News – Page 1972 – EEJournal

IAR Systems releases complete starter kit for NXP’s LPC1780 microcontroller series

July 19, 2011

Uppsala, Sweden—July 19, 2011— IAR Systems today announced a complete starter kit for NXP’s ARM Cortex-M3 based LPC1780 microcontroller family. IAR KickStart Kit for LPC1788 includes a feature-rich evaluation board, software development tools, an IAR J-Link Lite debug probe, and software. A high level of integration between hardware, software and tools in combination with pre-configured example projects and board support packages from various RTOS vendors makes it very easy to use the kit and get started with evaluation and development.

The evaluation board is fitted with … Read More → "IAR Systems releases complete starter kit for NXP’s LPC1780 microcontroller series"

XP Power extends family of COTS DC-DC converters aimed at military vehicle and avionic applications

July 19, 2011

XP Power today introduced the MTC35 and MTC50 series of commercial off the shelf (COTS) 35 W and 50 W DC-DC converters aimed at a broad range of military vehicle and avionics applications. These extremely robust and encapsulated board mounted modules accommodate a wide input range from 10 to 40 VDC, and can handle transients up to 50 VDC for up to 100 ms. Single output modules are available with + 3.3, + 5, + 12, + 15 or + 28 VDC outputs and can be adjusted between -20% and +10% via an external trim pin.

When used in conjunction with XP Power’s DSF, FSO or MTF series of standard EMI filter modules, … Read More → "XP Power extends family of COTS DC-DC converters aimed at military vehicle and avionic applications"

Vector Fabrics takes the pain out of parallelizing code for multi-core x86 architectures

July 19, 2011

Eindhoven, The Netherlands, 19th July 2011 – Vector Fabrics today announced the availability of its vfThreaded-x86 cloud-based software tool that facilitates the optimization and parallelization of applications for multi-core x86 architectures. Aimed at software developers that write performance-centric code such as for high-performance computing, scientific, industrial, video or imaging applications, the tool greatly reduces the time involved and the risks associated with optimizing code for the latest multi-core x86 processors.

“We’re excited to bring our proven parallelization technologies to the programming community that develops applications for the Intel architecture. Our tools make it easy to speed up a … Read More → "Vector Fabrics takes the pain out of parallelizing code for multi-core x86 architectures"

Microsemi Introduces Replacement Solution for Micron Technology EOL Package Used with TI Processors

July 19, 2011

IRVINE, Calif., July 19, 2011–Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors. The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today. The new memory solution is compatible with TI processor families that are enclosed in Micron Technology’s end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming … Read More → "Microsemi Introduces Replacement Solution for Micron Technology EOL Package Used with TI Processors"

New Release of Lattice Diamond Design Software Delivers More Robust Design Capabilities for Low Power, Cost Sensitive FPGA Applications

July 18, 2011

HILLSBORO, OR–(Marketwire – Jul 18, 2011) – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced release 1.3 of its Lattice Diamond® design software, the flagship design environment for Lattice FPGA products. Users of Lattice Diamond 1.3 software will benefit from major new features, including clock jitter analysis. Lattice Diamond 1.3 software is also now integrated with Lattice’s PAC-Designer® 6.1 mixed signal design tools ( … Read More → "New Release of Lattice Diamond Design Software Delivers More Robust Design Capabilities for Low Power, Cost Sensitive FPGA Applications"

IP65-rated Panel PC family by WinSystems introduced for Demanding Industrial Applications

July 18, 2011

July 14, 2011, Arlington, TX – Four new industrial-grade Panel PCs were introduced today by WinSystems. Available with 12-, 15-, 17- or 19-inch diagonal displays and touch screens, the PPC65 family of Panel PCs is powered by a fully integrated 1.6 GHz Intel^® Atom^™ based single board computer (SBC) which offers a multitude of I/O connectivity options. The front bezels on these Panel PCs are environmentally sealed to comply with NEMA 4/IP65 specifications to prevent damaging moisture, dust, and dirt from getting … Read More → "IP65-rated Panel PC family by WinSystems introduced for Demanding Industrial Applications"

Lattice’s New Mixed Signal Design Software Simplifies Platform Management Design

July 18, 2011

HILLSBORO, OR–(Marketwire – Jul 18, 2011) – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced release 6.1 of its PAC-Designer® mixed signal design software, with updated support for Lattice’s Platform Manager™, Power Manager II and ispClock™ devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond® 1.3 software design environment, which was also announced today. … Read More → "Lattice’s New Mixed Signal Design Software Simplifies Platform Management Design"

TI’s new development kit helps engineers quickly and easily design Bluetooth® technology-enabled applications based on Stellaris® microcontrollers

July 18, 2011

DALLAS, Texas, July 18 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the Stellaris® 2.4 GHz CC2560 Bluetooth® Wireless Kit (DK-EM2-2560B), aimed at jumpstarting Bluetooth®-enabled designs. The kit includes the high-throughput, power-efficient CC2560 Bluetooth solution and proven Bluetooth stack within StellarisWare® software. The performance and integration of Stellaris MCUs pair with TI’s leading Bluetooth solution to help developers address the demand for … Read More → "TI’s new development kit helps engineers quickly and easily design Bluetooth® technology-enabled applications based on Stellaris® microcontrollers"

Renesas Electronics Achieves 4X Faster Performance with Synopsys’ HAPS® FPGA-Based Prototyping Solution

July 18, 2011

MOUNTAIN VIEW, Calif., July 18, 2011 — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, adopted Synopsys’ HAPS-64 FPGA-based prototyping systems for their prototyping environment for systems-on-chips (SoCs) and microcontrollers. By deploying the HAPS systems, Renesas Electronics achieved more than a 4X speed-up in prototype performance over their previous FPGA prototyping solution. In addition, the … Read More → "Renesas Electronics Achieves 4X Faster Performance with Synopsys’ HAPS® FPGA-Based Prototyping Solution"

Maxim Acquires SensorDynamics, Developer and Manufacturer of Proprietary Sensor and MEMS Solutions

July 18, 2011

SUNNYVALE, Calif., 2011-07-18 13:15 CEST (GLOBE NEWSWIRE) — Maxim Integrated Products (Nasdaq:MXIM) today announced it has acquired SensorDynamics, a privately held semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) solutions. SensorDynamics is based in Lebring, near Graz, … Read More → "Maxim Acquires SensorDynamics, Developer and Manufacturer of Proprietary Sensor and MEMS Solutions"

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