News – Page 1969 – EEJournal

WirelessHART & Internet Protocol Wireless Sensor Networks Achieve Industry’s Lowest Power Consumption at Less Than 50µA per Node

October 16, 2012

MILPITAS, CA – October 16, 2012 – Linear Technology’s Dust Networks^® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking … Read More → "WirelessHART & Internet Protocol Wireless Sensor Networks Achieve Industry’s Lowest Power Consumption at Less Than 50µA per Node"

Analog Bits Extends Industry Leadership to 20nm

October 16, 2012

Sunnyvale, CA, October 16, 2012 – Analog Bits, the leader in Integrated Clocking and Interface IP, today announced the successful completion of a tape-out in TSMC’s 20nm manufacturing process and the corresponding availability of a Mixed Signal Design Kit (MSDK) for this advanced node. This combination equips customers with reliable, industry leading IP products on the industry’s next high-volume node: TSMC’s 20-nm SoC process. These steps follow the successful volume production of Analog Bits IP products in various versions of 28nm nodes.

“Our 20nm MSDK will help current and future customers reduce production risk while accelerating their … Read More → "Analog Bits Extends Industry Leadership to 20nm"

Mentor Graphics Provides Design, Verification and Test Solutions for TSMC’s 20nm Design Infrastructure

October 16, 2012

WILSONVILLE, Ore., October 16, 2012—Mentor Graphics Corp. (NASDAQ: MENT) today announced new capabilities to complement TSMC’s 20nm manufacturing processes. Enhancements to support both digital and analog/mixed signal 20nm reference flows include new features in the Pyxis™ IC Station platform, the Eldo fast SPICE simulation products, the Olympus-SoC™ place and route system, the Calibre® nmDRC™, Calibre RealTime, Calibre PERC™ and Calibre xACT 3D solutions, and the Tessent® silicon test product suite.

“Each successive process node brings new challenges that require greater understanding between design and manufacturing to resolve,” said Wally Rhines, chairman and CEO … Read More → "Mentor Graphics Provides Design, Verification and Test Solutions for TSMC’s 20nm Design Infrastructure"

Altium releases new TASKING C compilers for Power Architecture and RH850, targeting ISO 26262 application development

October 16, 2012

Karlsruhe, Germany, 16 October 2012 – Altium has released two completely new TASKING <http://www.tasking.com/> C compiler solutions for automotive application development, delivering support for the RH850 microcontrollers from Renesas and the Power Architecture® based microcontrollers from the Freescale Qorivva/5xxx and STMicroelectronics SPC56 series. These new development solutions extend the range of popular TASKING toolsets for automotive microcontrollers like XC2000, ARM, ST10 and TriCore.

Both new compilers have been developed from the ground up, using Altium’s highly efficient Viper “VX” … Read More → "Altium releases new TASKING C compilers for Power Architecture and RH850, targeting ISO 26262 application development"

Synopsys Joins PACE Global Partnership

October 16, 2012

MOUNTAIN VIEW, Calif., Oct. 16, 2012 /PRNewswire/ –Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced it has joined the Partners for the Advancement of Collaborative Engineering Education (PACE) program. Through the PACE program, Synopsys’ Saber product line for the modeling and simulation of power, physical and multi-domain automotive systems will be provided to all 57 PACE institutions worldwide.

“Promoting math and science education around the world is a fundamental value at Synopsys,” said Howard Ko, senior vice president and general manager of the Silicon Engineering … Read More → "Synopsys Joins PACE Global Partnership"

Avnet Electronics Marketing Americas Introduces Its Wi-Go Module and Supporting SpeedWay™ Technical Seminars

October 16, 2012

PHOENIX—October 15, 2012 — Today, Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: < … Read More → "Avnet Electronics Marketing Americas Introduces Its Wi-Go Module and Supporting SpeedWay™ Technical Seminars"

CEVA Reaches Major Shipment Milestone, Surpassing 4 Billion CEVA-powered Chips

October 16, 2012

MOUNTAIN VIEW, Calif. – October 16, 2012 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has reached a number of key milestones in relation to customer shipments and technology adoption, reaffirming CEVA’s position as the world’s leading DSP licensing company.

Milestone highlights include:

More than 4 billion CEVA-powered chips have now shipped to date, powering many of the world’s leading electronics brands, including; HTC, Huawei, Lenovo, LG, Motorola, Nintendo, Panasonic, Philips, Samsung, Sanyo, Sharp, Sony, Toshiba and ZTE.
CEVA DSPs … Read More → "CEVA Reaches Major Shipment Milestone, Surpassing 4 Billion CEVA-powered Chips"

Micron 20nm NAND Flash Powers Skyera’s Highest-Capacity “Skyhawk” Enterprise Solid-State Storage System

October 16, 2012

SAN JOSE, Calif., 2012-10-16 17:00 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU) today announced another new storage industry milestone—the integration of its 20nm NAND flash storage media into a high-endurance, high-capacity enterprise system. San Jose-based Skyera is using Micron’s 20nm, 128 gigabit (Gb) Read More → "Micron 20nm NAND Flash Powers Skyera’s Highest-Capacity “Skyhawk” Enterprise Solid-State Storage System"

TSMC Selects Cadence Virtuoso and Encounter Platforms for Its 20nm Design Infrastructure, Spanning Custom/Analog, Digital and Mixed-Signal Design

October 16, 2012

SAN JOSE, CA–(Marketwire – October 16, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has selected Cadence® solutions for its 20-nanometer design infrastructure. The solutions cover the Virtuoso® custom/analog and Read More → "TSMC Selects Cadence Virtuoso and Encounter Platforms for Its 20nm Design Infrastructure, Spanning Custom/Analog, Digital and Mixed-Signal Design"

Microsemi Delivers New Low Power Voice Solutions for Residential Gateways

October 16, 2012

ALISO VIEJO, Calif.—Oct. 16, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will unveil its fourth generation subscriber line chipset at the Broadband World Forum (BBWF) tradeshow today in Amsterdam. The new ZL880 series features low power, dual-channel wideband foreign exchange service (FXS) voice solutions for broadband residential gateways, cable embedded multimedia terminal adapters (eMTAs) and fiber to the premise (F TTX) applications. Microsemi will showcase the ZL880 series as well as the VeriVoice line test software in stand D45 at the tradeshow.

“Power efficiency, … Read More → "Microsemi Delivers New Low Power Voice Solutions for Residential Gateways"