News – Page 1954 – EEJournal

Synopsys’ CODE V Delivers Optical Design Innovations That Enable Reduced Manufacturing Costs

October 9, 2012

MOUNTAIN VIEW, Calif., Oct. 9, 2012 /PRNewswire/ —

Highlights:

Direct optimization method can reduce sensitivity of optical systems to manufacturing tolerances, improve as-built performance and minimize production costs
New tolerancing feature provides increased flexibility for modeling surface irregularities and evaluating their impact on system performance

Synopsys, Inc. (Nasdaq: SNPS), a global leader accelerating innovation in the design, verification and manufacture of chips and systems, today announced the availability of Synopsys’ CODE V^® Optical Design Software, version 10.5, which offers new and improved optimization and tolerancing capabilities for … Read More → "Synopsys’ CODE V Delivers Optical Design Innovations That Enable Reduced Manufacturing Costs"

Cadence Introduces Innovative Verification Debugger, Offering Significant Productivity Improvements and Time Savings

October 9, 2012

SAN JOSE, CA–(Marketwire – October 09, 2012) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the Incisive® Debug Analyzer, a new and innovative verification debug product for RTL, testbench and SoC verification that offers significant reductions in debug time and effort. Cadence® customers who have used this unique, multi-language debug solution have reported average time savings of up to 40 percent or more.

“Incisive Debug Analyzer is an innovative debug technology that has helped us fix bugs in minutes … Read More → "Cadence Introduces Innovative Verification Debugger, Offering Significant Productivity Improvements and Time Savings"

3V to 5V 802.11n/ac High Linearity WiFi Front End Modules

October 9, 2012

RFMD’s new high linearity WiFi front end modules provide complete integrated solution in a single front end module (FEM) for WiFi systems. The ultra-small form factor and integrated matching minimizes layout area in the application and greatly reduces the number of external components. This simplifies the total front end solution by reducing the bill of materials, system footprint, and manufacturability costs. Each of these devices integrates a power amplifier, switch, LNA with bypass, and a power detector coupler for improved accuracy and are provided in a 3mm x 3mm x 1.0mm, 16-pin laminate package.

Features</ … Read More → "3V to 5V 802.11n/ac High Linearity WiFi Front End Modules"

Hisense Picks Tensilica’s HiFi Audio/Voice DSP and Software Codecs for DTVs

October 9, 2012

SANTA CLARA, Calif. USA – October 9, 2012 –Tensilica®, Inc., today announced that Hisense Company Ltd., of Qingdao, China, is using the Tensilica HiFi Audio/Voice DSP (digital signal processor) to do all of the audio decoding and post processing in its new SOCs (system on chips) for DTV (digital televisions). Tensilica’s HiFi Audio/Voice DSP is the most popular audio IP core on the market, with the lowest power and largest library of over 100 ported software codecs.

“For product differentiation, we decided to design our own DTV chips and we needed an audio DSP that … Read More → "Hisense Picks Tensilica’s HiFi Audio/Voice DSP and Software Codecs for DTVs"

Taoglas Unveils Range of High Performance LTE Antennas

October 9, 2012

SAN DIEGO, CA – October 8, 2012 – TaoglasUSA, Inc. (www.taoglas.com), a leading provider of antenna solutions to the M2M and connected device market, today unveiled a range of high performance, ultra-wideband LTE antennas. Included in this off-the-shelf range are through hole, adhesive and connector mount external antennas as well as internal, surface mount, on-board and off-board, flexible polymer antennas. The new TG.30 Apex</ … Read More → "Taoglas Unveils Range of High Performance LTE Antennas"

Freescale demonstrates fastest dual-network functionality for ZigBee® networks and smart energy systems

October 8, 2012

AMSTERDAM (Metering, Billing/CRM Europe) – Oct. 8, 2012 – Freescale Semiconductor (NYSE: FSL) is demonstrating dual-PAN (personal area network) functionality with its new generation of Kinetis wireless solutions. As the deployment of IEEE® 802.15.4 ZigBee® networks continues to expand, multiple ZigBee networks (including ZigBee Home Automation, ZigBee RF4CE and ZigBee Smart Energy versions 1.x and 2.0) may exist simultaneously in a home or building. The dual-PAN capability in Freescale’s Kinetis KW20 wireless microcontroller (MCU) allows a single device to seamlessly connect and actively participate in two separate networks.</ … Read More → "Freescale demonstrates fastest dual-network functionality for ZigBee® networks and smart energy systems"

Calypto PowerPro® Adopted by Core Logic for Advanced RTL Power Reduction

October 8, 2012

SANTA CLARA, Calif., – October 5, 2012 – Calypto® Design Systems, Inc., the leader in Electronic System Level (ESL) hardware design and Register Transfer Level (RTL) power reduction, today announced that Core Logic Inc., Korea’s leading fabless semiconductor manufacturer, has adopted PowerPro® CG as their primary power optimization tool for designing their complex system-on-chip (SoC) products.

Core Logic develops competitive SoC products and various platforms for mobile, home and automotive applications. Choosing Calypto’s PowerPro CG tool was an easy decision for them because PowerPro CG delivered the automation and quality … Read More → "Calypto PowerPro® Adopted by Core Logic for Advanced RTL Power Reduction"

New Telit GPS Miniature Receiver Based on Latest 3-D Embedded Technology is Market’s Smallest

October 8, 2012

Raleigh, October 8, 2012 – Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the Jupiter SE880ultra-compact GPS receiver module for applications in the commercial, industrial, and consumer segments including wearable and handheld devices. The miniature 4.7×4.7mm LGA (Land Grid Array), SiRFstarIV™-based receiver module employs leading 3-D component embedding technology to achieve best-in-class performance in all dimensions critical … Read More → "New Telit GPS Miniature Receiver Based on Latest 3-D Embedded Technology is Market’s Smallest"

Microsemi Introduces Next-generation SmartFusion®2 SoC FPGA with Breakthrough Capabilities in Security, Reliability and Low Power

October 8, 2012

ALISO VIEJO, Calif.—Oct. 8, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today unveiled its new SmartFusion®2 system-on-chip (SoC) field programmable gate array (FPGA) family. Microsemi’s next-generation SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical industrial, defense, aviation, communications and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® Cortex™-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip.

Altera Introduces Industry’s Highest-Bandwidth 28 nm Midrange FPGA

October 8, 2012

SAN JOSE, Calif., Oct. 8, 2012 /PRNewswire/ — Altera Corporation (NASDAQ: ALTR) today announced it has expanded its 28 nm portfolio with the introduction of the Arria® V GZ variant, incorporating the company’s industry-leading transceiver technology and delivering an overall core performance boost of more than two speed grades, or 30 percent. This latest variant from Altera is designed to meet the demand for more bandwidth in communications and broadcast applications. Arria V GZ FPGAs feature 36 … Read More → "Altera Introduces Industry’s Highest-Bandwidth 28 nm Midrange FPGA"

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