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Freescale enables cost-effective meters with highest level of accuracy and security

AMSTERDAM (Metering, Billing/CRM Europe) – Oct. 9, 2012 – To address the increasing global demand for smart meters, Freescale Semiconductor (NYSE: FSL) has introduced the new Kinetis M series of microcontrollers (MCUs), based on the 32-bit ARM® CortexTM-M0+ core. The Kinetis M series was designed specifically to enable a wide range of cost-effective one- or two-phase electrical meter designs.

Some Kinetis M series devices integrate the necessary peripherals to build a single- chip, cost-effective meter that does not require external components, while … Read More → "Freescale enables cost-effective meters with highest level of accuracy and security"

Freescale announces first sub-gigahertz wireless microcontroller using world’s most energy-efficient 32-bit processor core

AMSTERDAM (Metering, Billing/CRM Europe) – Oct. 9, 2012 – Freescale Semiconductor (NYSE: FSL) today announced the Kinetis KW01 wireless microcontroller (MCU), expanding its popular Kinetis MCU line with a device ideally suited for wirelessly networked smart energy applications.

Several protocols are emerging globally for outdoor and indoor smart energy networks that require robust communication and low power consumption. The Kinetis KW01 wireless MCU meets their requirements with a high-performance radio capable of up to 600 Kbps using complex modulation schemes (GFSK, MSK, GMSK and OOK) while operating at multiple frequencies in the range … Read More → "Freescale announces first sub-gigahertz wireless microcontroller using world’s most energy-efficient 32-bit processor core"

Cadence Signoff Solution Produces Time-to-Market Advantage for STMicroelectronics

SAN JOSE, CA–(Marketwire – October 09, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, slashed multiple weeks from its design schedule on a 28-nanometer system-on-chip (SoC) by switching to the Cadence® signoff solution. In concert with the Cadence RTL-to-GDSII flow, ST deployed Cadence signoff technologies to gain better quality of results and productivity while accelerating time to market in the tapeout of an advanced SoC.</ … Read More → "Cadence Signoff Solution Produces Time-to-Market Advantage for STMicroelectronics"

CEVA, NXP Software Partner to Deliver Enhanced HD Voice Processing Solution based on the CEVA-TeakLite-4 DSP

MOUNTAIN VIEW, Calif., and EINDHOVEN, The Netherlands – October 09, 2012 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and NXP Software, a world leader in mobile multimedia software, today announced the companies have partnered to deliver an enhanced HD voice processing solution for the smartphone market, integrating NXP Software’s market-leading LifeVibes VoiceExperience software with the CEVA-TeakLite family of DSPs, including the Read More → "CEVA, NXP Software Partner to Deliver Enhanced HD Voice Processing Solution based on the CEVA-TeakLite-4 DSP"

Express Logic’s ThreadX RTOS Supports ARM and TI DSP Processors on Critical Link’s MityDSP-L138F Board

San Diego, CA – October 9, 2012 – Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced that Express Logic’s popular ThreadX® RTOS now supports Critical Link’s MityDSP-L138 board. Critical Link’s MityDSP-L138F system-on-module (SoM) combines a TI C674x floating point DSP, an ARM9 processor, and an optional FPGA. ThreadX is the first and only RTOS … Read More → "Express Logic’s ThreadX RTOS Supports ARM and TI DSP Processors on Critical Link’s MityDSP-L138F Board"

Synopsys’ CODE V Delivers Optical Design Innovations That Enable Reduced Manufacturing Costs

MOUNTAIN VIEW, Calif., Oct. 9, 2012 /PRNewswire/ —

Highlights:

  • Direct optimization method can reduce sensitivity of optical systems to manufacturing tolerances, improve as-built performance and minimize production costs
  • New tolerancing feature provides increased flexibility for modeling surface irregularities and evaluating their impact on system performance

Synopsys, Inc. (Nasdaq: SNPS), a global leader accelerating innovation in the design, verification and manufacture of chips and systems, today announced the availability of Synopsys’ CODE V® Optical Design Software, version 10.5, which offers new and improved optimization and tolerancing capabilities for … Read More → "Synopsys’ CODE V Delivers Optical Design Innovations That Enable Reduced Manufacturing Costs"

Cadence Introduces Innovative Verification Debugger, Offering Significant Productivity Improvements and Time Savings

SAN JOSE, CA–(Marketwire – October 09, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the Incisive® Debug Analyzer, a new and innovative verification debug product for RTL, testbench and SoC verification that offers significant reductions in debug time and effort. Cadence® customers who have used this unique, multi-language debug solution have reported average time savings of up to 40 percent or more.

“Incisive Debug Analyzer is an innovative debug technology that has helped us fix bugs in minutes … Read More → "Cadence Introduces Innovative Verification Debugger, Offering Significant Productivity Improvements and Time Savings"

3V to 5V 802.11n/ac High Linearity WiFi Front End Modules

RFMD’s new high linearity WiFi front end modules provide complete integrated solution in a single front end module (FEM) for WiFi systems. The ultra-small form factor and integrated matching minimizes layout area in the application and greatly reduces the number of external components. This simplifies the total front end solution by reducing the bill of materials, system footprint, and manufacturability costs. Each of these devices integrates a power amplifier, switch, LNA with bypass, and a power detector coupler for improved accuracy and are provided in a 3mm x 3mm x 1.0mm, 16-pin laminate package.

Features</ … Read More → "3V to 5V 802.11n/ac High Linearity WiFi Front End Modules"

Hisense Picks Tensilica’s HiFi Audio/Voice DSP and Software Codecs for DTVs

SANTA CLARA, Calif. USA – October 9, 2012 –Tensilica®, Inc., today announced that Hisense Company Ltd., of Qingdao, China, is using the Tensilica HiFi Audio/Voice DSP (digital signal processor) to do all of the audio decoding and post processing in its new SOCs (system on chips) for DTV (digital televisions).  Tensilica’s HiFi Audio/Voice DSP is the most popular audio IP core on the market, with the lowest power and largest library of over 100 ported software codecs.

“For product differentiation, we decided to design our own DTV chips and we needed an audio DSP that … Read More → "Hisense Picks Tensilica’s HiFi Audio/Voice DSP and Software Codecs for DTVs"

Taoglas Unveils Range of High Performance LTE Antennas

SAN DIEGO, CA –  October 8, 2012 – TaoglasUSA, Inc. (www.taoglas.com), a leading provider of antenna solutions to the M2M and connected device market, today unveiled a range of high performance, ultra-wideband LTE antennas. Included in this off-the-shelf range are through hole, adhesive and connector mount external antennas as well as internal, surface mount, on-board and off-board, flexible polymer antennas. The new TG.30 Apex</ … Read More → "Taoglas Unveils Range of High Performance LTE Antennas"

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