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Cadence Encounter Digital Technology Helps Renesas Gain Advantage in Design Power, Area and Productivity

SAN JOSE, CA–(Marketwire – July 18, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, significantly improved power, area and productivity by using Cadence® Encounter® digital technology to tape out its new generation of automotive 32-bit microcontrollers (MCU). These latest MCUs were designed specifically for integrating system control and network processing functions of car infotainment devices on one chip.

In modern MCU designs, clock networks can contribute … Read More → "Cadence Encounter Digital Technology Helps Renesas Gain Advantage in Design Power, Area and Productivity"

IPM System Integrating Machine-To-Machine Technology From Telit Wireless Solutions For Solar Panels

Raleigh, NC – July 17, 2012 – Telit Wireless Solutions, Telit Wireless Solutions, a leading global provider of high-quality machine-to-machine (M2M) modules and value-added services, has won IPM SYSTEM International GmbH as a new client. The Germany-based company specializes in the area of renewable energy, developing innovative regulation and control technology for the optimization of solar photovoltaic panels.  

The photovoltaic specialists’ solution portfolio … Read More → "IPM System Integrating Machine-To-Machine Technology From Telit Wireless Solutions For Solar Panels"

Robotic Nano Positioning Systems have Applications in many High-Tech Fields

Auburn, MA, PI (Physik Instrumente) LP – a leading manufacturer of nano positioning systems — provides a complete line of highly accurate 6-axis robotic parallel positioners (Hexapod/SpaceFAB) for advanced applications in fields as diverse as bio/nano-technology, aerospace, medical technology and lasers/photonics. 

Parallel Robots: How do they Work?
Hexapod parallel positioners differ from classical articulated / stacked multi-axis positioners where each actuator is connected to the other actuators / motion axes in a serial configuration. In a hexapod positioner, all six actuators always work together affecting the common motion output platform. This design principle increases the … Read More → "Robotic Nano Positioning Systems have Applications in many High-Tech Fields"

Vicor Corporation Integrates Zero-Voltage Switching into Point of Load Devices with New Picor Cool-Power® ZVS Buck Regulators

Andover, MA – July 17, 2012 – Vicor Corporation (NASDAQ: VICR) today introduced its new Picor PI33XX Cool-Power® ZVS buck regulator series that affords board-level designers maximum power density and flexibility for high efficiency point of load DC-DC regulation. The integration of a high performance Zero-Voltage Switching (ZVS) topology within the PI33XX series increases point of load performance, providing best in class power efficiency up to 98% peak. Products in the PI33XX series are highly integrated with control circuitry, power semiconductors and support components in a high density 10mmx14mmx2.56mm LGA System in Package (SiP). PI33XX buck regulators can … Read More → "Vicor Corporation Integrates Zero-Voltage Switching into Point of Load Devices with New Picor Cool-Power® ZVS Buck Regulators"

Micron Announces Availability of Phase Change Memory for Mobile Devices

BOISE, Idaho, 2012-07-17 17:17 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), one of the world’s leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today’s wireless market and paves the way for enhanced features and … Read More → "Micron Announces Availability of Phase Change Memory for Mobile Devices"

Molex Custom LED Circuit Assemblies Offer Wide Range Of High Volume Production Design Options

LISLE, IL – July 17, 2012 – Molex Incorporated has ramped up engineering and production to bring custom LED circuit assemblies into a broader range of electronic products – from appliances and computers to automotive and consumer electronics.  Molex LED solutions on printed circuit board (PCB) substrates are … Read More → "Molex Custom LED Circuit Assemblies Offer Wide Range Of High Volume Production Design Options"

RFSA2514/2524 5-Bit Serial-Controlled Digital Step Attenuators

RFMD’s new RFSA2514/2524 5-bit digital step attenuators (DSAs) feature high linearity over their entire gain control range with excellent step accuracy in 0.5dB (RFSA2514) or 1dB (RFSA2524) steps. They are programmed via a serial mode control interface that is both 3V and 5V compatible. They also offer a rugged Class 1C HBM ESD rating via on-chip ESD circuitry. The MCM package is footprint-compatible with most 24-pin, 4mm x 4mm, QFN packages.

Features

Fujitsu Semiconductor Selects Cadence Signoff Solution for Its Newest Reference Design Flow

SAN JOSE, CA–(Marketwire – July 17, 2012) – Timing signoff closure has become an increasingly significant bottleneck due to the increase in modes and corners required for analysis and the divergence of timing results between implementation and signoff timing tools. Furthermore, the complexity of today’s designs requires the ability to do complete physically-aware MMMC signoff during ECO for rapid timing closure. To accomplish this requires a deep integration between physical and signoff design tools and a fundamentally new approach to software architecture. All of this can be done today uniquely with Cadence Encounter Timing System. The Encounter Timing System’s physically … Read More → "Fujitsu Semiconductor Selects Cadence Signoff Solution for Its Newest Reference Design Flow"

Proof-of-Concept Library is compatible with IEEE Std. 1666™-2011 Standard, includes Transaction-Level Modeling

Napa, Calif., USA, 16 July 2012 — Accellera Systems Initiative announces the release of version 2.3.0 of its SystemC open source proof-of-concept library, now available at no charge to the worldwide electronic design community. Compatible with the newly revised IEEE 1666 “Standard SystemC Language Reference Manual,” announced by the IEEE Standards Association in November 2011, version 2.3.0 provides a number of important new features, including support for transaction-level modeling (TLM), a critical approach to enable high level and more efficient design of complex ICs and SoCs in a single library.

New extensive process control features enable modeling of concepts such as power domains and … Read More → "Proof-of-Concept Library is compatible with IEEE Std. 1666™-2011 Standard, includes Transaction-Level Modeling"

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