News – Page 1960 – EEJournal

MFI renamed as X-FAB MEMS Foundry Itzehoe

November 1, 2012

Erfurt, Germany – Nov. 1, 2012 – X-FAB Silicon Foundries today announced it has increased its share in the German-based MEMS Foundry Itzehoe GmbH (MFI) from 25.5 percent to 51 percent – becoming the majority shareholder – and also renamed MFI as X-FAB MEMS Foundry Itzehoe.

These moves reflect X-FAB’s focus on MEMS manufacturing services and technologies. The Itzehoe site complements the MEMS capabilities and resources of the recently announced X-FAB MEMS Foundry in Erfurt, adding technologies for micro sensors, actuators, micro-optical structures and hermetic wafer-level packaging processes.

X-FAB MEMS Foundry Itzehoe will … Read More → "MFI renamed as X-FAB MEMS Foundry Itzehoe"

Xilinx Zynq-7000 All Programmable SoC Accelerates the Development of Trusted Systems at ARM TechCon 2012

November 1, 2012

SAN JOSE, Calif., Oct. 31, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced at ARM TechCon™ 2012 availability of solutions that further extend the Zynq™-7000 All Programmable SoC’s use within trusted systems that must meet strict safety and security requirements. Developers now have access to key hardware and software technologies, including on-chip decryption, authentication, ARM TrustZone® architecture, commercial and open source hypervisors, IP cores, and development boards. Collectively, these technologies offered by Xilinx, Xilinx Alliance Program members and the ARM Connected Community® … Read More → "Xilinx Zynq-7000 All Programmable SoC Accelerates the Development of Trusted Systems at ARM TechCon 2012"

Energy Micro and CODICO give away EFM32 Cortex-M3 MCU development kits at Electronica 2012

November 1, 2012

Oslo, Norway, October 31, 2012 – Energy Micro, the energy friendly microcontroller and radio company, is partnering with CODICO, the component distribution company, to distribute free EFM32GG-STK3700 Giant Gecko microcontroller starter kits at Electronica 2012. To qualify for a free kit, which can be used as the starting point of the development of most energy efficient applications, visitors register their interest at the booth of Energy Micro (A4.442) or Codico (A5.507).

Each starter kit features a … Read More → "Energy Micro and CODICO give away EFM32 Cortex-M3 MCU development kits at Electronica 2012"

Plessey develops sensor solution to monitor driver fatigue

October 31, 2012

Plymouth, ENGLAND – 29 October 2012 – Plessey has developed a novel solution to monitor driver fatigue that is based on its multi-award winning EPIC sensor technology. According to the British Royal Society for the Prevention of Accidents, research shows that driver fatigue may be a contributory factor in up to 20% of road accidents and up to a quarter of fatal and serious accidents. Car manufacturers are constantly looking for ways to make their vehicles safer especially as safety can be a strong selling point.

Until recently, measuring ECG in a car meant the driver having a … Read More → "Plessey develops sensor solution to monitor driver fatigue"

eSilicon Offers Specialty Memory Products on TSMC 28nm and 40nm Processes

October 31, 2012

SUNNYVALE, Calif. — October 30, 2012 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, is now offering memory compilers targeting the networking and computing markets in TSMC’s 28nm and 40nm technologies. eSilicon’s specialty eFlex™ and eFlexCAM™ embedded memory products include ternary content addressable memories (TCAMs) and multi-port register files</ … Read More → "eSilicon Offers Specialty Memory Products on TSMC 28nm and 40nm Processes"

TI LED driver is the first with frequency synchronization, PWM dimming and thermal foldback

October 31, 2012

DALLAS (Oct. 30, 2012) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a 1.5-A constant current DC/DC buck converter with an industry-leading combination of frequency synchronization, pulse-width modulation (PWM) dimming and thermal foldback. The TPS92510 features a wide 3.5-V to 60-V input voltage operating range and integrated MOSFET. Together with TI’s WEBENCH^® LED Architect, the lighting developer can quickly design a power management circuit to drive a string of up to 17 high-brightness LEDs at up to 97-percent power efficiency in automotive, industrial and general … Read More → "TI LED driver is the first with frequency synchronization, PWM dimming and thermal foldback"

Imec and Nantero Launch Joint Carbon Nanotube Memory Program for High-Density Next-Generation Memory Below 20nm

October 31, 2012

Leuven, BELGIUM and Woburn, MASSACHUSETTS, October 31, 2012 – Imec, a world-leading research institution in nanoelectronics and Nantero, Inc., a nanotechnology company using carbon nanotubes (CNTs) for the development of next-generation semiconductor devices, have announced a joint development program. The collaboration will focus on the carbon-nanotube-based memory developed by Nantero, NRAM™, and its application in high-density next-generation memories with a size under 20nm. NRAM arrays will be manufactured, tested and characterized in imec’s advanced nanoelectronics facilities.

Carbon nanotube memory is based on the carbon nanotube, “CNTs”, cylindrical carbon molecules about a nanometer across and up to … Read More → "Imec and Nantero Launch Joint Carbon Nanotube Memory Program for High-Density Next-Generation Memory Below 20nm"

Latest IAR Embedded Workbench for ARM offers new functionality and compiler optimizations

October 31, 2012

ARM TechCon, Santa Clara, California—October 30, 2012—IAR Systems today announced a new version of its world-leading development tool suite, IAR Embedded Workbench ® for ARM® version 6.50. The new version adds expanded integration and new functionality. In addition, enhancements to the optimization technology in … Read More → "Latest IAR Embedded Workbench for ARM offers new functionality and compiler optimizations"

Cadence Announces Tapeout of 14nm Test-Chip With ARM Processor and IBM FinFET Process Technology

October 31, 2012

SAN JOSE, CA–(Marketwire – October 30, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today the tapeout of a 14-nanometer test-chip featuring an ARM Cortex®-M0 processor implemented using IBM’s FinFET process technology. The successful tapeout is the result of close collaboration between the three technology leaders as they teamed to build an ecosystem to address the new challenges from design through manufacturing inherent in a 14-nanometer FinFET-based design flow.

The 14-nanometer ecosystem … Read More → "Cadence Announces Tapeout of 14nm Test-Chip With ARM Processor and IBM FinFET Process Technology"

RFEL achieves certified membership of Xilinx Alliance Program

October 31, 2012

Newport, Isle of Wight, UK – 31 October 2012 – RFEL, who specializes in high performance electronic signal processing solutions, has achieved Certified Membership status in the Xilinx Alliance Program, only one of 26 companies in Europe to do so.

“Certified Members have to demonstrate a high level of expertise in the latest Xilinx products,” said Ian Ventress, Engineering Manager at RFEL “Our engineers have worked hard to pass through the certification process in extremely short order after joining the alliance program only this summer. The advanced qualification means that they … Read More → "RFEL achieves certified membership of Xilinx Alliance Program"