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Industry’s Smallest, Most Integrated IO-Link Transceiver Fits in Industrial Applications When Other Solutions Will Not

SUNNYVALE, CA—October 3, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX14821, the smallest IO-Link(R) physical-layer (PHY) transceiver in the industry. Encased in a 2.5mm x 2.5mm WLP, the MAX14821 saves more than 60% compared to competitors’ packages and enables designs to fit in tiny housings. An extra set of a digital output and input plus dual integrated low-dropout linear regulators provide added flexibility with complex sensor modules. This IO-Link transceiver is optimized for point-to-point communication between industrial controllers and sensor modules and actuators. 

IO-Link Sets a New Standard for Industrial Automation

< … Read More → "Industry’s Smallest, Most Integrated IO-Link Transceiver Fits in Industrial Applications When Other Solutions Will Not"

Atmel Launches Industry’s Smallest Low-frequency RF IDIC Package for Direct Coil Mounting

Heilbronn, Germany, October 4, 2011 – Atmel® Corporation (NASDAQ: ATML) today announced the availability of an ultra-small XDFN (Extremely Thin Dual Flat No Leads) package including a 363-bit read/write transponder IDIC®. The transponder IDIC ATA5577M1 is a high-volume low-frequency (LF, 100-150kHz) RFID (radio frequency identification) device designed for small tag applications including animal ID ear and bolus tags, standard key fobs or clamshell cards for access control solutions. Measuring at 2mm x 1.5mm x 0.37mm, the XDFN package is the world’s smallest RFID package available in the market today.

The two coil wires can … Read More → "Atmel Launches Industry’s Smallest Low-frequency RF IDIC Package for Direct Coil Mounting"

MoSys Demonstrates Bandwidth Engine IC Interoperability with Avago Technologies SerDes

SANTA CLARA, Calif., October 4, 2011 – MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, has successfully demonstrated interoperability of its Bandwidth Engine® IC with the SerDes characterization and evaluation board from Avago Technologies.

MoSys’ Bandwidth Engine SerDes is compatible with the OIF CEI-11 specification allowing it to interface with high-performance network … Read More → "MoSys Demonstrates Bandwidth Engine IC Interoperability with Avago Technologies SerDes"

Microchip Launches Embedded Code Source, an Application Store and Social Community for Downloading and Rating Free PIC® MCU Code

CHANDLER, Ariz., Oct. 3, 2011 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced the Embedded Code Source(http://www.microchip.com/get/R0BA), an application store for the embedded community that provides free software and firmware for PIC® microcontrollers, along with the ability to rate and review … Read More → "Microchip Launches Embedded Code Source, an Application Store and Social Community for Downloading and Rating Free PIC® MCU Code"

Renesas Electronics Europe Releases Compatible Microcontroller Families Optimized for Smart Metering Applications

Metering, Billing/CRM Europe, Amsterdam, October 4, 2011 – Renesas Electronics Europe has announced the availability of the RX210 and RX630 microcontrollers (MCUs), two compatible families designed to provide flexible and scalable solutions for the next generation of smart meters. Both RX210 and RX630 MCUs are based on Renesas’ powerful 32-bit RX CPU core.

The new RX210 and RX630 families of MCUs have been developed using two advanced MONOS flash processors to provide compatible devices with a range of different features optimised for smart metering applications. The development of two compatible families allows the system designers to choose … Read More → "Renesas Electronics Europe Releases Compatible Microcontroller Families Optimized for Smart Metering Applications"

OpenET Alliance announces Envelope Tracking interface spec for energy efficient 4G handsets

Cambridge, UK, 4 October 2011 – The OpenET Alliance, the not-for-profit organisation that promotes energy efficient wireless transmission through Envelope Tracking, today announced that it has released a new API specification for 4G handsets to support further industry collaboration. Envelope Tracking is the most effective wide-band power optimisation technology for the RF front end of 3G and 4G handsets. 

Commenting, Steven Baker, Technical Director, OpenET Alliance said, “The new API will help the industry deliver efficient 4G transmitters more quickly by providing a platform for closer and more effective … Read More → "OpenET Alliance announces Envelope Tracking interface spec for energy efficient 4G handsets"

Analog Bits Expands SERDES Product Line to Include SONET Grade IP

MOUNTAIN VIEW, Calif., Oct. 3, 2011 /PRNewswire/ — Analog Bits, the Integrated Clocking and Interface IP leader, has added a SONET Grade Programmable Low Power IP to its expanding SERDES product line.

This new addition broadens Analog Bits’ SERDES IP product line to serve switches and ATM applications for central office telecommunication equipment. In addition to standard protocols, such as PCI Express, SATA, and XAUI, the new SERDES also supports protocols including SONET/SDH (OC3/12/48), OTU-1, STM(1/4/16), SPI 4.2, SFI 4.2, SDI-SD/SDI-HD, and SDI-3G.

The pin-configured macro uses standard logic process devices and exhibits exceptional input sensitivity, input … Read More → "Analog Bits Expands SERDES Product Line to Include SONET Grade IP"

EDA Solutions Announces Mixed-Signal ASIC Design Workshops for Incentia and Tanner EDA Design Tools in Germany, Belgium and UK

EDA Solutions, sole representative in Europe for Tanner EDA and Incentia Design Systems, today announced a series of workshops in Germany, Belgium and the UK, on mixed-signal ASIC design, based on advanced ASIC design tools from Incentia and Tanner.

Hosted by EDA Solutions, in conjunction with Europractice IC Services, a leading European provider of ASIC prototyping and small-volume IC production services, the dates and locations of the workshops are:

  • October 18/19 – Fraunhofer IIS, Erlangen, Germany
  • October 25/26 – IMEC, Leuven, Belgium
  • November 8/9 – STFC/RAL, Didcot, near Oxford, UK

The first … Read More → "EDA Solutions Announces Mixed-Signal ASIC Design Workshops for Incentia and Tanner EDA Design Tools in Germany, Belgium and UK"

Microsemi Announces Availability of Space-saving SmartFusion® cSoC Devices

ALISO VIEJO, Calif.—Oct. 4, 2011—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its award-winning SmartFusion® customisable system-on-chip (cSoC) family is now available in a “CS288” 288-ball chip scale package (CSP) package. The new small footprint package is designed for a wide range of industrial, military, communications, medical and computational applications such as security cameras, advanced weapon systems, wearable power supplies, optical transponders, flow monitors, oral x-ray sensors, remote heart monitors and single board computers.

“In today’s marketplace, the … Read More → "Microsemi Announces Availability of Space-saving SmartFusion® cSoC Devices"

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