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Arasan Chip Systems further expands its Ethernet portfolio by adding AVB (Audio Video Bridging)

December 13, 2012

San Jose, California – December 10, 2012 -Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today that they have added AVB (Audio Video Bridging) to their Gigabit Ethernet MAC product family. The new Gigabit Ethernet MAC with AVB enables the transmission of audio and video streams synchronized within a microsecond of each other, with low delay, and with minimal lost data due to network congestion.

An AVB network implements a set of protocols developed by the IEEE 802.1 Audio/Video Bridging Task Group. There are four significant differences between the AVB MAC and standard 802 architectures; precise … Read More → "Arasan Chip Systems further expands its Ethernet portfolio by adding AVB (Audio Video Bridging)"

WiFi Front End Modules

December 13, 2012

RFMD’s new RFFM8xxx series provide complete integrated solutions in single front end modules (FEMs) for WiFi systems. The ultra-small form factor and integrated matching minimizes the layout area in the customer’s application and greatly reduces the number of external components. This simplifies the total front end solution by reducing the bill of materials, system footprint, and manufacturability cost. Each device is provided in a 2.5mm x 2.5mm x 0.45mm, 16-pin QFN package.

Features

Imec Shows Path Toward Non-Si Devices at IEDM 2012

December 13, 2012

IEDM2012, San Francisco, USA – December 12, 2012 – At this week’s IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs. Imec showed that channel mobility can be boosted by growing non-Si channels on a strain relaxed buffer (SRB), and demonstrated excellent scalability potential of the technology. Moreover, imec revealed insight on the unique influence oxide trapping has on the gate stack mobility in High-Mobility Ge and III-V channels. 

For logic device technology, the industry previously used SiGe source/drain stressors to enhance the Si channel mobility. However, … Read More → "Imec Shows Path Toward Non-Si Devices at IEDM 2012"

DC/DC Converter from Diodes Incorporated Boosts Light Load Efficiency

December 13, 2012

Plano, Texas – December 13th, 2012 – Designed to help meet energy efficiency standards under light load and standby conditions, the AP65200 synchronous DC-DC buck converter from Diodes Incorporated achieves efficiency as high as 96% for a light load of 200mA and maintains efficiency above 70% down to 20mA.  Its high level of integration and minimal external component count suits distributed power architectures in consumer electronics products, including TVs, monitors and set-top boxes.

Offering an input voltage range from 4.75V to 18V, the AP65200 provides a single device solution for both 5V and 12V bus systems, and delivers up … Read More → "DC/DC Converter from Diodes Incorporated Boosts Light Load Efficiency"

Nordic nRF8001-powered module from LiSeng makes bridging the gap between healthcare products and smartphones simple

December 13, 2012

Oslo, Norway – December 13, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-headquartered ODM LiSeng – a provider of design solutions from concepts to products – has developed and commercialized a Bluetooth® low energy module based on Nordic’s µBlue™ nRF8001 Single-Chip-Connectivity solution.

The module is a tested wireless device fully compatible with Bluetooth v4.0. The module is available in three sizes measuring from 15 by 22 mm to 23 by 33 mm and can be easily incorporated into a battery-powered healthcare product (or other portable consumer devices) without in-depth knowledge of RF … Read More → "Nordic nRF8001-powered module from LiSeng makes bridging the gap between healthcare products and smartphones simple"

Schneider Electric Selects Cypress 1-Mbit Serial nvSRAMs For Two New Programmable Automation Controllers

December 13, 2012

SAN JOSE, Calif., December 11, 2012 – Cypress Semiconductor Corp. (Nasdaq: CY) today announced that Schneider Electric has designed Cypress’s nonvolatile static random access memories (nvSRAMs) into two of its new programmable automation controllers. The Schneider BMXCRA31210 and BMXERT1604 controllers each employ Cypress’s CY14B101Q2 1-Mbit nvSRAM as a time-stamp buffer. When an event such as the closure of a switch or power line defect is detected, the nvSRAM records it in a rolling buffer. These types of events can occur an infinite number of times during the lifetime of a product, so it is critical to have a … Read More → "Schneider Electric Selects Cypress 1-Mbit Serial nvSRAMs For Two New Programmable Automation Controllers"

Pentek Introduces Rugged Portable RF/IF High-Bandwidth Signal Recorder

December 13, 2012

Pentek, Inc., today announced the new Talon® RF/IF signal recording and playback system: the Model RTR 2727 rugged portable recorder suitable for military and aerospace applications. The system features recording and playback of IF signals up to 700 MHz with signal bandwidths to 200 MHz. It can be configured with 500 MHz 12-bit A/Ds or 400 MHz 14-bit A/Ds and an 800 MHz 16-bit D/A. Pentek’s SystemFlow software allows turnkey operation through a graphical user interface (GUI), while the SystemFlow application programming interface (API) allows easy integration of the recording software into custom applications.</ … Read More → "Pentek Introduces Rugged Portable RF/IF High-Bandwidth Signal Recorder"

Microsemi Delivers Power Amplifier for Next-generation Wi-Fi Applications

December 12, 2012

ALISO VIEJO, Calif.—Dec. 12, 2012—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced a 5 gigahertz (GHz) LX5509 power amplifier (PA) for IEEE 802.11ac—also known as fifth generation Wi-Fi—wireless access points and media devices. The LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks, allowing optimum system performance by extending the high data rate range.

“Our new PA is the second in a series of devices we are introducing to … Read More → "Microsemi Delivers Power Amplifier for Next-generation Wi-Fi Applications"

Altera and ARM Announce Industry’s First FPGA-Adaptive Embedded Software Toolkit

December 12, 2012

SAN JOSE, Calif., Dec. 12, 2012 /PRNewswire/ — Altera Corporation (NASDAQ: ALTR) and ARM (LON: ARM; NASDAQ: ARMH) today announced that, with a unique agreement, the companies have jointly developed a DS-5 embedded software development toolkit with FPGA-adaptive debug capabilities for Altera SoC devices. The ARM® Development Studio 5 (DS-5™) Altera Edition toolkit is designed to remove the debugging barrier … Read More → "Altera and ARM Announce Industry’s First FPGA-Adaptive Embedded Software Toolkit"

Shipments Of Lattice iCE FPGA Family Reach 15 Million

December 12, 2012

HILLSBORO, OR – DECEMBER 12, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that since December 2011 it has shipped 15 million iCE FPGA devices, including its flagship ultra-low density iCE40™ FPGA family, making this the company’s fastest shipping product of the past decade.  This extraordinary success reflects unprecedented adoption of the iCE40 devices for use in mobile consumer applications, which represent the overwhelming majority of device shipments. 

Demonstrations of the iCE40 devices in a variety of applications will be on display in Lattice’s “Mobile Innovation”  private … Read More → "Shipments Of Lattice iCE FPGA Family Reach 15 Million"

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