++™, PoE+ and PoE-compliant powered device (PD) interface controllers for applications requiring up to 90W of delivered power. PoE+ limits the maximum PD power delivery to 25.5W, which is insufficient to power today’s new class of power-hungry applications, such as picocells, base stations, signage and heated outdoor cameras. Linear Technology’s</ … Read More → "High Efficiency PoE++ PD Controllers Provide up to 90W Delivered Power"

Linux Professional Institute Hosts Exam Labs at SUSECon 2012

August 24, 2012

(Sacramento, CA, USA: August 23, 2012) The Linux Professional Institute (LPI), the world’s premier Linux certification organization (http://www.lpi.org), will offer all of its popular LPIC certification exams at SUSECon, September 18-21, 2012, at the Caribe Royale Hotel in Orlando, Florida (http://www.suse.com/events/susecon/). SUSECon is the first annual global conference for SUSE customers, partners and community enthusiasts. LPI … Read More → "Linux Professional Institute Hosts Exam Labs at SUSECon 2012"

Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models

August 24, 2012

SANTA CLARA, Calif., Aug. 23, 2012 – Agilent Technologies Inc. (NYSE: A) today announced shipment of its first release of the industry-leading SPICE modeling tools it obtained through the acquisition of Accelicon Technologies in February.

The tools – Model Builder Program (MBP), Model Quality Assurance (MQA) and Advanced Model Analysis (AMA) – are now an integral part of Agilent’s device-modeling portfolio.

“The release today … Read More → "Agilent Technologies Ships New Software for Generating and Qualifying SPICE Models"

Xilinx 3D-IC System Integration at Hot Chips 2012

August 23, 2012

SAN JOSE, Calif., Aug. 23, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at Hot Chips 2012, August 27-29, at the Flint Center for the Performing Arts. Xilinx corporate vice president of FPGA development and silicon technology,Liam Madden, will kick off Xilinx activities by hosting a multi-vendor tutorial on die stacking, with presentations from AMD, Amkor, Qualcomm, UMC, and Xilinx. During the tutorial, Xilinxwill cover how 3D-ICs built with Xilinx stacked silicon interconnect technology are delivering capabilities that in many respects are a … Read More → "Xilinx 3D-IC System Integration at Hot Chips 2012"

Cymbet Introduces First Real Time Clock with Integrated Solid State Battery

August 23, 2012

Minneapolis, August 23, 2012 – Cymbet Corporation announced the world’s first all solid state device that integrates a Real Time Clock chip, EnerChip™ solid state rechargeable battery, and power management integrated circuit (PMIC) in a tiny single chip plastic package. Combining bare die devices into the world’s smallest footprint solution, EnerChip™ RTCs are low cost, space efficient, low profile, and utilize fewer components than legacy solutions. Electronic product designers can now implement time keeping/alerting functions with integrated power holdover and their customers will never have to change a dead backup battery over the life of the products.

Synchronous Step-Down DC/DC Controller with I²C/PMBus Digital Power System Management & Onboard EEPROM

August 23, 2012

MILPITAS, CA – August 23, 2012 – Linear Technology Corporation announces the LTC3883/-1, a synchronous step-down DC/DC controller with an I²C-based PMBus interface for digital power system management. This device combines best-in-class current-mode switching regulator performance with precision mixed signal data acquisition for unsurpassed ease of power system design and management. It is supported by the LTpowerPlay™ software development system … Read More → "Synchronous Step-Down DC/DC Controller with I²C/PMBus Digital Power System Management & Onboard EEPROM"

Digi-Key Corporation Announces Global Distribution Agreement with Touch Revolution

August 22, 2012

THIEF RIVER FALLS, Minn., USA – Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection of electronic components available … Read More → "Digi-Key Corporation Announces Global Distribution Agreement with Touch Revolution"

45V, 2.3A LED Driver for Boost, Buck or Buck-Boost High Current LED Applications Offers Maximum Junction Temperature of 150°C & QFN Package

August 22, 2012

MILPITAS, CA – August 22, 2012 – Linear Technology announces the H-grade version of the LT3518. The LT3518 is a 45V, high-side current sense DC/DC converter designed to drive high current LEDs at constant current. Its 3V to 30V input voltage range with transient protection to 40V makes the LT3518 ideal for a wide variety of applications, including automotive, industrial and architectural lighting.

The H-grade version operates … Read More → "45V, 2.3A LED Driver for Boost, Buck or Buck-Boost High Current LED Applications Offers Maximum Junction Temperature of 150°C & QFN Package"

Saelig Debuts High Performance 3-Ch 195W Power Supply

August 21, 2012

Pittsford, NY, USA: Saelig Company, Inc. has introduced theODP3032, a high-performance, programmable three-channel linear DC power supply. It features dual independent outputs with separate controls and one fixed 5V/3A supply for up to 195W total power with an output resolution of 1mV/1mA. The ODP3032 offers outstanding line regulation and low ripple noise, with standard PC interfaces to meet diverse test applications.

Four operating modes are provided for the two variable outputs: independent (0~30V/0~3A), parallel (0~30V/0~6A), series (0~60V/0~3A), and plus-minus (-30V ~ +30V/0~3A). All three channels are isolated, and a 3.9″ high-resolution (480 x320 … Read More → "Saelig Debuts High Performance 3-Ch 195W Power Supply"

Greenliant Pushes MLC NAND-based NANDrive™ SSDs to Industrial Temperatures

August 21, 2012

SANTA CLARA, CALIF. – AUGUST 21, 2012 – Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, is now sampling its industrial temperature SATA and PATA interfaceNANDrive™ embedded solid state drives (SSDs) using 2-bits-per-cell (MLC) NAND flash memory. The new NANDrive devices are the first ball grid array (BGA) package SATA / PATA SSDs based on MLC NAND that are capable of operating at temperatures between -40 to +85 degrees Celsius.

NANDrive combines Greenliant’s internally developed NAND controller with NAND flash die for a fully integrated SSD … Read More → "Greenliant Pushes MLC NAND-based NANDrive™ SSDs to Industrial Temperatures"